RAM: 1 x 262-pin SO-DIMM DDR5 4800 MHz, up to 48GB
Expansion: Most Flexible I/O and Expansion for Industrial Applications
Other features: Fan-less and Rugged Design; -40°C to 70°C Wide Operating Temp. for Basic SKU, -40°C to 50°C Wide Operating Temp. for PoE SKU; 6-36VDC Wide Range Power Inputs for Basic SKU, 19-36VDC Wide Range Power Inputs for PoE SKU; Intel TCC and TSN Support for Real-Time Computing; DIN Rail or Wall Mount Options; 4 x Intel 1G LAN (2 Support IEEE 802.3AF PoE Ports), 1 x Intel 2.5G LAN; Support Intel IN-Band ECC
RAM: 1 x 262-pin SO-DIMM DDR5 4800 MHz, up to 48GB
Expansion: 2 x USB 3.2 Gen2, 4 x USB 2.0, 1 x M.2 Key E, 1 x M.2 Key M, 1 x M.2 Key B, 4 x COM, 1 x SATA3
Other features: 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN; Intel TCC and TSN support for Real-Time Computing; Supports Triple display, 1 x HDMI 2.0b, 1 x DP 1.4b, 1 x LVDS, 1 x eDP; 9~36V DC-In PWR; Operating Temp -40° C ~ 85° C
Other features: 4K High Resolution Support, Triple Display Capability, Rich I/O Connectivity: 2 2.5GbE LAN, up to 4 USB 3.2, 1 USB Type C, 2 SATA3, 2 USB2.0, Longevity Support: Typically supports a 10-Year CPU Life Cycle Until Q1’ 33.
Expansion: 4 x PCIe x1 (Gen3), 2 x USB 3.2 Gen2, 8 x USB 2.0, 2 x UART, 2 x SATA3
Other features: 1 x Intel 2.5 Gigabit LAN, Supports Dual Display, 2 x DDI, 1 x eDP, 1 x DP or HDMI, TPM 2.0 onboard IC (optional), ATX: 12V±5%/5Vsb±5%, AT: 9~20V±5%
CPU: Intel® Alder Lake Core™ i3-N305 processor 15W with 8 E-Cores or Atom® x7425E
RAM: Up to 16GB DDR5-4800 SODIMM
Expansion: M.2 2280 M key SATA socket
Other features: -25 °C to 70 °C rugged wide temperature operation, 4x GbE ports PoE+ / 4x USB3.2 Gen 2 with screw-lock, DP++ / HDMI 1.4b dual display outputs, 4-CH isolated DI + 4-CH isolated DO, Front I/O access DIN-mounting design, MezIO® compatible
RAM: Up to 32GB DDR4 3200 MHz (2 x 260-pin SO-DIMM, 16GB per DIMM)
Expansion: 1 x USB 3.2 Gen2, 3 x USB 2.0, 1 x M.2 Key E, 1 x M.2 Key M, 3 x COM, 1 x SATA3
Other features: 2 x Intel 2.5 Gigabit LAN, Supports dual display (1 x HDMI 2.0b, 1 x VGA), 1 x 19V/65W AC-DC power brick adapter, Compact dimensions: 200 x 134.5 x 39mm.
