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Industrial and Embedded Products

  • HPC150R DCP series 45D
    Jetway 15″ – 32″ Tiger Lake Celeron IP65 Rugged Industrial Panel PC Series
    • Product Name: Jetway Tiger Lake Celeron IP65 Panel PC
    • Screen Size: 15″, 17″, 19″, 23.8″, 27″, or 32″ TFT LCD with LED backlight
    • CPU: Intel Tiger Lake 6305E processor
    • RAM: 2* DDR4 SO-DIMM (Max 64GB)
    • Expansion: Not specified
    • Other features: 5 Wire Resistive Touch/Anti-Reflection Protection Glass, Support Open frameless design, Easy HDD and RAM installation, cable-free design, 2-36V DC-in, with Electrical Over Stress (EOS) and OVP design, Front bezel meets IP65-rated protection
  • rsc101
    Axiomtek RSC101 J6412/N6210 Hailo-8 Processor Edge AI Vision System
    • Product Name: Axiomtek RSC101
    • System Type: Edge AI Vision System
    • CPU: Intel Celeron processor J6412/N6210
    • RAM: 1 x DDR4 SO-DIMM slot, up to 32GB
    • Expansion: Supports dual GbE LAN for cameras
    • Other features: Hailo-8 AI processor, up to 26 TOPS, Palm size with high AI computing performance, Supports Wi-Fi/Bluetooth/5G/LTE wireless connection, Wide operating temperature from -10°C to +60°C, Wide voltage input from 12 to 24 VDC, Supports Windows 10 and Linux, Ideal for edge AI smart city applications
  • EHL700
    DFI EHL700 Intel Elkhart Lake Celeron / Atom Qseven
    • Product Name: DFI EHL700
    • Module Form Factor: Intel Elkhart Lake Celeron / Atom Qseven
    • CPU: Intel Elkhart Lake Celeron / Atom
    • RAM: 4GB/8GB LPDDR4 Single Channel Memory Down
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: 1 DDI*, 1 LVDS*/eDP, DP++ resolution supports up to 4096×2160 @ 60Hz, Rich I/O: 1 Intel GbE, 3 USB 3.1, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
  • TP series
    Kingdy 11th Gen 7″ – 24″ Rugged Industrial Aluminium Panel PC Series
    • Product Name: Kingdy 11th Gen Industrial Aluminium Panel PC Series</li> <li><strong>Screen Size: 7″ – 24″
    • CPU: 11th Gen Intel Core Celeron 6305E / i3-1115G4E / i5-1145G7E / i7-1185G7E and Intel Elkhart Lake ATOM X series processors
    • RAM: DDR4 So-DIMM up to 64GB
    • Expansion: True Flat PCT or 5 Wires Resistive touch solution
    • Other features: Fanless and Rugged Aluminium Design, Standard and High Brightness Display, Resolution 1024×768 to 1920×1080, IP65 / IP66 Silver Aluminium front bezel, Operating Temperature: Standard (0 ~ 45°C) and Wide Temp (-20 ~ 60°C)
  • FB0103 1
    Kingdy 11th Gen Full IP65 Stainless Steel PC
    • Product Name: Kingdy 11th Gen Full IP65 Stainless Steel PC
    • System Type: Full IP65 Stainless Steel PC
    • CPU: 11th Gen Intel Core Celeron 6305E i3-1115G4E / i5-1145G7E / i7-1185G7E
    • RAM: 1 x 260-pin DDR4 3200MHz SODIMM up to 64 GB
    • Expansion: 1 x M.2 M key, 1 x M.2 B Key, 1 x M.2 E Key
    • Other features: Full IP65 304 stainless steel enclosure, All M12 waterproof connectors with cables, 1 x LAN, 2 x RS232, 2 x USB, 1 x HDMI, Wall mount, IIoT gateway, Wide Temperature (optional)
  • ADS101 ADS103 1
    DFI ADS101/ADS103 12th Gen Alder Lake-S Mini-ITX SBC
    • Product Name: DFI ADS101/ADS103
    • Motherboard Form Factor: Mini-ITX
    • CPU: 12th Generation Intel Core Processors
    • RAM: 2 DDR4 3200MHz SODIMM up to 64GB
