LEX APOLLO 3I370DW 8th/9th Gen Edge AI Industrial Computer

  • Product Name: Lex APOLLO 3I370DW
  • System Type: Edge AI Computing Platform
  • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron
  • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
  • Expansion: 1 x M.2 B Key, 1 x Mini PCIe, 1 x PCIe x16 Slot
  • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP, 5 x Intel GbE LAN, 4 x USB 3.1 (2~4 x COM), DIO (optional), Supports NVIDIA RTX3070 GPU Card

Description

  • Intel 8th / 9th Gen Coffee Lake-S i7 / i5 / i3 / Pentium / Celeron CPU
  • Intel Q370 Chipset
  • 2 x DDR4 SODIMM socket, Max. 64GB
  • Multiple Independent display: HDMI, DP
  • 5 x Intel GbE LAN, 4 x USB 3.1 (2~4 x COM)
  • DIO (optional), 1 x M.2 B Key, 1 x Mini PCIe, 1 x PCIe x16 Slot
  • Supports NVIDIA® RTX3070 GPU Card

APOLLO 3I370DW Specification

MODEL APOLLO 3I370DW
Dimension 360 x 145 x 173 mm
Weight 7.35 kg
CPU 8th / 9th Gen Coffee Lake-S i7 / i5 / i3 CPU
Chipset Intel® Q370
Memory 2 x DDR4 SODIMM socket, Max. 64GB
Storage mSATA, HDD / SSD*, M.2
Expansion slots 1 x Full-size Mini PCIe (PCIe / mSATA / USB 3.0 / 2.0)
1 x M.2 Bkey Type2242 (PCIe / mSATA / USB 3.0 / 2.0)
1 x PCIe slot
I/O ports Network 5 x Intel GbE (1 x I219LM + 4 x I210 IT)
USB 4 x USB 3.1
Serial ports 2~4 x RS232 / 422 / 485 (option)
DIO 16DI / 16DO (optional to COM port)
Display 1 x DP, 1 x HDMI
Optional Modules
& Accessory
NVIDIA GeForce RTX3070 GPU Card
*SATA Kit, Wall Mount Kit
Power DC input : DC +24V (12V option)
Operating Temp.
(100 % CPU usage)
-20°C to +50°C with SSD
Storage Temp. -20°C to +70°C
OS Support Windows® 10 IOT (64bit),
Ubuntu 18.04.2 above, Fedora 29 above

 

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

Build to Order Banner

Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.