CPU: Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/3.0GHz 12W processor
RAM: Up to 32GB DDR4-3200 SDRAM by one SODIMM socket
Expansion: 4x Gigabit PoE+ ports via RJ-45 connector with screw-lock, 2x full-size mini-PCIe sockets, 1x M.2 3042/3052 B key, 1x front-accessible 2.5” SATA SSD tray (up to 15mm height), 1x M.2 2280 SATA
Other features: Rugged -25°C to 70°C fanless operation, 1x isolated RS-485 port and 1x RS-422/485 or 3x 3-wire RS-232 ports, 1x patented Cassette for single-slot PCIe card (Nuvo-2600E) or 1x 2500 watt-second SuperCAP UPS (Nuvo-2600J), 8V to 35V wide-range DC input with remote control and optional ignition power control
CPU: Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/3.0GHz 12W processor
RAM: Up to 32GB DDR4-3200 SDRAM by one SODIMM socket
Expansion: 4x PoE+ GbE ports via M12 x-coded connectors, 1x front-accessible 2.5” 15mm HDD tray and 1x M.2 2280 SATA SSD, 1x M.2 3042/3052 B Key for 4G/5G mobile broadband, 2x full-size mini-PCIe sockets for WIFI/CAN/GNSS modules
Other features: Rugged -40°C to 70°C fanless operation, compliant with EN 50155 Class OT4, 8-35V wide-range DC input with built-in ignition power control
CPU: Intel Elkhart Lake Atom® x6425E quad-core 2.0GHz/3.0GHz 12W processor
RAM: Up to 32 GB DDR4-3200 SDRAM by one SODIMM socket
Expansion: 2x full-size mini-PCIe sockets, 1x M.2 3042/3052 B Key
Other features: Compliant with EN 50155 and EN 45545-2 standards, rugged -40°C to 70°C fanless operations, 43V to 160V wide-range DC input with 1500Vdc insulation, 4x PoE+ GbE ports via M12 x-coded connectors, built-in SuperCAP UPS for power interruptions > 30 seconds (Nuvo-2615RL only), 1x front-accessible 2.5″ 15mm HDD tray and 1x M.2 2280 SATA SSD.
CPU: Intel Elkhart Lake Atom x6211E dual-core processor
RAM: Up to 32 GB DDR4-3200 SDRAM (one SODIMM slot)
Expansion: M.2 2280 M key SATA storage interface, One M.2 B key socket supporting 5G/4G 3042/3052 modules, One M.2 E key socket for WiFi 5/WiFi 6 modules
Other features: 52 x 89 x 112 mm extremely compact form factor, Rugged -25°C to 70°C fanless wide-temperature operation, Two GigE ports, two USB 3.1 Gen1 ports, and two USB 2.0 ports, One COM port with RS-232/422/485 modes and three RS-232 COM ports
System Type: Ultra-compact Fanless Embedded Computer
CPU: Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/3.0GHz 12W processor
RAM: Up to 32 GB DDR4-3200 SDRAM by one SODIMM socket
Expansion: M.2 2280 M key SATA interface, MezIO® compatible
Other features: Rugged -25 °C to 70 °C fanless operation, 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock, 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock, Dual DP display outputs supporting 4096 x 2160 resolution, Front I/O access DIN-mounting design
CPU: Latest and Powerful Intel® Atom® x6000E Processor (Elkhart Lake-PU)
RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
Expansion: Most Flexible IOs and Expansion for Industrial Applications
Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40°C to 70°C), 6-36VDC Wide Range Power Inputs, Intel® TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options, 4 x Intel 1G LAN (2 Support IEEE 802.3AF PoE Ports), 1 x Intel 2.5G LAN, Support Intel® IN-Band ECC
RAM: 1 x SO-DIMM, DDR4 3200 MHz, 4GB 8GB (Optional)
Expansion: Not specified
Other features: Features PCAP touch screen, field-replaceable front panel, IP65-rated waterproof and dustproof design, engineered for wide temperature range operation.
Other features: IP65-rated waterproof and dustproof design, wide power input range (10-60V DC) with ignition support, engineered for wide temperature range operation, supports VESA mount for easy installation and integration.
RAM: 1 x SO-DIMM, DDR4 3200 MHz, 4GB 8GB (Optional)
Expansion: Not specified
Other features: Features a 12.1″ 1024 x 768 Panel with PCAP touch functionality, equipped with a field-replaceable front panel, IP65-rated waterproof and dustproof design, engineered to operate reliably in a wide range of temperatures.
Other features: Features a 12.1″ 1024 x 768 Panel with PCAP touch screen, IP65-rated waterproof and dustproof design, wide power input range of 10-60V DC with ignition support, engineered for reliable operation in various temperatures, supports VESA mount for easy installation.
RAM: 1 x SO-DIMM, DDR4 3200 MHz, 4GB 8GB (Optional)
Expansion: Not specified
Other features: Features a 14″ 1920 x 1080 Panel with a PCAP touch screen, IP65-rated waterproof and dustproof design, wide power input range of 10-60V DC with ignition support, engineered to operate reliably in a wide range of temperatures, supports VESA mount.