    • Expansion: Multiple expansion: 1 PCIe x16 gen 5, 1 M.2 E Key (USB/PCIe), 1 M.2 M Key (PCIe/SATA), 1 M.2 B Key (PCIe/SATA/USB)
    • Other features: Quad Displays: 1 DP++, 1 DP++/HDMI, 1 LVDS/eDP, 1 DFI display extension port (DP/HDMI/VGA available), Supports up to 4K/2K resolution, Rich I/O: 1 Intel 2.5GbE, 2 Intel GbE, 2 COM, up to 6 USB 3.2 Gen2, 2 USB 3.2 Gen1, 4 USB 2.0, 2 SATA 3.0, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • CB103 1
    Kingdy Intel 11th Gen Rugged Fanless Box PC
    • Product Name: Kingdy Intel 11th Gen Rugged Fanless Box PC
    • System Type: Fanless Box PC
    • CPU: 11th Gen Intel Core Celeron 6305E i3 1115G4E / i5 1145G7E / i7 1185G7E
    • RAM: 2 x 260-pin DDR4 3200MHz SODIMM up to 64 GB
    • Expansion: 1 x M.2 M Key, 1 x M.2 B Key, 1 x M.2 E key
    • Other features: 4 x USB 3.2, 2 x USB 2.0, 4 x RS232 / RS422 / RS485, 2 x GLAN, 1 x HDMI, 1 x DP, GPIO 16 bits, Wall Mount / DIN Rail installation, IIoT gateway, Wide Temperature (optional)
  • DRPC 240 TGL U 1
    IEI DRPC-240-TGL-U Tiger Lake Fanless DIN-Rail Embedded System
    • Product Name: IEI DRPC-240-TGL-U
    • System Type: Fanless DIN-Rail Embedded System
    • CPU: Supported CPUs: Intel Celeron 6305/6305E, i5-1145G7E, i7-1185G7E
    • RAM: 2 x SO-DIMM DDR4 3200 MHz (8 GB pre-installed) (up to 64GB)
    • Expansion: 4 x 2.5GbE ports, supporting PoE (optional), 2 x RS-232 & 2 x RS-422/485 (with 2.5kV isolation)
    • Other features: CE/FCC compliant
  • ADS310 R680E Q670E Micro ATX 1
    DFI ADS310-R680E/Q670E 12th Gen Alder Lake-S Micro-ATX Motherboard
    • Product Name: DFI ADS310-R680E/Q670E
    • Motherboard Form Factor: Micro-ATX
    • CPU: 12th Gen Intel Core with Intel R680E/Q670E chipset
    • RAM: 4 DDR4 UDIMM up to 128GB
    • Expansion: Multiple expansion: 1 PCIe x16 gen 5, 3 PCIe x4, 1 M.2 E key, 2 M.2 M key, 4 SATA 3.0
    • Other features: Supports 4 independent displays: VGA, 2 DP++, HDMI 2.0a, Supports 8K/4K resolution, Rich I/O: 2 Intel 10GbE, 2 Intel 2.5GbE, 2 COM, 6 USB 3.2 Gen 2, 4 USB 3.2 Gen 1, 4 USB 2.0
  • RPS310 1
    DFI RPS310-R680E/Q670E 12th Gen Alder Lake-S Micro-ATX Motherboard
    • Product Name: DFI RPS310-R680E/Q670E
    • Motherboard Form Factor: Micro-ATX
    • CPU: 14th/13th/12th Gen Intel Core with Intel R680E/Q670E chipset
    • RAM: 4 DDR5 UDIMM up to 128GB
    • Expansion: 1 PCIe x16, 3 PCIe x4, 1 M.2 E key, 2 M.2 M key, 4 SATA 3.0
    • Other features: 4 independent displays: VGA, 2 DP++, HDMI 2.0a, Supports 8K/4K resolution, Rich I/O: 2 Intel 10GbE, 2 Intel 2.5GbE, 2 COM, 6 USB 3.2 Gen 2, 4 USB 3.2 Gen 1, 4 USB 2.0
  • ADS630 R680E Q670E ATX 1
    DFI ADS630-R680E/Q670E 12th Gen Alder Lake-S ATX Motherboard
    • Product Name: DFI ADS630-R680E/Q670E
    • Motherboard Form Factor: ATX
    • CPU: 12th Gen Intel Core Processors
    • RAM: 4 DDR4 UDIMM up to 128GB
    • Expansion: Multiple Expansion: 1 PCIe x16(Gen 5), 4 PCIe x4(Gen 4), 2 PCI, 2 M.2 M key, 1 M.2 E Key
    • Other features: Quad Displays: VGA + 2 x DP++ + HDMI, Supports 4K resolution, Rich I/O: 2 Intel 10GbE, 2 Intel 2.5GbE, 6 USB 3.2 Gen2, 4 USB 3.2 Gen1, 3 USB 2.0
  • IMB 1003L1
    ASRock Industrial IMB-1003 Elkhart Lake Fanless Mini-ITX SBC
    • Product Name: Asrock IMB-1003
