DFI VC300-CS AI-Enabled 5G MXM In-Vehicle PC
- Product Name: DFI VC300-CS
- System Type: AI-Enabled 5G MXM In-Vehicle PC
- CPU: 8th/9th Generation Intel Core Processors
- RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
- Expansion: 4 x 802.3af POE Ports, Multiple Expansion Slots for 3G/LTE/5G Cellular Support
- Other features: AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
Description
Introducing DFI’s VC300-CS, a high-performance In-Vehicle/Railway System that provides robust support for PoE and MXM-module. Powered by 8th/9th generation Intel® Processors, this system is meticulously engineered to meet the diverse requirements of a wide range of applications. Whether it’s Electric interurban buses, Autonomous vehicles, Mobility as a Service (MaaS) platforms, Fleet management solutions, Robotaxis, AI-based Railway surveillance, Driver-less systems, Autopilot technology, or track monitoring, the VC300-CS from DFI is designed to excel in these demanding environments. With its compatibility with 8th/9th Gen Intel® Core processors, DDR4 memory, and a host of features including 3 Mini PCIe slots, 2 M.2 slots, 1 HDMI port, 1 VGA port, and 1 DP++ port, the VC300-CS offers a comprehensive and reliable solution for industrial and transportation applications that demand exceptional performance.
Key Features
- 8th/9th Generation Intel® Core™ Processors
- 4 x 802.3af POE Ports
- AI Accelerated: Up to 110W GPU MXM Module Supported
- Multiple Expansion Slots for 3G/LTE/5G Cellular Support
- Extended Operating Temperature: -25°C to 70°C
- Support 5G Communication
- 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
Specification
| System |
| Processor |
| 8th/9th Generation Intel® CoreTM Processors, LGA 1151 |
| – Intel® Core™ i7-9700TE 8C/8T 1.8GHz 12MB cache, TDP 35W with Q370PCH |
| – Intel® Core™ i7-8700T 6C/12T 2.4GHz 12MB cache, TDP 35W with Q370PCH |
| – Intel® Core™ i7-9700E 8C/8T 2.6GHz 12MB cache, TDP 65W with Q370PCH |
| – Intel® Core™ i5-9500TE 6C/6T 2.2GHz 9MB cache, TDP 35W with Q370PCH |
| (Other CPU support upon request) |
| Chipset |
| Intel® Q370 Chipset |
| Memory |
| Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB |
| BIOS |
| AMI SPI 128Mbit |
| Graphics |
| Controller |
| Intel® HD Graphics |
| Display |
| 1 x VGA (display out by DB-15 connector) |
| 1 x HDMI (with screw lock) |
| 1 x DP++ (standard display port connector DIP type with screw lock) |
| Support NIVIDIA Optimus technology |
| VGA: resolution up to 1920×1200@60Hz |
| HDMI: resolution up to 4096×2160@24Hz |
| DP++: resolution up to 4096×2304@60Hz |
| AI Accelerator |
| Interface |
| MXM Type A, B, C on x16 PCIe 3.0 |
| Controller |
| Nvidia Quadro embedded/ Geforce series |
| Storage |
| External |
| 4 x Swappable 2.5” storage bays with lock. |
| Supports 7mm SSD devices |
| Internal |
| 1 x M.2 2280 M key supports SATA SSD |
| Expansion |
| Interface |
| 1 x Half-size Mini PCIe for WiFi/BT modules, with PCIe x1 & USB signal |
| 2 x Full-size Mini PCIe support PCIe x1, USB 2.0 signal with SIM card socket of each |
| 1 x M.2 B key supports 3042, 3052 devices or 5G module on PCIe x1, USB2.0, USB3.0 signal with SIM card slot bracket |
| – SIM card can all be external accessible |
| 1 x M.2 2280 M key supports 2242, 2260 & 2280 devices (PCIe x4 & SATA signal, support boot up function) |
| Audio |