Expansion: Compact size with multiple COM, CANBus, and DIO for communication
Other features: CE and FCC certified and ISO 7637-2 compliant, Fanless and wide operating temperatures from -40°C to +70°C, Supports 9 to 36 VDC and 12/24 VDC typical in-vehicle power input, Smart Ignition for power on/off schedule, vehicle battery protection, and different power modes, Suitable for transportation gateway applications
System Type: Fanless Stainless Steel Waterproof Box PC
CPU: Intel Elkhart Lake J6412
RAM: Dual channel support 3200MHz DDR4 SODIMM socket x 2, up to 32GB
Expansion: Not specified
Other features: IP66/69K Full Sealed with Anti-Corrosion Enclosure, IP67 M12 Stainless/Metal Connectors, M12 DC 12-28V with IP68 120W power adapter, 2x M12 USB for USB1/2+3/4 ; 2x M12 COM ; 1x M12 LAN ; 1x M12 DC ; 1x IP65 HDMI ; Power on/off bottom, Optional Cable Gland for External I.O., 100% Waterproof Guarantee, CE, FCC, VCCI Class B Certified
Motherboard Form Factor: Intel Elkhart Lake Celeron / Atom Qseven
CPU: Intel Elkhart Lake Celeron / Atom
RAM: 4GB/8GB LPDDR4 Single Channel Memory Down
Expansion: Multiple expansions: 4 PCIe x1
Other features: 1 DDI*, 1 LVDS*/eDP, DP++ resolution supports up to 4096×2160 @ 60Hz, Rich I/O: 1 Intel GbE, 3 USB 3.1, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
Expansion: Multiple Expansion: 1 M.2 E Key, 1 Mini- PCIe/M.2 B Key, 1 I2C
Other features: 4K High Resolution, Triple Independent Displays (1 VGA, 1 DP++, 1 LVDS/eDP), Rich I/O (2 LAN, 2 USB 3.1 Gen2, 2 USB 2.0, 2 COM, 1 SATA 3.0), 15-Year CPU Life Cycle Support Until Q4′ 35 (Based on Intel IOTG Roadmap)
CPU: Latest and Powerful Intel Atom x6000E Processor
RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
Expansion: Most Flexible IOs and Expansion for Industrial Applications
Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40 °C to 70 °C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options
CPU: Latest and Powerful Intel Atom x6000E Processor
RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
Expansion: Most Flexible IOs and Expansion for Industrial Applications
Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40 °C to 70 °C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options
System Type: Elkhart Lake 5G Fanless Embedded System
CPU: Intel Atom Processors X Series
RAM: One 260 pin DDR4 SODIMM up to 3200MHz
Expansion: Support 5G Sub-6 module, Support WiFi 6 module, Support Isolated COM & DIO
Other features: 4 LAN: Support 1 x 2.5GbE TSN, 3 x GbE LAN, Wide Operating Temperature: Support up to -40 ~ 70°C, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
Expansion: 1 M.2 B Key, 1 M.2 E Key, 1 PCIe x4 (x2 signal)
Other features: 3 Independent Displays: 1 DP++/VGA, 1 HDMI/DP++, 1 eDP/LVDS; Rich I/O: 2 x 2.5GbE, 2 USB 3.1 Gen2, 2 USB 3.1 Gen1, 6 COM, up to 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
Motherboard Form Factor: COM Express Mini – COM Express Type 10
CPU: Intel® Atom® Processor Elkhart Lake Series
RAM: Dual Channel LPDDR4X 3200MHz/4267MHz up to 16GB
Expansion: Multiple expansions: 4 PCIe x1
Other features: 1 LVDS/eDP, 1 DDI (HDMI/DP++); Supports dual displays: DDI + LVDS/eDP, Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap).