    • Motherboard Form Factor: Mini-ITX
    • CPU: Intel Elkhart Lake SoC Processors
    • RAM: 2 x 260-pin SO-DIMM DDR4 3200 MHz, up to 32GB
    • Expansion: 1 x PCIE x1 Gen3, 1 x M.2 Key E, 1 x M.2 Key M, 1 x M.2 Key B, 6 x COM, 2 x SATA3
    • Other features: 4 x USB 3.2 Gen1, 7 x USB 2.0, 1 x Realtek 2.5 Gigabit LAN, 1 x Realtek 1 Gigabit LAN, Support Triple display, 1 x LVDS or eDP, 1 x HDMI 2.0b, 1 x VGA, TPM Header, ATX-PWR (24+4-pin) and 12~28V DC-In co-design
  • EHL556 1
    DFI EHL556 Elkhart Lake Atom X Series 3.5″ SBC
    • Product Name: DFI EHL556
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom X Series Processor
    • RAM: 1 DDR4-3200 SODIMM up to 32GB
    • Expansion: Multiple Expansion: 1 M.2 E Key, 1 Mini- PCIe/M.2 B Key, 1 I2C
    • Other features: 4K High Resolution, Triple Independent Displays (1 VGA, 1 DP++, 1 LVDS/eDP), Rich I/O (2 LAN, 2 USB 3.1 Gen2, 2 USB 2.0, 2 COM, 1 SATA 3.0), 15-Year CPU Life Cycle Support Until Q4′ 35 (Based on Intel IOTG Roadmap)
  • IMB 1004L1
    ASRock Industrial IMB-1004 Elkhart Lake Mini-ITX SBC
    • Product Name: Asrock IMB-1004
    • Motherboard Form Factor: Mini-ITX SBC
    • CPU: Intel ElkHart Lake SoC Processors
    • RAM: 2 x 260-pin SO-DIMM DDR4 3200 MHz, up to 32GB
    • Expansion: 1 x PCIE x1 Gen3, 4 x USB 3.2 Gen1, 7 x USB 2.0, 1 x M.2 Key E, 1 x M.2 Key M, 1 x M.2 Key B, 4 x COM, 2 x SATA3
    • Other features: 1 x Realtek 2.5 Gigabit LAN, 1 x Realtek 1 Gigabit LAN; Support Triple display, 1 x LVDS or eDP, 1 x HDMI2.0b, 1 x VGA; TPM Header; 12~28V DC-In
  • NUC 1245UE 1
    ASRock Industrial NUC-7305 12th Gen Alder Lake-P Celeron NUC SBC
    • Product Name: Asrock NUC-7305
    • Motherboard Form Factor: NUC
    • CPU: Intel 12th Gen (Alder Lake-P) Core Processors
    • RAM: 2 x 260-pin SO-DIMM DDR4 3200 MHz, up to 64GB
    • Expansion: 6 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
    • Other features: 2 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0b, 3 x DP 1.4a (2 from Type-C), TPM 2.0 onboard IC, 12V~19V DC-In
  • 7 Winmate IP67 Resistive Chassis Panel PC 1
    Winmate 10″ – 19″ IP67 Stainless Resistive Panel PC Series – N6211
    • Product Name: Winmate IP67 Stainless Resistive Chassis Celeron
    • Screen Size: 10″ – 19″
    • CPU: Intel Celeron Elkhart Lake N6211 Processor / Bay Trail-M N2930 1.83GHz Processor
    • RAM: 1 x SO-DIMM, DDR3L 1600 MHz, 4GB 8GB (Optional)
    • Expansion: Not specified
    • Other features: Fanless Design, Full IP67 dust/water resistant, SUS 316 / AISI 316 stainless steel, Optical Bonding with Anti-moisture Treatment, 5 Wire Resistive Touch/ Anti-Reflection Protection Glass (Optional)
  • 7 Winmate IP67 Resistive Chassis Panel PC 1
    Winmate 10″ – 19″ IP67 Stainless Resistive Panel PC Series – N6211
    • Product Name: Winmate IP67 Stainless Resistive Chassis
    • Screen Size: 10″ – 19″
    • CPU: Intel Celeron Elkhart Lake N6211 Processor
    • RAM: 1 x SO-DIMM, DDR4 3200 MHz, 4GB 8GB (Optional) 16GB (Optional)
    • Expansion: Not specified
    • Other features: Fanless Design, Full IP67 Dust / Water Resistant, SUS 316 / AISI 316 Stainless Steel, Optical Bonding with Anti-moisture Treatment, 5 Wire Resistive Touch / Anti-Reflection Protection Glass (Optional)
  • 1 IP65 Stainless B Series with Push Buttons 1
