Expansion: Compact size with multiple COM, CANBus, and DIO for communication
Other features: CE and FCC certified and ISO 7637-2 compliant, Fanless and wide operating temperatures from -40°C to +70°C, Supports 9 to 36 VDC and 12/24 VDC typical in-vehicle power input, Smart Ignition for power on/off schedule, vehicle battery protection, and different power modes, Suitable for transportation gateway applications
System Type: Fanless Stainless Steel Waterproof Box PC
CPU: Intel Elkhart Lake J6412
RAM: Dual channel support 3200MHz DDR4 SODIMM socket x 2, up to 32GB
Expansion: 2x M12 USB for USB1/2+3/4 ; 2x M12 COM ; 1x M12 LAN
Other features: IP66/69K Full Sealed with Anti-Corrosion Enclosure, IP67 M12 Stainless/Metal Connectors, M12 DC 12-28V with IP68 120W power adapter, 1x M12 DC ; 1x IP65 HDMI ; Power on/off bottom, 100% Waterproof Guarantee, CE, FCC, VCCI Class B Certified
Module Form Factor: Intel Elkhart Lake Celeron / Atom Qseven
CPU: Intel Elkhart Lake Celeron / Atom
RAM: 4GB/8GB LPDDR4 Single Channel Memory Down
Expansion: Multiple expansions: 4 PCIe x1
Other features: 1 DDI*, 1 LVDS*/eDP, DP++ resolution supports up to 4096×2160 @ 60Hz, Rich I/O: 1 Intel GbE, 3 USB 3.1, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
Other Features: Supports 4K/2K resolution, triple display (HDMI, Type-C DP Alt Mode, LVDS/eDP), 3x 2.5GbE LAN, 4x USB 3.2, 2x USB 2.0, 1x SATA, 10-year CPU lifecycle until Q1 2033 with optional 5-year extended support
Other Features: Supports 4K/2K resolution, triple display (HDMI, Type-C DP Alt Mode, LVDS/eDP optional), 3x 2.5GbE LAN, 4x USB 3.2, 2x USB 2.0, 1x SATA, wide temperature support (-40 to 85°C)
Expansion: Multiple Expansion: 1 M.2 E Key, 1 Mini- PCIe/M.2 B Key, 1 I2C
Other features: 4K High Resolution, Triple Independent Displays (1 VGA, 1 DP++, 1 LVDS/eDP), Rich I/O (2 LAN, 2 USB 3.1 Gen2, 2 USB 2.0, 2 COM, 1 SATA 3.0), 15-Year CPU Life Cycle Support Until Q4′ 35 (Based on Intel IOTG Roadmap)
CPU: Latest and Powerful Intel Atom x6000E Processor
RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
Expansion: Most Flexible IOs and Expansion for Industrial Applications
Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40 °C to 70 °C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options
CPU: Latest and Powerful Intel Atom x6000E Processor
RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
Expansion: Most Flexible IOs and Expansion for Industrial Applications
Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40 °C to 70 °C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options
System Type: Elkhart Lake 5G Fanless Embedded System
CPU: Intel Atom Processors X Series
RAM: One 260 pin DDR4 SODIMM up to 3200MHz
Expansion: Support 5G Sub-6 module, Support WiFi 6 module, Support Isolated COM & DIO
Other features: 4 LAN: Support 1 x 2.5GbE TSN, 3 x GbE LAN, Wide Operating Temperature: Support up to -40 ~ 70°C, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
Expansion: 1 M.2 B Key, 1 M.2 E Key, 1 PCIe x4 (x2 signal)
Other features: 3 Independent Displays: 1 DP++/VGA, 1 HDMI/DP++, 1 eDP/LVDS; Rich I/O: 2 x 2.5GbE, 2 USB 3.1 Gen2, 2 USB 3.1 Gen1, 6 COM, up to 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
Module Form Factor: COM Express Mini – COM Express Type 10
CPU: Intel Atom Processor Elkhart Lake Series
RAM: Dual Channel LPDDR4X 3200MHz/4267MHz up to 16GB
Expansion: Multiple expansions: 4 PCIe x1
Other features: 1 LVDS/eDP, 1 DDI (HDMI/DP++); Supports dual displays: DDI + LVDS/eDP, Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap).