| Audio Codec |
| Realtek ALC888 |
| Interface |
| 1 x Mic-in |
| 1 x Line-out |
| Ethernet |
| Controller |
| 5 x Intel® I210IT NIC (10/100/1000Mbps) |
| 1 x Intel® I219LM PHY (10/100/1000Mbps) |
| LED |
| Indicators |
| 1 x Power LED (green) |
| 5 x Storage LED (red) |
| 4 x PoE LED |
| Front I/O |
| PoE |
| 4 x RJ45 802.3af PoE by XCT7-4PoE |
| Support 802.11af, max 15.4W (PSE side) |
| NOT support Wake on Lan |
| Ethernet |
| 2 x GbE (RJ-45) support Wake on Lan |
| Serial |
| 2 x High speed full RS-232/422/485 (DB-9) |
| 2 x RS-232/422/485 (pin headers) |
| USB |
| 4 x USB 3.0 (type A) |
| Display |
| 1 x VGA display out by DB-15 connector |
| DIO |
| 1 x 8-bit isolated DI port by DB-9 connector |
| 1 x 8-bit isolated DO port by DB-9 connector |
| 2KV isolation |
| Power-in |
| 1 x 6Pins 5.0mm terminal block |
| Rear I/O |
| USB |
| 2 x USB 2.0 (type A) |
| Display |
| 1 x HDMI |
| 1 x DP++ |
| Audio |
| 1 x Mic-in |
| 1 x Line-out |
| by 3.5mm 3P Phone Jack |
| Buttons |
| 1 x Power button |
| 1 x Reset button |
| Antenna |
| 7 x SMA type antenna hole for GNSS, WWAN/LTE MIMO, WLAN/ BT MIMO, 5G |
| SIM |
| 3 x SIM sockets (external accessible with cover) |
| Watchdog Timer |
| Output & Interval |
| System reset, programmable via software from 1 to 255 seconds |
| Security |
| TPM |
| TPM 2.0 |
| Power |
| Type |
| +12VDC (9~36V), +24VDC(14.4~33.6) |
| +12V and +24V compliant to eMark with power ignition function |
| Reverse polarity protection |
| Connector |
| 6-pin 5.0mm terminal block |
| OS Support |
| Microsoft |
| Windows 10 IoT Enterprise 64 Bit |
| Linux |
| Ubuntu 18.04 |
| Environment |
| Operating Temperature |
| -25°C to 70°C with when CPU+GPU<100W, up to +85°C for 10min |
| -25°C to 55°C with when CPU+GPU<160W, up to +70°C for 10min |
| CPU throttling at high temperature is acceptable |
| Storage Temperature |
| -40 to 85°C |
| Relative Humidity |
| 10% to 90% (non-condensing) |
| Mechanism |
| Construction |
| Metal + Aluminum |
| Mounting |
| Wall mount |
| Dimensions (W x H x D) |
| 340.5 x 132 x 223 mm (3U height, excluding rubber foot) |
| Weight |
| 9.85 kg |
| Standards and Certifications |
| Shock |
| EN61373: 2010, Category 1 Class A & Class B |
| Vibration |
| EN61373: 2010, Category 1 Class B |
| Certifications |
| CE, FCC Class B (tested with adapter) |
| E-Mark |
| Safety: EN50153, EN50124-1 |
| Fire Proof: EN45545 |
| IP Rating |
| IP40 |
| Country of Origin |
| Country of Origin |
| Taiwan |
BVM Customisation Service
Design | Develop | Test | Manufacture
Here’s a selection of our design, manufacturing & associated services: –
Design to Order: OEM/ODM Embedded Product Design ServicesFor customers designing a new product or working with an existing prototype.
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Build to Order: Computer Design and Customisation ServicesTake an existing system and we can:
Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs Embedded Software: Configuration, Integration and DeploymentPorting, Integration & Deployment
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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
![]() Testing |
![]() Materials Management |
![]() Logistics and Tracking |
![]() External Manufacturing |
| • Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |
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