    Winmate 10″ – 24″ IP65 Stainless B Push Buttons Panel PC Series – N2930
    • Product Name: Winmate IP65 Stainless B Series with Push Buttons
    • Screen Size: 10″ – 24″
    • CPU: Intel Celeron N2930 (2M Cache, up to 2.16 GHz)
    • RAM: 1 x SO-DIMM, DDR3L 1600 MHz, 4GB 8GB (Optional)
    • Expansion: Not specified
    • Other features: Fanless cooling system, SUS 316/ AISI 316 stainless steel for food and chemical industries, Full IP65 waterproof enclosure, True flat, easy-to-clean front surface with edge-to-edge design, Supports VESA mount, Rotary switch adjusts different touch modes for Hand/Rain/Glove application, Emergency and Flat buttons for automation device control, Optical bonding (optional)
  • N6211 IP65 Stainless B Series Panel PC 1
    Winmate 10″ – 24″ IP65 Stainless B Push Buttons Panel PC Series – N6211
    • Product Name: Winmate IP65 Stainless B Series with Push Buttons
    • Screen Size: 10″ – 24″
    • CPU: Intel Celeron Elkhart Lake N6211 processor
    • RAM: 1 x SO-DIMM, DDR4 3200 MHz, 4GB 8GB (Optional)
    • Expansion: 1 x M.2 2242 B-key
    • Other features: Fanless cooling system, SUS 316/ AISI 316 stainless steel for food and chemical industries, Full IP65 waterproof enclosure, True flat, easy-to-clean front surface with edge-to-edge design, Supports VESA mount, Rotary switch adjusts different touch modes for Hand/Rain/Glove application, Emergency and Flat buttons for automation device control, Optical bonding (optional)
  • kingdy ppc
    Kingdy 11th Gen 12″ – 24″ Rugged Stainless Steel Panel PC Series
    • Product Name: Kingdy 11th Gen Rugged Stainless Steel Panel PC Series
    • Screen Size: 12″ – 24″
    • CPU: 11th Gen Intel Core Celeron 6305E / i3-1115G4E / i5-1145G7E / i7-1185G7E and Intel Elkhart Lake ATOM X series processors
    • RAM: DDR4 So-DIMM up to 64GB
    • Expansion: True Flat PCT or 5 Wires Resistive touch solution
    • Other features: Fanless and Rugged Stainless Steel Design, Standard and High Brightness Display, Resolution 1024×768 to 1920×1080, IP65 Stainless Steel front bezel, Operating Temperature: Standard (0 ~ 45°C) and Wide Temp (-20 ~ 60°C)
  • ED700 EHL side
    DFI ED700-EHL Elkhart Lake 5G Fanless Embedded System
    • Product Name: DFI ED700-EHL
    • System Type: Elkhart Lake 5G Fanless Embedded System
    • CPU: Intel Atom Processors X Series
    • RAM: One 260 pin DDR4 SODIMM up to 3200MHz
    • Expansion: Support 5G Sub-6 module, Support WiFi 6 module, Support Isolated COM & DIO
    • Other features: 4 LAN: Support 1 x 2.5GbE TSN, 3 x GbE LAN, Wide Operating Temperature: Support up to -40 ~ 70°C, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
  • HBFDF04 Front45D
    Jetway HBFDF04 Series Elkhart Lake Embedded Mini PC
    • Product Name: Jetway HBFDF04 Series
    • System Type: Embedded Box PC
    • CPU: Intel Elkhart Lake SoC Processor (Default: J6412)
    • RAM: Support 2 * SO-DIMM DDR4-3200MHz up to 32GB
    • Expansion: 1* M.2 B-key (3042) Support USB3.1/USB2.0 interface, 1* M.2 E-key (2230) Support USB2.0/PCIe Gen.3 x1 interface
    • Other features: All-aluminium body, produced by casting process, 12~24V DC-in
  • MF04 Full
    Jetway MF04-03 Series J6412 Elkhart Lake 3.5″ SBC
    • Product Name: Jetway MF04-03 Series