Other features: Independent display: 2 x HDMI (DP), 1 x eDP, 2 x Intel 2.5 GbE LAN, 2 x USB 3.0, 5 x USB 2.0, 4 x COM, Touch Screen, 4DI / 4DO, TPM 2.0
CPU: Onboard Intel Atom Processor E3950 1.6 GHz, up to 2.0 GHz
RAM: 1 x SO-DIMM, DDR3L 1866 MHz, 4GB 8GB (Optional)
Expansion: 1 x RS232 / 422 / 485 communication (select thru BIOS), 4 x Giga LAN, 3 x USB 3.0, 1 x USB 2.0, 1 x VGA, 1 x Line out, 1 x line in, 1 x Mic in, 1 x Power Jack
Other features: Class 1, Division 2 device certified for hazardous area application, DIN Rail design for Industrial Automation applications, Fanless, streamlined enclosure for highly efficient heat Dissipation, -40˚C~70˚C wide operation temperature range, AWS IoT Greengrass Certified
Other features: Two GbE LAN ports, Two RS-232/422/485, Pre-installed Mustang-MPCIE-MX2, 2 x Intel Myriad X VPU for AI deep learning workload consolidation
System Type: Ruggedized Outdoor IoT IP67 Fanless Embedded System
CPU: Intel Atom Processor E3900 Series
RAM: 4GB DDR3 onboard, 64G eMMC
Expansion: 1 x Full-size Mini PCIe for 4G LTE module, 1 x Full-size Mini PCIe for Canbus, 1 x M.2 2230 (USB2.0/PCIe) for WiFi module
Other features: Ruggedized IPC67 Grade Box PC, Outdoor IoT Gateway Application, Operating temperature: -40° to 70° C, 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
Expansion: 1 x Mini-PCIe full size for option 3G/LTE/GPS, 1 x Mini-PCIe half size slot for option WIFI/BT, 1 x SIM slot onboard, 1 x SMA connector for option GPS antenna
Other features: High Brightness LED Backlight LCD, Rugged Engineering Plastics Enclosure and Fanless Design, 6~36V DC Wide-ranging Power Input, HDD/SSD: 1 x Micro SD onboard, 1 x mSATA MO-300 slot
Expansion: 1 x Mini-PCIe full size for option 3G/LTE/GPS, 1 x Mini-PCIe half size slot for option WIFI/BT, 1 x SIM slot onboard, 1 x SMA connector for option GPS antenna
Other features: High Brightness LED Backlight LCD, Rugged Engineering Plastics Enclosure and Fanless Design, 6~36V DC Wide-ranging Power Input, HDD/SSD: 1 x Micro SD onboard, 1 x mSATA MO-300 slot
Other features: Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0; 1 DDI*, 1 LVDS*/(eDP + DDI) Supports triple displays: eDP+2DDI; 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)
Other features: 1 DDI*, 1 LVDS*/(eDP + DDI);Supports triple displays: eDP+2DDI; DP++ resolution supports up to 4096×2160 @ 60Hz; Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
Other features: Three independent displays: VGA*/DDI + LVDS*/eDP + DDI; Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0, 2 SATA 3.0; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
RAM: Dual Channel LPDDR4-2400MHz Memory Down up to 8GB
Expansion: Multiple expansions: 4 PCIe x1
Other features: Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0; 1 LVDS/eDP, 1 DDI (HDMI/DP++) Supports dual displays: DDI + LVDS/eDP; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
CPU: Intel Atom Processor E3900 Series or Celeron CPU
RAM: 2GB/4GB LPDDR4 Memory Down
Expansion: 1 Mini DP++
Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 1 USB 2.0, 15-Year CPU Life Cycle Support Until Q4’31 (Based on Intel IOTG Roadmap), Operating: 0 to 60°C
Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 1 USB 2.0, 15-Year CPU Life Cycle Support Until Q4’31 (Based on Intel IOTG Roadmap), Operating: -40 to 85°C
Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 1 USB 2.0, 15-Year CPU Life Cycle Support Until Q4’31 (Based on Intel IOTG Roadmap), Operating: -20 to 70°C
RAM: 1 SODIMM Memory Support up to 8GB Single Channel DDR3L 1600/1866MHz
Expansion: 1 mSATA, eMMC (optional), 1 x Full-size Mini PCIe (PCIe/USB/Daul micro SIM), 1 x Full-size Mini PCIe (PCIe/USB/micro SIM), 1 x Half-size mSATA
Other features: Supports ignition delay on/off function, GPS Onboard, 3 SIM Slots Onboard, Supports Wi-Fi, 3G, and GPRS application, 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)
CPU: Intel Atom X5-E3930 / X5-E3940 / 7-E3950 / N3350
RAM: 1 DDR3L SODIMM up to 8GB
Expansion: 1 Mini PCIe, 1 M.2, 1 SMBus
Other features: Two independent displays: LVDS + Mini DP++, Rich I/O: 1 Intel GbE, 1 COM, 2 USB 3.1 Gen1, 2 USB 2.0, 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
System Type: Fanless Wide Temp Embedded Ultra Compact PC
CPU: Intel Atom Processor E3900 Series, BGA 1296
RAM: DDR3L-1866 memory onboard + 1 SODIMM up to 8GB
Expansion: Supports 2 Mini PCIe and 1 M.2 slots
Other features: Displays: 1 DP/HDMI combo + 1 DP/VGA, Rich I/O ports: up to 4 Intel GbE, 4 COM, 4 USB, Extended operating temperature: -40 to 70°C, 15-Year CPU Life Cycle Support Until Q1’31 (Based on Intel IOTG Roadmap)
