Wincomm WLPM-V24 24″ AMD Ryzen Modular Industrial Panel PC
- Product Name: Wincomm WLPM-V24
- Screen Size: 24″
- CPU: AMD Ryzen CPU, V1605B, QC, 2GHz, 12-25W
- RAM: Dual Channel DDR4 2400 MHz (V1605B/ V1202B), 32 GB
- Expansion: Optional Expansion Slot PCIex8
- Other features: Modular Design with Panel Size 23.8”, Front IP66 Waterproof and Dustproof, Panel Mount, Fanless with Smart Thermal Control, Full Flat Design with Resistive or P-cap Touch, CE, FCC, VCCI Class B Passed
Description
- AMD Ryzen CPU, V1605B, QC, 2GHz, 12-25W
- Modular Design with Panel Size 23.8”
- Front IP66 Waterproof and Dustproof, Panel Mount
- Fanless with Smart Thermal Control
- Full Flat Design with Resistive or P-cap Touch
- CE, FCC, VCCI Class B Passed
- Optional Expansion Slot PCIex8
Modular Panel PCs for Industrial Applications
Specification
| Model | WLPM-V24 | ||
| Main System | |||
| CPU / Chipset | AMD Ryzen CPU, V1605B, QC, 2GHz, 12-25W / SoC | ||
| Graphic | AMD Radeon™ Vega 8 Graphics | ||
| RAM | Dual Channel DDR4 2400 MHz (V1605B/ V1202B) , 32 GB | ||
| OS Support | Win 10 (64 bit) | ||
| Storage | 1 x 2.5” SATA SSD | ||
| 1 x M.2 M.Key 2242/2260/2280 PCIex2 and SATA for SSD | |||
| Expansion | 1 x M.2 Key E 2230 w/ PCIex1, share USB2.0 for Wireless | ||
| 1 x mini-PCIe for Full/Half w/ PCIex1 | |||
| 1 x PCIex8 (25W max.) | |||
| Display Size | 23.8” 16:9 | ||
| Display | 1920 x 1080 (FHD), 178(H) / 178(V), 250 nits (Typ. Center point), CR: 3000 : 1 (Typ) | ||
| Touch Screen | Full Flat Projective Capacitive Touch Panel / Light Transmission: >=85% / Hardness: >=7H pencil / Life: 100M times | ||
| I.O. Ports | |||
| USB | 2 x USB 3.2 GenII, 2 x USB 2.0 | ||
| COM | 2 x RS232/RS422/RS485 | ||
| LAN | 2 x RJ-45 | ||
| Audio | 2 x 3.5mm phone jack connector (Line-out, Mic-in) | ||
| Video | 3 x DP1.2a | ||
| Control Keys | Rear bottom: Power on/off | ||
| Mechanical and Environmental | |||
| Cooling | Fanless | ||
| Power Input | 1 x DC-in(Jack with locker), DC19V~28V | ||
| Power Adapter | 150W (PSU with PSE) | ||
| Temperature | Operating Temperature: 19V DC Input 0~50℃ (air flow cooling) | ||
| Storage Temperature: -20~60℃ | |||
| Humidity | Operating & Storage:10% ~ 90%, non-condensing | ||
| IP & IK Rating / Housing | IP66 at front, IK05 / Front bezel is Aluminum, others are SECC with black coating | ||
| Dimensions (Net) | 653.7 mm (H) x 412 mm (V) x 121.4 mm (T) | ||
| Weights (Net) | TBD kg (w/o power adapter) | ||
| Mounting | Panel mount (by clamp), VESA (75×75) | ||
| Certification | FCC/CE/VCCI Class B | ||
Ordering Information
| Item | Touch | Description |
| WLPM-V22-MBKFT | Full Flat Resis. touch | 21.5” V1605B, QC, 2GHz/ DDR4 4G RAM/ 128G SSD/ Fanless |
| WLPM-V22-MBKPT | Full Flat P-cap. touch | 21.5” V1605B, QC, 2GHz/ DDR4 4G RAM/ 128G SSD/ Fanless |
| WLPM-V24-MBKPT | Full Flat P-cap. touch | 23.8” V1605B, QC, 2GHz/ DDR4 4G RAM/ 128G SSD/ Fanless |
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.
BVM Customisation Service
Design | Develop | Test | Manufacture
Here’s a selection of our design, manufacturing & associated services: –
Design to Order: OEM/ODM Embedded Product Design ServicesFor customers designing a new product or working with an existing prototype.
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Build to Order: Computer Design and Customisation ServicesTake an existing system and we can:
Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs Embedded Software: Configuration, Integration and DeploymentPorting, Integration & Deployment
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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
![]() Testing |
![]() Materials Management |
![]() Logistics and Tracking |
![]() External Manufacturing |
| • Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |
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