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Elkhart Lake SoC Processor
    • RAM: 2* DDR4 3200MHz SO-DIMM up to 32GB
    • Expansion: 1* M.2 E-key 2230, 1* M.2 B-key 3042 W/SIM card slot, 1* M.2 M-key 2242/2280, 1* SATAIII (6Gb/s); 32GB eMMC (default)
    • Other features: 1* Intel i211AT GbE, 1* Intel i225LM 2.5GbE, 2* HDMI2.0b, 1* eDP (co-layout LVDS), 2* COM, 3* USB3.1 (Gen.2), 5* USB2.0, Support 12~24V DC-in
  • MF04 Full
    Jetway MF04-33 Series N6210 Elkhart Lake 3.5″ SBC
    • Product Name: Jetway MF04-33 Series
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Elkhart Lake SoC Processor
    • RAM: 2* DDR4 3200MHz SO-DIMM up to 32GB
    • Expansion: 1* M.2 E-key 2230, 1* M.2 B-key 3042 W/SIM card slot, 1* M.2 M-key 2242/2280, 1* SATAIII (6Gb/s); 32GB eMMC (default)
    • Other features: 1* Intel i211AT GbE, 1* Intel i225LM 2.5GbE, 2* HDMI2.0b, 1* eDP (co-layout LVDS), 2* COM, 3* USB3.1 (Gen.2), 5* USB2.0, Support 12~24V DC-in
  • Lex 2I110AW 1
    LEX 2I110AW 11th Gen Tiger Lake-UP3 i7/i5/i3 2.5″ Embedded SBC
    • Product Name: Lex 2I110AW
    • Motherboard Form Factor: 2.5″ SBC
    • CPU: 11th Gen Intel Tiger Lake-UP3, i7 / i5 / i3 / Celeron
    • RAM: 1 x DDR4 SODIMM (Max. 32GB)
    • Expansion: 1 x M.2 B Key, 1 x M.2 M Key
    • Other features: Multiple Independent display: 4 x HDMI, 3 x Intel 2.5 GbE LAN, 2 x USB 3.0 (type A), 4 x USB 2.0, 2 x COM, 4DI / 4DO, 1 x Nano SIM, TPM 2.0
  • 2I110D 1
    LEX 2I110D 11th Gen Tiger Lake-UP3 i7/i5/i3 2.5″ Embedded SBC
    • Product Name: Lex 2I110D
    • Motherboard Form Factor: 2.5″ SBC
    • CPU: 11th Gen Intel Tiger Lake-UP3, i7 / i5 / i3 / Celeron
    • RAM: 1 x DDR4 SODIMM (Max. 32GB)
    • Expansion: 1 x M.2 B Key, 1 x M.2 M Key
    • Other features: Multiple Independent display: HDMI, eDP, 4 x Intel GbE LAN, 3 x USB 3.0 (type A), 6 x USB 2.0, 2 x COM, 4DI / 4DO, 1 x Nano SIM, TPM 2.0
  • NUC BOX EHLL3 2
    ASRock Industrial NUC BOX-J6412 Intel Elkhart Lake NUC PC
    • Product Name: Asrock NUC BOX-J6412
    • System Type: Intel Elkhart Lake Celeron NUC 6000 BOX Series
    • CPU: Intel ElkHart Lake SoC Processors
    • RAM: 2 x 260-pin SO-DIMM up to 32GB DDR4 3200 MHz
    • Expansion: 4 x USB 3.2 Gen2, 1 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x SATA3
    • Other features: 2 x Realtek 1 Gigabit LAN, Supports Dual display, 1 x HDMI 2.0b, 1 x DP 1.4, TPM onboard, 19V/65W Power Adapter, 110.0 x 117.5 x 47.85mm, Fanned Barebone
  • 3I110HW 1
    LEX 3I110HW / 3I110BW 11th Gen Tiger Lake i7/i5/i3 3.5″ Embedded SBC
    • Product Name: Lex 3I110HW / 3I110BW
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: 11th Gen Intel Tiger Lake-UP3, i7 / i5 / i3 / Celeron
    • RAM: 2 x DDR4 SODIMM (Max. 64GB)
    • Expansion: 1 x M.2 B Key, 1 x M.2 M Key, 1 x Mini PCIe, 1 x SIM
    • Other features: Multiple Independent display: VGA, HDMI (or DP), eDP or LVDS, 3 x Intel GbE LAN, 6 x USB 2.0, 4 x COM, 4DI / 4DO, TPM 2.0, Battery Charger Function (3I110BW), OEM Option: DP (Type C), 1 x USB 3.0 (type C)
  • NUC J6412L1
    ASRock Industrial NUC-J6412 Intel Elkhart Lake Celeron NUC SBC
    • Product Name: Asrock NUC-J6412
    • System Type: Intel Elkhart Lake Pentium NUC 6000 Motherboard Series
    • CPU: Intel J6412 ElkHart Lake SoC Processor
