RAM: Onboard LPDDR5 4800, Single Channel (Max. 16GB)
Expansion: Full-Size mSATA/mPCIe x 1, M.2 2230 E-key x1
Other features: HDMI1.4, eDP1.4/LVDS, Dual Ethernet (2.5GbE & 1GbE), USB 3.2 Gen2 x 2, RS-232/422/485 x 2, TPM 2.0, SATA 6Gbps, DC 9~36V input (Optional)
System Type: Ultra-compact in-vehicle computer with E-Mark certification
CPU: Intel Alder Lake Core i3-N305 processor with 8 E-Cores, 15W TDP
RAM: Up to 16 GB DDR5-4800 SDRAM (one SODIMM socket)
Expansion: 2x mPCIe slots for WiFi/4G/5G modules with conduction-cooled heatsink
Other Features: 4x GbE PoE+ ports, 4x USB 3.2 Gen 2 with screw-lock, dual DP++/HDMI 1.4b display outputs, 2x isolated CAN 2.0 ports (SocketCAN in Linux), 8-CH isolated DI/DO, 8V-35V DC input with ignition power control, EN 50155 EMC compliant.
RAM: 1 x 262-pin SO-DIMM DDR5 4800 MHz, up to 48GB
Expansion: Most Flexible I/O and Expansion for Industrial Applications
Other features: Fan-less and Rugged Design; -40°C to 70°C Wide Operating Temp. for Basic SKU, -40°C to 50°C Wide Operating Temp. for PoE SKU; 6-36VDC Wide Range Power Inputs for Basic SKU, 19-36VDC Wide Range Power Inputs for PoE SKU; Intel TCC and TSN Support for Real-Time Computing; DIN Rail or Wall Mount Options; 4 x Intel 1G LAN (2 Support IEEE 802.3AF PoE Ports), 1 x Intel 2.5G LAN; Support Intel IN-Band ECC
RAM: 1 x 262-pin SO-DIMM DDR5 4800 MHz, up to 48GB
Expansion: 2 x USB 3.2 Gen2, 4 x USB 2.0, 1 x M.2 Key E, 1 x M.2 Key M, 1 x M.2 Key B, 4 x COM, 1 x SATA3
Other features: 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN; Intel TCC and TSN support for Real-Time Computing; Supports Triple display, 1 x HDMI 2.0b, 1 x DP 1.4b, 1 x LVDS, 1 x eDP; 9~36V DC-In PWR; Operating Temp -40° C ~ 85° C
Other features: 4K High Resolution Support, Triple Display Capability, Rich I/O Connectivity: 2 2.5GbE LAN, up to 4 USB 3.2, 1 USB Type C, 2 SATA3, 2 USB2.0, Longevity Support: Typically supports a 10-Year CPU Life Cycle Until Q1’ 33.
Other Features: Dual 2.5GbE ports, USB 3.2 Gen 2, Onboard TPM 2.0, 9 ~ 36V DC input, -20°C ~ 70°C wide temperature range, optional Hailo-8 AI Accelerator support
Expansion: 4 x PCIe x1 (Gen3), 2 x USB 3.2 Gen2, 8 x USB 2.0, 2 x UART, 2 x SATA3
Other features: 1 x Intel 2.5 Gigabit LAN, Supports Dual Display, 2 x DDI, 1 x eDP, 1 x DP or HDMI, TPM 2.0 onboard IC (optional), ATX: 12V±5%/5Vsb±5%, AT: 9~20V±5%
CPU: Intel Alder Lake Core i3-N305 processor 15W with 8 E-Cores or Atom x7425E
RAM: Up to 16GB DDR5-4800 SODIMM
Expansion: M.2 2280 M key SATA socket
Other features: -25 °C to 70 °C rugged wide temperature operation, 4x GbE ports PoE+ / 4x USB3.2 Gen 2 with screw-lock, DP++ / HDMI 1.4b dual display outputs, 4-CH isolated DI + 4-CH isolated DO, Front I/O access DIN-mounting design, MezIO compatible
CPU: Intel Alder Lake Core i3-N305 processor 15W with 8 E-Cores or Atom x7425E
RAM: Up to 16GB DDR5-4800 SODIMM
Expansion: M.2 2280 M key SATA socket
Other features: -25 °C to 70 °C rugged wide temperature operation, 4x GbE ports PoE+ / 4x USB3.2 Gen 2 with screw-lock, DP++ / HDMI 1.4b dual display outputs, 4-CH isolated DI + 4-CH isolated DO, Front I/O access DIN-mounting design, MezIO compatible
RAM: Up to 32GB DDR4 3200 MHz (2 x 260-pin SO-DIMM, 16GB per DIMM)
Expansion: 1 x USB 3.2 Gen2, 3 x USB 2.0, 1 x M.2 Key E, 1 x M.2 Key M, 3 x COM, 1 x SATA3
Other features: 2 x Intel 2.5 Gigabit LAN, Supports dual display (1 x HDMI 2.0b, 1 x VGA), 1 x 19V/65W AC-DC power brick adapter, Compact dimensions: 200 x 134.5 x 39mm.