Other features: Independent display: 2 x HDMI (DP), 1 x eDP, 2 x Intel 2.5 GbE LAN, 2 x USB 3.0, 5 x USB 2.0, 4 x COM, Touch Screen, 4DI / 4DO, TPM 2.0
CPU: Onboard Intel® Atom® Processor E3950 1.6 GHz, up to 2.0 GHz
RAM: 1 x SO-DIMM, DDR3L 1866 MHz, 4GB 8GB (Optional)
Expansion: 1 x RS232 / 422 / 485 communication (select thru BIOS), 4 x Giga LAN, 3 x USB 3.0, 1 x USB 2.0, 1 x VGA, 1 x Line out, 1 x line in, 1 x Mic in, 1 x Power Jack
Other features: Class 1, Division 2 device certified for hazardous area application, DIN Rail design for Industrial Automation applications, Fanless, streamlined enclosure for highly efficient heat Dissipation, -40˚C~70˚C wide operation temperature range, AWS IoT Greengrass Certified
Other features: Two GbE LAN ports, Two RS-232/422/485, Pre-installed Mustang-MPCIE-MX2, 2 x Intel Myriad X VPU for AI deep learning workload consolidation
Product Name: Asrock Industrial Athena A2 AI Development Kit
Motherboard Form Factor: 6.5-in x 3.8-in
CPU: Intel Apollo Lake J3455 Processor
RAM: Supports LPDDR4 2400MHz 4GB, up to 8GB
Expansion: 2 x USB 3.2 Gen1, 1 x M.2 Key B, 1 x M.2 Key M, 1 x M.2 Key E
Other features: 1 x IP camera (2MP, 1080P@30fps, H.264), 1 x Movidius Myriad X/Keem Bay (Optional), 2 x Realtek Gigabit LAN, 1 x HDMI 1.4b, 1 x micro SD card slot, 1 x 32GB eMMC, 1 x micro SIM socket, TPM 2.0 onboard IC, 12V DC-In/ PoE (PD) with 25.5W (Optional)
Expansion: 1 x USB 3.0, 1 x M.2 Key B, 1 x M.2 Key E
Other features: 1 x IP camera (2MP, 1080P@30fps, H.264), 1 x Movidius Myriad X (Option), 1 x micro HDMI, 1 x micro SD card slot, 1 x Realtek LAN, 1 x 32GB eMMC, 1 x SIM socket, 1 x Mic-in (Option), 12V DC-in / PoE (PD) with 25.5W
System Type: Ruggedized Outdoor IoT IP67 Fanless Embedded System
CPU: Intel® Atom® Processor E3900 Series
RAM: 4GB DDR3 onboard, 64G eMMC
Expansion: 1 x Full-size Mini PCIe for 4G LTE module, 1 x Full-size Mini PCIe for Canbus, 1 x M.2 2230 (USB2.0/PCIe) for WiFi module
Other features: Ruggedized IPC67 Grade Box PC, Outdoor IoT Gateway Application, Operating temperature: -40° to 70° C, 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
Expansion: 1 x Mini-PCIe full size for option 3G/LTE/GPS, 1 x Mini-PCIe half size slot for option WIFI/BT, 1 x SIM slot onboard, 1 x SMA connector for option GPS antenna
Other features: High Brightness LED Backlight LCD, Rugged Engineering Plastics Enclosure and Fanless Design, 6~36V DC Wide-ranging Power Input, HDD/SSD: 1 x Micro SD onboard, 1 x mSATA MO-300 slot
Expansion: 1 x Mini-PCIe full size for option 3G/LTE/GPS, 1 x Mini-PCIe half size slot for option WIFI/BT, 1 x SIM slot onboard, 1 x SMA connector for option GPS antenna
Other features: High Brightness LED Backlight LCD, Rugged Engineering Plastics Enclosure and Fanless Design, 6~36V DC Wide-ranging Power Input, HDD/SSD: 1 x Micro SD onboard, 1 x mSATA MO-300 slot
Other features: Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0; 1 DDI*, 1 LVDS*/(eDP + DDI) Supports triple displays: eDP+2DDI; 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)
Other features: 1 DDI*, 1 LVDS*/(eDP + DDI);Supports triple displays: eDP+2DDI; DP++ resolution supports up to 4096×2160 @ 60Hz; Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
Other features: Three independent displays: VGA*/DDI + LVDS*/eDP + DDI; Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0, 2 SATA 3.0; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
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