Home » Shop » Industrial Computers | Embedded Systems | Boards & Modules » Industrial Motherboards and Embedded SBCs » 3.5" Single Board Computers » LEX 3I110HW / 3I110BW 11th Gen Tiger Lake i7/i5/i3 3.5″ Embedded SBC
LEX 3I110HW / 3I110BW 11th Gen Tiger Lake i7/i5/i3 3.5″ Embedded SBC
- Product Name: Lex 3I110HW / 3I110BW
- Motherboard Form Factor: 3.5″ SBC
- CPU: 11th Gen Intel Tiger Lake-UP3, i7 / i5 / i3 / Celeron
- RAM: 2 x DDR4 SODIMM (Max. 64GB)
- Expansion: 1 x M.2 B Key, 1 x M.2 M Key, 1 x Mini PCIe, 1 x SIM
- Other features: Multiple Independent display: VGA, HDMI (or DP), eDP or LVDS, 3 x Intel GbE LAN, 6 x USB 2.0, 4 x COM, 4DI / 4DO, TPM 2.0, Battery Charger Function (3I110BW), OEM Option: DP (Type C), 1 x USB 3.0 (type C)
SKU: 3I110HW / 3I110BW
Category: 3.5" Single Board Computers
Tags: 9~36V, CANbus, GPIO / DIO, Intel Tiger Lake, IoT, Multi Display - Quad, NVMe, OS: Linux, OS: Windows, PoE, TPM 2.0
Brand: LEX Systems
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Description
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- 11th Gen Intel Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU
- 2 x DDR4 SODIMM (Max. 64GB) Multiple Independent display: VGA, HDMI (or DP), eDP or LVDS
- 3 x Intel GbE LAN, 6 x USB 2.0
- 4 x COM, 4DI / 4DO, 1 x Mini PCIe, 1 x SIM
- 1 x M.2 B Key, 1 x M.2 M Key
- TPM 2.0
- Battery Charger Function (3I110BW)
- OEM Option: DP (Type C), 1 x USB 3.0 (type C)
3I110HW Specification
| MODEL | 3I110HW / 3I110BW |
|---|---|
| CPU Type | Intel® Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU |
| MB Chipset | Intel® Tiger Lake-UP3 SoC |
| Graphics | Intel® Iris® Xe Graphics and media encode / decode engine Intel® UHD Graphics, Support DirectX 12 & OpenGL 4.5 |
| System Memory | 2 x DDR4 SODIMM, Max 64GB |
| Storage | 2 x SATA ports 3.0 Data transfer rates up to 6.0 Gb/s (600 MB/s) 1 x M.2 B key Type 3042 (PCIe x2 / mSATA / USB 3.0 / 2.0)-share SATA2 1 x M.2 M key Type 2280 (PCIe x4), Support NVMe |
| BIOS | AMI UEFI BIOS |
| Display | 1 x VGA, 1 x HDMI (or DP), eDP or Dual Channel, 48 bits LVDS |
| Touch | USB touch screen controller |
| TPM | TPM 2.0 (Firmware) ; OEM Optional to Hardware TPM |
| LAN | 1 x Intel GbE I219LM (internal) 2 x Intel GbE I210IT (internal) |
| Audio (OEM) | High Definition Audio Specification, Support Line-out / Mic-in / Line-in Two channel Class D Audio Amplifier |
| Expansion Interface | 1 x Full size Mini PCIe (PCIe / USB 2.0) 1 x M.2 B key Type 3042 (PCIe x2 / mSATA / USB 3.0 / 2.0) 1 x M.2 M key Type 2280 (PCIe x4), Support NVMe 1 x SIM |
| Expansion Module | Mini Card : GPS, 3G / 4G, WI-FI, 2 / 4 x LAN, 4 x COM, CANBus, SDI / AHD Video By Cable : Bluetooth, Digital I/O, 2 / 4 PoE, 4 x USB mini card |
| USB | 6 x USB 2.0 (internal) |
| Serial IO | 4 x RS232 / 422 / 485 (internal) |
| GPIO | Hardware digital Input & Output, 4 x DI / 4 x DO |
| WDT | Hardware Watch Dog Timer, 0~255 sec programmable |
| Power Input | Wide Range +9~36V ; Battery Charger function (3I110BW) |
| Dimension | 3.5″ (146 x 115 mm) |
| Operation Temperature (100 % CPU Usage) |
-40°C~+70°C (Core i GRE series CPU) -20°C~+70°C (Core i G7E / G7 series CPU) |
| Operation Humidity | 5~95%, non-condensing |
| Chassis (OEM I/O Expansion by request) | Waterproof System ; Waterproof PPC |
BVM Customisation Service
Design | Develop | Test | Manufacture
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.
Here’s a selection of our design, manufacturing & associated services: –
Design to Order: OEM/ODM Embedded Product Design ServicesFor customers designing a new product or working with an existing prototype.
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Build to Order: Computer Design and Customisation ServicesTake an existing system and we can:
Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs Embedded Software: Configuration, Integration and DeploymentPorting, Integration & Deployment
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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
![]() Testing |
![]() Materials Management |
![]() Logistics and Tracking |
![]() External Manufacturing |
| • Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |
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