    • RAM: 2 x 260-pin SO-DIMM DDR4 3200 MHz, up to 32GB
    • Expansion: 4 x USB 3.2 Gen2, 4 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
    • Other features: 2 x Realtek 1 Gigabit LAN, Supports Dual display, 1 x HDMI 2.0b, 1 x DP 1.4, TPM onboard, 12V~19V DC-In
  • WMP2157 L 1
    MACTRON WMP1567 15.6″ 12th Gen Medical All-In-One Panel PC
    • Product Name: MACTRON WMP1567
    • Screen Size: 15.6″
    • CPU: Intel Alder Lake Processors
    • RAM: 8GB DDR4
    • Expansion: Rich & Flexible I/O Port Design
    • Other features: Aluminium Die Casting Housing, Fanless & Front Panel IP65, Magnetic I/O Port Cover For Easy Maintaining
  • NUC N6210L1
    ASRock Industrial NUC-N6210 Intel Elkhart Lake Celeron NUC SBC
    • Product Name: Asrock NUC-N6210
    • System Type: Intel Elkhart Lake Pentium NUC 6000 Motherboard Series
    • CPU: Intel N6210 ElkHart Lake SoC Processor
    • RAM: 2 x 260-pin SO-DIMM DDR4 3200 MHz, up to 32GB
    • Expansion: 4 x USB 3.2 Gen2, 4 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
    • Other features: 2 x Realtek 1 Gigabit LAN, Supports Dual display, 1 x HDMI 2.0b, 1 x DP 1.4, TPM onboard, 12V~19V DC-In
  • WMP2157 L 1
    MACTRON WMP2157 21.5″ 12th Gen Medical All-In-One Panel PC
    • Product Name: MACTRON WMP2157
    • Screen Size: 21.5″
    • CPU: Intel Alder Lake Processors
    • RAM: 1 x SO-DIMM, DDR5 8GB, 4800MHz (Max.32GB)
    • Expansion: Not specified
    • Other features: 21.5″ Windows System, IEC60601 Medical Certified, Aluminium Die Casting Housing, Rich & Flexible I/O Port Design, Magnetic I/O Port Cover For Easy Maintaining
  • Winmate Marine W 1
    Winmate W10IB3S-MRH2 10.1″ IP66 5th Gen i5 PCAP ECDIS Marine Panel PC
    • Product Name: Winmate W10IB3S-MRH2
    • Screen Size: 10.1″
    • CPU: Intel Celeron N2930
    • RAM: 1 x SO-DIMM, DDR3L 1600 MHz, 4GB 8GB (Optional)
    • Expansion: Not specified
    • Other features: P-Cap multi-touch screen, Front IP65 and full IP44 ratings, Isolated connectors (M12 type), Wireless communications – Wi-Fi, WWAN, GPS (optional), Optical bonding with touch screen available on request
  • LE 37P 2D8
    Commell LE-37P iCore / Celeron / Xeon Tiger Lake 3.5″ SBC
    • Product Name: Commell LE-37P
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: iCore / Celeron / Xeon Tiger Lake
    • RAM: 1 x 260-pin DDR4 3200 MHz SO-DIMM up to 32GB (Support Non-ECC, unbuffered memory)
    • Expansion: 1 x MiniPCIe socket (support mSATA), 1 x M.2 (Key E 2230) and 2 x M.2 (Key M 2280) for NVMe, 1 x SIM slot
    • Other features: 6 x USB3.2 Gen2, 2 x SATA3, Dual Gigabit Ethernet, 2 x RS232 ports, 2 x RS232/422/485 ports, 2 x USB2.0 ports, Intel High Definition Audio.
  • LV 6713 2D8without Battery
    Commell LV-6713 Mini-ITX iCore / Celeron / Xeon Tiger Lake SBC
    • Product Name: Commell LV-6713
    • Motherboard Form Factor: Mini-ITX
    • CPU: iCore / Celeron / Xeon Tiger Lake
    • RAM: 2 x DDR4 SO-DIMM 3200 MHz up to 64GB, support Non-ECC, unbuffered memory
    • Expansion: 1 x PCIE X16 slot, 1 x MiniPCIe socket (supporting mSATA), 1 x M.2 (Key M 2280) and 1 x M.2 (Key E 2230)
    • Other features: 6 x USB3.2 Gen2, 3 x SATAIII, Dual Gigabit Ethernet, 4 x RS232 ports, 2 x RS232/422/485 ports, 2 x USB2.0 ports, Intel High Definition Audio, 1 x SIM slot.
