AAEON BOXER-6646-ADP 12/13th Gen Fanless Computer

AAEON BOXER-6646-ADP 12/13th Gen Fanless Computer

Product Name: AAEON BOXER-6646-ADP
System Type: Fanless Industrial Computer
CPU: 12th/13th Gen Intel Core i7/i5/i3 Processor SoC
RAM: Dual-Channel DDR5 SODIMM slot
Expansion: M.2 2280 M-Key for high-speed NVMe SSD, Multi-LAN including 2.5GbE Ethernet
Other Features: USB 3.2 Gen 2, wide 10-35V DC input, -20°C ~ 60°C operating temperature, onboard TPM 2.0, optional Hailo-8 AI Accelerator support

CPU Model

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SKU: BOXER-6646-ADP Categories: AIoT | Edge AI Computers, ALL INDUSTRIAL AND EMBEDDED COMPUTERS, Fanless Industrial Mini PCs, Rugged Industrial Mini PCs, Rugged PCs Tags: 2.5GbE, Artificial Intelligence, DDR5, Fanless, Intel Alder Lake, Intel Raptor Lake, IoT, Multi Display - Quad, NVMe, OS: Windows, OS: Windows 11, Powered by Intel, Rugged, TPM 2.0, Wide Temp Brand: AAEON Technology Inc

Description

The AAEON BOXER-6646-ADP is a fanless industrial computer powered by 12th/13th Gen Intel® Core™ processors. It features dual-channel DDR5 RAM, 2.5GbE Ethernet, high-speed M.2 NVMe SSD support, and USB 3.2 Gen 2. With a wide operating temperature range (-20°C ~ 60°C) and 10-35V DC input, it’s designed for demanding environments. Additional support for the Hailo-8™ AI Accelerator module makes it ideal for edge AI applications.

Key Features

12th/13th Gen Intel Core i7/i5/i3 Processor SoC
Dual-Channel DDR5 SODIMM slot
Support Multi-LAN including 2.5GbE Ethernet
Support M.2 2280 M Key High speed NVMe SSD
SuperSpeed+ USB 3.2 Gen2
Wide Range 10~35V DC input
Wide Operating Temperature -20~60^°C
Compact Size
Onboard TPM 2.0
Hailo-8^™ M.2 2280 AI Accelerator Module Support (Optional)

Specification

Category	Details
CPU	13th Gen Intel® Core™ i7-1370PE, i5-1350PE, i3-1320PE; 12th Gen Intel® Core™ i7-1270PE, i5-1250PE, i3-1220PE
Chipset	Intel® System on Chip
System Memory	DDR5 SODIMM slot x 2, max. 64GB
Display Interface	HDMI x 2, Display Port x 2
Storage Device	Removable 2.5″ SATA Drive Bay x 1, M.2 2280 M Key NVMe Slot x 1
Ethernet	RJ-45 x 2 for 2.5GbE LAN i225-LM x 2, RJ-45 x 1 for GbE LAN i219-LM x 1
I/O	USB Type-A x 3 for USB3.2 Gen2, USB Type-A x 3 for USB 2.0, DB-9 x 4 for RS-232/422/485, Line out
Expansion	M.2 E key 2230 x 1, M.2 B Key 3052 x 1 (for 5G/LTE module)
Power Supply	DC-in 10~35V in 3pin Terminal block connector
Operating Temperature	-4°F ~140°F (-20°C ~ 60°C), IEC68-2 with 0.5 m/s AirFlow (w/ Industrial wide Temp. SSD/RAM)
Storage Temperature	-40˚F ~ 176˚F (-40˚C ~ 80˚C)
Storage Humidity	5 ~ 95% @ 40˚C, non-condensing
Mounting	Wallmount
Dimensions	8.66”x 6.06” x 2.42” (220 mm x 154 mm x 61.6 mm)
Gross Weight	6.6 lbs. (3.0 kg)
Net Weight	4.9 lbs. (2.2 kg)
Anti-Vibration	SSD: Random, 3Grms, 5~500Hz
Anti-Shock	SSD: 50G @ wallmount, Half-sine, 11ms
Certification	CE/FCC class A

AAEON Boxer Fanless Computers

Datasheet

Download(1 MB)

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

Here’s a selection of our design, manufacturing & associated services: –

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

FREE Pre-design / Pre-sales advise
Prototyping
- Custom PC Design
- Custom Panel PC
- Custom Racks and Towers
- Custom Peli Case PCs
Prototyping pre checks (chargeable one-time fee for existing prototype)
- Hardware compatibility
- Thermal testing
- Software compatibility
Custom PCB / Board Design
- COM Express, Qseven, SMARC
  Jetson, Raspberry Pi
Custom Chassis Design
- Metal
- Plastic
Custom Cables
Custom Back Panels and Faceplates
Custom Cooling
Custom Metal Work (internal brackets, mounting brackets)
Touchscreen Integration and Display Enhancements
- Custom LCD Displays
- Integration of touch technologies
- Optical Bonding
- Anti-reflective and anti-glare coatings
All products are Designed for Manufacture
Software – Custom OS Image

Build to Order: Computer Design and Customisation Services

Take an existing system and we can:

Custom specification (CPU, RAM, I/O, Industrial Storage, RAID)
Chassis customisation and branding
Custom BIOS
Long Term Availability
Software – Custom OS Image
Custom Packaging and branding
Integrating newly designed or existing hardware into a larger system

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

Windows image capture from customers HDD
Linux image capture from customers HDD
Android image capture from customers HDD
Windows / Linux Deployment from customers image
Custom Windows images, create and deploy
Update management
Custom Linux and Android images
Custom BIOS

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing	Materials Management	Logistics and Tracking	External Manufacturing
• Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test	• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System	• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels	• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test