LEX 2I110AW 11th Gen Tiger Lake-UP3 i7/i5/i3 2.5″ Embedded SBC

  • Product Name: Lex 2I110AW
  • Motherboard Form Factor: 2.5″ SBC
  • CPU: 11th Gen Intel Tiger Lake-UP3, i7 / i5 / i3 / Celeron
  • RAM: 1 x DDR4 SODIMM (Max. 32GB)
  • Expansion: 1 x M.2 B Key, 1 x M.2 M Key
  • Other features: Multiple Independent display: 4 x HDMI, 3 x Intel 2.5 GbE LAN, 2 x USB 3.0 (type A), 4 x USB 2.0, 2 x COM, 4DI / 4DO, 1 x Nano SIM, TPM 2.0

Description

The Lex 2I110AW is a compact 2.5″ embedded single board computer designed for high-performance industrial and edge computing applications. Powered by 11th Gen Intel® Tiger Lake-UP3 processors, including Core™ i7, i5, i3, and Celeron options, it delivers strong compute and graphics capability in a space-efficient embedded form factor.

It supports up to 32GB of DDR4 memory via a single SODIMM slot and offers flexible expansion through M.2 B Key and M.2 M Key interfaces, along with a Nano SIM slot for wireless connectivity. The board features extensive I/O including four independent HDMI display outputs, three Intel 2.5GbE LAN ports, USB 3.0 and USB 2.0 connectivity, COM ports, and 4DI/4DO for industrial control integration. With TPM 2.0 security support, the Lex 2I110AW is well suited for demanding applications in industrial automation, intelligent edge systems, and embedded control environments.

Key Features

  • 11th Gen Intel Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU
  • 1 x DDR4 SODIMM (Max. 32GB)
  • Multiple Independent display: 4 x HDMI
  • 3 x Intel 2.5 GbE LAN, 2 x USB 3.0 (type A), 4 x USB 2.0
  • 2 x COM, 4DI / 4DO, 1 x Nano SIM
  • 1 x M.2 B Key, 1 x M.2 M Key
  • TPM 2.0

2I110AW Specification

MODEL 2I110AW
CPU Intel® Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU
MB Chipset Intel® Tiger Lake-UP3 SoC
Graphics Intel® UHD Graphics, Support DirectX 12 & OpenGL 4.5
System Memory 1 x DDR4 3200 MHz SODIMM, Max 32GB
Storage 1 x SATA ports 3.0 Data transfer rates up to 6.0 Gb/s (600 MB/s)
1 x M.2 M key Type 2242 (PCIe x4 ), Support NVMe, -optional to SATA
BIOS AMI UEFI BIOS
Display 4 x HDMI
TPM TPM 2.0 (Firmware)
LAN 3 x Intel 2.5GbE I225IT (external)
Expansion Interface 1 x M.2 B key Type 3042 (PCIe / USB 3.0 / 2.0),
1 x M.2 M key Type 2242 (PCIe x4 ), Support NVMe,
1 x Nano SIM
USB 2 x USB 3.0 (Type A)
4 x USB 2.0 (internal)
Serial IO 2 x RS232 / 422 / 485 (internal) ; eSPI
GPIO Hardware digital Input & Output, 4 x DI / 4 x DO
WDT Hardware Watch Dog Timer, 0~255 sec programmable
Power Input Wide Range DC IN +9~36V
Dimension 2.5″ (108 x 102 mm)
Operation Temperature (100% CPU Usage) -40°C~70°C (Core i GRE series CPU)
-20°C~70°C (Core i G7E / G7 series CPU)
(100% CPU Usage, not-underclocking)
Operation Humidity 5~95%, non-condensing
Chassis (OEM I/O Expansion by request) Box PC: SKY 2, TERA
OS Support Windows® 10 IOT (64bit),
Ubuntu 18.04.2 above, Fedora 29 above

Lex 11th Gen Tiger Lake SBC’s

Model Form Factor CPU RAM LAN Display Key Features
3I110HW 3.5″ Tiger Lake-UP3 Up to 64GB 3× GbE VGA / HDMI / DP / Type-C DP / eDP-LVDS TPM 2.0 (opt), rich multi-display, Mini PCIe, M.2, SIM
3I110BW 3.5″ Tiger Lake-UP3 Up to 64GB 3× GbE VGA / HDMI / DP / Type-C DP / eDP-LVDS Battery charger function, TPM 2.0 (opt), expansion heavy
2I110D 2.5″ Tiger Lake-UP3 Up to 32GB 4× GbE HDMI / eDP Compact design, TPM 2.0, rich I/O
2I110AW 2.5″ Tiger Lake-UP3 Up to 32GB 3× 2.5GbE 4× HDMI High multi-display output, TPM 2.0

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs, Panel PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

  • Windows image capture from customers HDD
  • Linux image capture from customers HDD
  • Android image capture from customers HDD
  • Windows / Linux Deployment from customers image
  • Custom Windows images, create and deploy
  • Update management
  • Custom Linux and Android images
  • Custom BIOS

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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