  • CMS101 103 W480F210831 R1 w600
    DFI CMS101/CMS103 10th Gen Intel iCore Wide Temp Mini-ITX
    • Product Name: DFI CMS101/CMS103
    • Motherboard Form Factor: Mini-ITX
    • CPU: 10th Generation Intel Core Processors
    • RAM: 2 DDR4 2933MHz SODIMM up to 64GB
    • Expansion: 1 PCIe x16, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Multiple Displays: 2 x DP++, 1 LVDS/eDP; Supports up to 4K/2K resolution; Rich I/O: 1 Intel 2.5GbE, 2 Intel GbE, 4 COM, 4 USB 3.2 Gen2, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • DT200 CS side w600
    DFI DT200-CS High Performance MXM Embedded System
    • Product Name: DFI DT200-CS
    • System Type: High Performance MXM Embedded System
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: DDR4 2400/2666MHz up to 64GB
    • Expansion: Support M.2 B key 3052 5G cellular module
    • Other features: Multiple displays: 4 DP (from MXM), 1 DP++/HDMI (auto-detection), AI accelerated: up to 110W GPU MXM module supported, Rich I/O connectivity: 4 LAN, 4 USB 3.1, 6 USB 2.0, 2 COM, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • IBDRW100
    Winmate IBDRW100 Intel Celeron N2930 DIN Rail Box PC
    • Product Name: Winmate IBDRW100
    • System Type: Intel Celeron N2930 DIN Rail Box PC
    • CPU: Onboard Intel Celeron Quad-Core N2930 1.83GHz, up to 2.16GHz
    • RAM: 1 x DDR3L SODIMM slot, 4GB
    • Expansion: 1 x RS232 / 422 / 485 communication (switch by jump), 4 x Giga LAN, 1 x USB 3.0, 3 x USB 2.0, 1 x VGA, 1 x Line out, 1 x Power Jack
    • Other features: DIN Rail design for Industrial Automation application, Fanless, High efficiency thermal design, AWS IoT Greengrass Certified
  • IBDRW100 C1D2
    Winmate IBDRW100-EX Intel Celeron DIN Rail Box PC (C1D2 & ATEX Certified)
    • Product Name: Winmate IBDRW100-EX
    • System Type: Intel Celeron DIN Rail Box PC
    • CPU: Intel Celeron N2930 Bay Trail-M Processor
    • RAM: 1 x SO-DIMM, DDR3L 1600 MHz, 4GB 8GB (Optional)
    • Expansion: 1 x RS232 / 422 / 485 communication (switch by jump), 4 x Giga LAN, 1 x USB 3.0, 3 x USB 2.0, 1 x VGA, 1 x Line out, 1 x Power Jack
    • Other features: Class 1, Division 2 & ATEX Zone 2 device certified for hazardous area application, Designed for industrial automation, DIN Rail application, Fanless, streamlined enclosure for highly efficient heat dissipation, Rated for wide temperature use -20˚C to 60˚C, AWS IoT Greengrass Certified
  • ES220 CSSide200612 w600
    DFI ES220-CS High Performance 9th/8th Gen iCore Embedded System
    • Product Name: DFI ES220-CS
    • System Type: High Performance 9th/8th Gen iCore Embedded System
    • CPU: 8th/9th Gen Intel Core Processors with Intel C246/Q370/H310 Chipset
    • RAM: 2 DDR4 SODIMM up to 64GB
    • Expansion: Single/Triple storage: 1 M.2 SSD + 2 2.5″ SSD (option) (with RAID supported)
    • Other features: Rich I/O connectivity: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0, 2 COM, 2 HDMI 2.0 Support resolution 4K@60Hz, Acoustic level support full load 36dB @operating temperature 45° C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • PPC F 1
    IEI PPC-FxxD Series 15″ – 18.5″ 8th Gen Industrial Panel PC Series
    • Product Name: EI PPC-FxxD
    • Screen Size: 15″ – 18.5″ 
    • CPU: 8th Gen Intel Whiskey Lake-U Processors
    • RAM: 2 x 260-pin 2400 MHz dual-channel DDR4 unbuffered SO-DIMM
    • Expansion: Support NVMe SSD
      Other features: Low power consumption and fanless design, IP66-rated front panel for water and dust resistance, Touch screen with anti-UV / anti-glare coating, Support PoE PD power
  • IDS 310AI 1
    IEI IDS-310AI Fanless Ultra Compact AI System
    • Product Name: IEI IDS-310AI