CPU: Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/3.0GHz 12W processor
RAM: Up to 32GB DDR4-3200 SDRAM by one SODIMM socket
Expansion: 4x Gigabit PoE+ ports via RJ-45 connector with screw-lock, 2x full-size mini-PCIe sockets, 1x M.2 3042/3052 B key, 1x front-accessible 2.5” SATA SSD tray (up to 15mm height), 1x M.2 2280 SATA
Other features: Rugged -25°C to 70°C fanless operation, 1x isolated RS-485 port and 1x RS-422/485 or 3x 3-wire RS-232 ports, 1x patented Cassette for single-slot PCIe card (Nuvo-2600E) or 1x 2500 watt-second SuperCAP UPS (Nuvo-2600J), 8V to 35V wide-range DC input with remote control and optional ignition power control
CPU: Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/3.0GHz 12W processor
RAM: Up to 32GB DDR4-3200 SDRAM by one SODIMM socket
Expansion: 4x PoE+ GbE ports via M12 x-coded connectors, 1x front-accessible 2.5” 15mm HDD tray and 1x M.2 2280 SATA SSD, 1x M.2 3042/3052 B Key for 4G/5G mobile broadband, 2x full-size mini-PCIe sockets for WIFI/CAN/GNSS modules
Other features: Rugged -40°C to 70°C fanless operation, compliant with EN 50155 Class OT4, 8-35V wide-range DC input with built-in ignition power control
CPU: Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/3.0GHz 12W processor
RAM: Up to 32 GB DDR4-3200 SDRAM by one SODIMM socket
Expansion: 2x full-size mini-PCIe sockets, 1x M.2 3042/3052 B Key
Other features: Compliant with EN 50155 and EN 45545-2 standards, rugged -40°C to 70°C fanless operations, 43V to 160V wide-range DC input with 1500Vdc insulation, 4x PoE+ GbE ports via M12 x-coded connectors, built-in SuperCAP UPS for power interruptions > 30 seconds (Nuvo-2615RL only), 1x front-accessible 2.5″ 15mm HDD tray and 1x M.2 2280 SATA SSD.
CPU: Intel Elkhart Lake Atom x6211E dual-core processor
RAM: Up to 32 GB DDR4-3200 SDRAM (one SODIMM slot)
Expansion: M.2 2280 M key SATA storage, One M.2 B key socket supporting 5G/4G 3042/3052 modules, One M.2 E key socket for WiFi 5/WiFi 6 modules
Other features: 52 x 89 x 112 mm extremely compact form factor, Rugged -25°C to 70°C fanless wide-temperature operation, Two GigE ports, two USB 3.1 Gen1 ports, and two USB 2.0 ports, One COM port with RS-232/422/485 modes and three RS-232 COM ports
System Type: Ultra-compact Fanless Embedded Computer
CPU: Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/3.0GHz 12W processor
RAM: Up to 32 GB DDR4-3200 SDRAM by one SODIMM socket
Expansion: M.2 2280 M key SATA interface, MezIO compatible
Other features: Rugged -25 °C to 70 °C fanless operation, 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock, 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock, Dual DP display outputs supporting 4096 x 2160 resolution, Front I/O access DIN-mounting design
CPU: Latest and Powerful Intel Atom x6000E Processor (Elkhart Lake-PU)
RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
Expansion: Most Flexible IOs and Expansion for Industrial Applications
Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40°C to 70°C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options, 4 x Intel 1G LAN (2 Support IEEE 802.3AF PoE Ports), 1 x Intel 2.5G LAN, Support Intel IN-Band ECC
RAM: 1 x SO-DIMM, DDR4 3200 MHz, 4GB 8GB (Optional)
Expansion: Not specified
Other features: Features PCAP touch screen, field-replaceable front panel, IP65-rated waterproof and dustproof design, engineered for wide temperature range operation.
Other features: IP65-rated waterproof and dustproof design, wide power input range (10-60V DC) with ignition support, engineered for wide temperature range operation, supports VESA mount for easy installation and integration.
RAM: 1 x SO-DIMM, DDR4 3200 MHz, 4GB 8GB (Optional)
Expansion: Not specified
Other features: Features a 12.1″ 1024 x 768 Panel with PCAP touch functionality, equipped with a field-replaceable front panel, IP65-rated waterproof and dustproof design, engineered to operate reliably in a wide range of temperatures.
Other features: Features a 12.1″ 1024 x 768 Panel with PCAP touch screen, IP65-rated waterproof and dustproof design, wide power input range of 10-60V DC with ignition support, engineered for reliable operation in various temperatures, supports VESA mount for easy installation.
RAM: 1 x SO-DIMM, DDR4 3200 MHz, 4GB 8GB (Optional)
Expansion: Not specified
Other features: Features a 14″ 1920 x 1080 Panel with a PCAP touch screen, IP65-rated waterproof and dustproof design, wide power input range of 10-60V DC with ignition support, engineered to operate reliably in a wide range of temperatures, supports VESA mount.
RAM: 2 x 260-pin SO-DIMM DDR4 3200 MHz, up to 32GB (16GB per DIMM)
Expansion: 1 x USB 3.2 Gen2, 1 x USB 3.2 Gen1, 6 x USB 2.0, 1 x M.2 Key E, 1 x M.2 Key M, 1 x M.2 Key B, 4 x COM, 1 x SATA3
Other features: 2 x Intel 2.5 Gigabit LAN, Support Triple display, 1 x LVDS or eDP, 1 x HDMI2.0b, 1 x VGA, TPM 2.0 onboard IC, 9~36V DC-In
BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
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