CPU: Intel Atom X5-E3930 / X5-E3940 / 7-E3950 / N3350
RAM: 1 DDR3L SODIMM up to 8GB
Expansion: 1 Mini PCIe, 1 M.2, 1 SMBus
Other features: Fanless design, operating temperature -40 to 85°C, Triple independent displays: VGA + Mini DP++ + LVDS, Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 2 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)
CPU: Intel Atom X5-E3930 / X5-E3940 / N3350 / X5-E3930
RAM: Support LPDDR4 memory down up to 4GB
Expansion: 1 Mini PCIe, 1 SMBus, 1 eMMC
Other features: Fanless design, operating temperature 0 to 60°C, Rich I/O: 1 LAN, 1 COM, 2 USB 3.0, 2 USB 2.0, PoE single board solution support PoE PD 48VDC, 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)
RAM: 2GB/4GB ECC Memory Single Channel DDR3L 1333MHz
Expansion: 1 x Full-size Mini PCIe (PCIe/USB), 1 x Full-size Mini PCIe (mSATA), 1 x Half-size Mini PCIe (PCIe/USB/LPC)
Other features: Supports Ignition Control and Delay On/Off Function, IP65 Front Panel Protection, VESA/Panel Mount, Rich I/O: 2 LAN, 5 COM, 1 USB 3.0, 3 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 28 (Based on Intel IOTG Roadmap), 10.1″ 1280×800 TFT LCD Panel with Touch Screen, 2.5″ SATA 2.0 Drive Bay, micro SD (available upon request)
RAM: 2GB/4GB ECC Memory Single Channel DDR3L 1333MHz
Expansion: 1 x Full-size Mini PCIe (PCIe/USB), 1 x Full-size Mini PCIe (mSATA), 1 x Half-size Mini PCIe (PCIe/USB/LPC)
Other features: Supports Ignition Control and Delay On/Off Function, IP65 Front Panel Protection, VESA/Panel Mount, Rich I/O: 2 LAN, 5 COM, 1 USB 3.0, 3 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 28 (Based on Intel IOTG Roadmap)
Other features: Anti-vibration and fanless design, Supports ignition delay on/off function, Supports Wi-Fi, 3G, and GPRS application, 15-Year CPU Life Cycle Support
RAM: Supports Dual Channel DDR3L 1867MHz, 2 x SO-DIMM, up to 16GB system memory
Expansion: 1 x Mini-PCIe, 1 x Mini-PCIe / mSATA Colay
Other features: 1 x VGA, 1 x HDMI, 1 x LVDS or eDP (Jumper Switch), 2 x USB 3.0, 4 x USB 2.0, 1 x SATA3, Gigabit LAN: 2 x Intel LAN, 1 x TPM Header, 9V~36V DC-in (4-pin PWR Con)
Other features: Sunlight readable 10.4″ SVGA high brightness (1000 nits), Alternative keypad control in the front bezel, Auto-dimming for different environment, -25°C to +70°C wide temperature range (T3 Level), EN 50155 certified for railway application
Other features: Sunlight readable 10.4″ SVGA high brightness (1000 nits), Alternative keypad control in the front bezel, Auto-dimming for different environment, -25°C to +70°C wide temperature range (T3 Level), EN 50155 certified for railway application
Other features: Sunlight readable 12.1″ XGA LCD with a high brightness of 800 nits, Fanless, Auto-dimming for different environments, -25°C to +70°C wide temperature range, EN 50155 compliance for railway application
Other features: Sunlight readable XGA TFT LCD with a high brightness rating of 800 nits, Fanless design, Auto-dimming for different environments, -25°C to +70°C wide temperature range, Typical 24 to 110 VDC wide power input range, EN 50155 and EN 45545-2 certified for railway applications, Class S3 20ms power interruption protection
BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
We use cookies to enhance your browsing experience and analyse website performance. We do not collect personal data or show personalized ads. By consenting to cookies, you help us improve site functionality, optimize your experience, and gain insights into site statistics.
Functional
Always active
The technical storage or access is strictly necessary for the legitimate purpose of enabling the use of a specific service explicitly requested by the subscriber or user, or for the sole purpose of carrying out the transmission of a communication over an electronic communications network.
Preferences
The technical storage or access is necessary for the legitimate purpose of storing preferences that are not requested by the subscriber or user.
Statistics
The technical storage or access that is used exclusively for statistical purposes.We use cookies to improve your browsing experience and track website statistics. We do not store any personal data or display personalized ads. Consenting to cookies helps us optimize site performance.
Marketing
The technical storage or access is required to create user profiles to send advertising, or to track the user on a website or across several websites for similar marketing purposes.