    • System Type: Fanless Ultra Compact Size AI System
    • CPU: Intel Celeron J3455 1.5GHz (up to 2.3GHz, quad-core, TDP 10W)
    • RAM: 1 x 204-pin DDR3L SO-DIMM, 8 GB pre-installed
    • Expansion: M.2 A-key slot for expansion
    • Other features: Two GbE LAN ports, Triple USB 3.2 Gen1, Pre-installed a Mustang-MPCIE-MX2 that has two Intel Myriad X VPUs for AI deep learning workload consolidation
  • CH961 front
    DFI CH961 8th/9th Gen Intel iCore Xeon COM Express Basic
    • Product Name: DFI CH961
    • Module Form Factor: COM Express Basic
    • CPU: 8th/9th Gen Intel iCore Xeon Celeron
    • RAM: Dual channel DDR4 2666MHz SODIMM up to 96GB
    • Expansion: Multiple expansion: 1 PCIe x16, 8 PCIe x1
    • Other features: Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays; DP++ resolution supports up to 4096×2304 @ 60Hz; Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
  • 3I110HW 1
    Lex 3I110HW Embedded 11th Gen Tiger Lake 3.5″ SBC
    • Product Name: Lex 3I110HW
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: 11th Gen Intel Tiger Lake-UP3 – i7 / i5 / i3 / Celeron
    • RAM: 2 x DDR4 SODIMM (Max. 64GB)
    • Expansion: Multiple Independent display: VGA, HDMI, DP, DP (Type C), eDP or LVDS; 3 x Intel GbE LAN, 1 x USB 3.0 (type C), 6 x USB 2.0; 4 x COM, 4DI / 4DO, 1 x Mini PCIe, 1 x SIM; 1 x M.2 B Key, 1 x M.2 M Key
    • Other features: TPM 2.0 (Optional), Battery Charger Function (3I110BW)
  • LV 6712 2D8 NEW 2
    Commell LV-6712 Mini-ITX Celeron Tiger Lake SBC
    • Product Name: Commell LV-6712
    • Motherboard Form Factor: Mini-ITX
    • CPU: Onboard Intel Tiger Lake UP3 Processor
    • RAM: 2 x DDR4 SO-DIMM 3200 MHz up to 64GB
    • Expansion: 2 x MiniPCIe (one supports mSATA), 1 x M.2 2280 KEY M support PCIe Gen4, 1 x PCIe x1 Slot
    • Other features: Integrated DisplayPort, HDMI, LVDS for four display support, 1 x Intel Gigabit PHY LAN, 1 x Intel 2.5 Gigabit LAN, 2 x SATA3, 2 x USB2.0, 4 x USB3.2 Gen2, 6 x COM, 1 x GPIO, 1 x PS/2, Support Watchdog Timer
  • CS181 Front062420 R1 w600
    DFI CS181-H310 8th/9th Gen Intel iCore MXM Mini-ITX Motherboard
    • Product Name: DFI CS181-H310
    • Motherboard Form Factor: Mini-ITX
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: 2 DDR4 2400/2666MHz SODIMM up to 32GB
    • Expansion: Multiple Displays: 1 LVDS/eDP, 1 DP++/HDMI (autodetection), 4 DP; Multiple Expansions: 1 MXM Type-A/B, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Storage: 2 SATA 3.0; Rich I/O: 6 Intel GbE, 2 COM, 4 USB 3.1 Gen1, 6 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
  • CS181 Front062420 R1 w600
    DFI CS181-Q370 8th/9th Gen Intel iCore MXM Mini-ITX Motherboard
    • Product Name: DFI CS181-Q370
    • Motherboard Form Factor: Mini-ITX
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: 2 DDR4 2400/2666MHz SODIMM up to 32GB
    • Expansion: Multiple Displays: 1 LVDS/eDP, 1 DP++/HDMI (autodetection), 4 DP; Multiple Expansions: 1 MXM Type-A/B, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Storage: 2 SATA 3.0; Rich I/O: 6 Intel GbE, 2 COM, 4 USB 3.1 Gen2, 6 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
  • WMP 19K main
    Wincomm WMP-19K GTX 1060 19″ Medical AI Panel PC
    • Product Name: Wincomm WMP-19K GTX 1060
    • Screen Size: 19″
    • CPU: Intel 8th/9th Generation Core i5/i7
    • RAM: Supports Dual Channel DDR4 up to 64GB
    • Expansion: Support PCIe Expansion for Intel Movidius Vision AI Card
    • Other features: Anti-Bacteria (MRSA) Plastic Housing & Touch, 19″ 1280×1024 LCD Diagnostic Panel, EN/UL 60601-1 Safety & EMC Latest Version & MDR Certification Ready, Independent GeForce GTX 1060 Graphic Card with 6GB dedicated video memory