DFI VC70B-MTH Intel Core Ultra Vehicle Compact PC

  • Product Name: DFI VC70B-MTH
  • System Type: Ultra-compact, AI-powered in-vehicle compact PC designed for smart mobility and fleet applications
  • CPU: Intel Core Ultra processor platform optimised for edge AI and in-vehicle computing
  • RAM: Integrated LPDDR5-6400 high-speed memory for reliable, low-power operation
  • Expansion: Multiple M.2 slots including M.2 M-Key, M.2 B-Key, and M.2 E-Key for storage and wireless connectivity
  • Other Features: Triple display support (HDMI, DP, USB-C DP Alt Mode), rich I/O with 2× 2.5GbE, 1× GbE, USB 3.2/2.0, multiple COM ports, dual CAN-FD, built-in 9-axis sensor, and out-of-band remote management support

Description

The DFI VC70B-MTH is an ultra-compact, AI-enabled in-vehicle computing platform designed for smart mobility, fleet management, and edge AI applications. Powered by Intel® Core™ Ultra processors with high-speed LPDDR5 memory, it delivers efficient performance for real-time data processing, driver monitoring, and intelligent vehicle systems.

Engineered for automotive and transportation environments, the VC70B-MTH supports triple independent displays via HDMI, DP, and USB-C DP Alt Mode, enabling advanced visualization and control interfaces. Flexible expansion options include multiple M.2 slots for high-speed storage, wireless connectivity, and 4G/5G integration, while a comprehensive I/O layout provides high-bandwidth networking, USB connectivity, serial communication, and CAN-FD for vehicle data integration.

With built-in 9-axis sensors for driver detection, out-of-band remote management, and wide-range DC power input with ignition control, the DFI VC70B-MTH is a robust and future-ready solution for connected vehicles, intelligent transportation systems, and next-generation fleet deployments.

Key Features

  • Ultra-compact, stylish, and AI-powered in-vehicle system for smart mobility
  • Intel® Core™ Ultra processor with LPDDR5-6400 soldered memory
  • Remote Management: Supports Out of band control
  • Build-in 9 axis sensor for driver detection within fleet management
  • Triple Displays: 1 HDMI, 1 DP, 1 USB-C DP Alt. mode
  • Multiple Expansion: 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
  • Rich I/O: 2 2.5GbE, 1 GbE, 5 USB 3.2, 1 USB-C, 2 USB 2.0, 3 COM, 2 CAN F

Specification

Category Specification
System – Processor Intel® Core™ Ultra 7 165H, 16C, 24M Cache, 1.4GHz–5.0GHz, 28W
Intel® Core™ Ultra 7 155U, 12C, 12M Cache, 1.7GHz–4.8GHz, 15W
Intel® Core™ Ultra 5 125U, 12C, 12M Cache, 1.3GHz–4.3GHz, 15W
Memory Dual Channel LPDDR5x 6400MHz, up to 32GB (64GB on request)
BIOS AMI SPI 256Mbit
Graphics – Controller Intel® Arc™ Graphics
Graphics – Features OpenGL 4.6, DirectX 12.2, OpenCL 3.0
HW Decode: HEVC, VP9, AV1, AVC
HW Encode: HEVC, VP9, AV1, AVC
Display Outputs 1 × HDMI 1.4b
1 × DP++
1 × USB-C DP Alt. Mode
Display Resolution HDMI: up to 4096×2160 @24Hz
DP++: up to 4096×2160 @24Hz
USB-C DP: up to 4096×2304 @60Hz
Multi-Display Triple displays (HDMI + DP + USB-C DP Alt. Mode)
Expansion – Interface 1 × M.2 M-Key 2280 (PCIe Gen4 x4)
1 × M.2 B-Key 3052 (USB 3.0/2.0, PCIe x1, SATA) + 1 × SIM slot (4G/5G)
1 × M.2 E-Key 2230 (USB 2.0 / PCIe x1)
Ethernet – Controller 2 × Intel® I226IT (10/100/1000/2500Mbps)
1 × Intel® i210IT (10/100/1000Mbps)
LED Indicators 1 × Power LED
1 × HDD LED
Front I/O – Ethernet 2 × 2.5GbE RJ45
Front I/O – USB 5 × USB 3.2 Type-A
1 × USB Type-C
2 × USB 2.0 Type-A
Front I/O – Display 1 × HDMI
1 × USB-C DP Alt. Mode
1 × DP++
Front I/O – SIM 1 × Nano SIM slot
Rear I/O – Ethernet 1 × GbE RJ45 (supports OOB)
Rear I/O – Serial COM1: RS-232/422/485
COM2: RS-232
COM4: RS-232/422/485 or 8-bit DIO (jumper selectable)
CANBus 2 × CAN FD (DB9-M)
GMSL2 / OOB 1 × Micro SD slot for OOB
Watchdog Timer System reset, programmable via software (1–255 seconds)
Security – TPM TPM 2.0
Power – Input 9–36V DC
Power – Connector 3-pin terminal block (VCC / IGN / GND)
RTC Battery CR2032 coin cell (cable type)
Power Management Ignition on/off control
System on delay
OS protection time
System off delay
Car battery voltage monitoring
Low-voltage battery protection
OS Support – Microsoft Windows 11 & Windows 10 IoT Enterprise 64-bit
OS Support – Linux Linux (by request)
Environment – Temperature Operating: −20 to 70 °C (fanless)
Operating: −20 to 50 °C (28W CPU only)
Storage: −40 to 85 °C
Environment – Humidity Operating: 5–95% RH
Storage: 5–95% RH
Mechanism – Dimensions 181.6mm (W) × 71.5mm (H) × 118.4mm (D)
Mounting Wall mount
Weight < 3kg
Shock MIL-STD-810G Method 516.6, Procedure 1
Vibration MIL-STD-810G Method 514.6, Category 4
Certifications CE, FCC Class B, E-Mark (E24), RoHS, UKCA
Country of Origin Taiwan

 

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

Build to Order Banner

Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.