DFI ECX700-ADP 12th Gen Outdoor Ruggedized IPC67 Mini PC

  • Product Name: DFI ECX700-ADP
  • System Type: Outdoor Ruggedized IPC67 Box PC
  • CPU: Intel Alder Lake-P Processor i5-1245UE / i7-1265UE
  • RAM: Supports DDR4 memory
  • Expansion: Multiple I/O interfaces for versatile connectivity
  • Other Features: IP67-rated waterproof and dustproof design, extreme ruggedization to IEC 60068-2-64, wide operating temperature range (-20 to 70°C)

Description

The DFI ECX700-ADP is a ruggedized IPC67 box PC designed for extreme environments. Powered by Intel Alder Lake-P processors (i5-1245UE / i7-1265UE) with Intel Iris Xe graphics, it delivers high performance for industrial and outdoor applications. Its IP67-rated waterproof and dustproof design, combined with compliance to IEC 60068-2-64 standards and a wide operating temperature range (-20 to 70°C), ensures durability in harsh conditions. With rich I/O options, the ECX700-ADP is ideal for industrial automation and outdoor deployments.

Key Features

  • Intel Alder Lake-P Processor i5-1245UE/ i7-1265UE
  • Intel Iris Xe Graphic Performance
  • Extreme Ruggedized design to IEC 60068-2-64 & -20 ~ 70°C wide temperature
  • Rich I/O help integrators meet the demand for various applications
  • Various applications: Industrial automation, Outdoor application
  • Waterproof & Dustproof design conforming to IP6

Specification

 
Category Details
Processor 12th Gen Intel® Core™ Processors, BGA 1744 (Alder Lake-P, 15W)
Intel® Core™ i7-1265UE Processor, 10C12T, 12M Cache, 1.7GHz (4.7GHz)
Intel® Core™ i5-1245UE Processor, 10C12T, 12M Cache, 1.5GHz (4.4GHz)
Memory On board memory supports 8GB (default)
BIOS AMI SPI 256Mbit
Graphics Controller: Intel® Iris® Xe Graphics eligible
Feature: OpenGL 4.2, Direct X 11.1, OpenCL 1.2, OGL ES 3.0
HW Decode: H.264, MPEG2, VC1, VP8, H.265, MPEG4, MVC, VP9, WMV9, JPEG/MJPEG
HW Encode: H.264, MPEG4, VP8, H.265, MVC
Display 1 x HDMI (resolution up to 3840×2160@30Hz)
Storage M.2 SSD (M Key)
256GB Available (128GB/512GB by project support)
Expansion 1 x M.2 3042/3052 B key (PCIe x1 & USB3.0/2.0 for LTE or 5G module)
1 x M.2 2230 E Key (PCIe x1 & USB2.0 for Wi-Fi module)
Ethernet 2 x Intel® i225IT (10/100/1000Mbps)
LED Indicators 1 x Power Status LED
Flank I/O 1 x HDMI
1 x SIM card slot
2 x USB 3.2
6 x Antenna (2 x WiFi, 4 x LTE) (Top I/O)
Bottom I/O 2 x GbE
2 x USB 3.2
2 x RS232 and 2 x Can bus protocol
Power 1 x 9~36V DC-IN
M12 D-code Connector
Vent 1 x Vent
Watchdog Timer Output & Interval: System Reset, Programmable via Software from 1 to 255 Seconds
OS Support Microsoft: Windows 10 IoT Enterprise 64-bit, Windows 11 IoT Enterprise LTSC 2024
Linux: Linux
Operating Temperature -20 to 70°C
Storage Temperature -40 to 85°C
Relative Humidity 5 to 95% RH (non-condensing)
Mounting Wall mount
Dimensions (W x H x D) 239.24 x 194 x 101 mm
Weight TBD
Standards and Certifications Shock: Operation shock test: Half Sine Wave 15G, 11ms, 3 Shock Per Axis
Vibration: Operation Vibration test: MIL-STD-810G 514.6C-2, Figure 514.6C-2
Certifications: CE, FCC Class A, ROHS
Construction IP67/IP69K enclosure
Packing List 1 ECX700-ADP system unit
1 COMBO cable (for COM & CANBUS)
2 LAN cable
2 Wi-Fi antenna
2 LTE antenna
6 Dust covers (for antenna connector)
1 DC input cable
Country of Origin Taiwan

Ordering Information

Model Name Part Number Description
ECX700-ADP2040A-i5 750-ECX7001-000G i5-1245UE, 8GB Memory down, 256GB SSD, 4 USB 3.2, 2 LAN, 1 HDMI, 2 COM + 2 CAN bus, WIFI+BT, LTE, 1 IP67 M12 4pin DC cable, IP67 M12 4pin DC cable L=100mm, IP67 COM+ CAN cable L=300mm, M12 Lan cable L=300mm
ECX700-ADP2040A-i7 750-ECX7001-100G i7-1265UE, 8GB Memory down, 256GB SSD, 4 USB 3.2, 2 LAN, 1 HDMI, 2 COM + 2 CAN bus, WIFI+BT, LTE, 1 IP67 M12 4pin DC cable, IP67 M12 4pin DC cable L=100mm, IP67 COM+ CAN cable L=300mm, M12 Lan cable L=300mm

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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