ASRock Industrial iEP-5002G Elkhart Lake Rugged IoT Controller
- Product Name: Asrock iEP-5002G
- System Type: Rugged Industrial IoT Controller
- CPU: Latest and Powerful Intel Atom x6000E Processor
- RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
- Expansion: Most Flexible IOs and Expansion for Industrial Applications
- Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40 °C to 70 °C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options
Description
Features
- Latest and Powerful Intel Atom x6000E Processor
- Fan-less and Rugged Design, Wide Temperature Operation (-40 °C to 70 °C)
- 6-36VDC Wide Range Power Inputs
- Most Flexible IOs and Expansion for Industrial Applications
- Intel TCC and TSN Support for Real-Time Computing
- DIN Rail or Wall Mount Options
Specification
| Processor System | |
| CPU | Intel® Elkhart Lake SoC Processors |
| x6212RE, DC,1.2GHz, 6W | |
| Video | 1 x HDMI 2.0b, 1 x VGA |
| Memory | 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC) |
| Expansion Slot | |
| SIM Socket | 1 x External SIM card socket for 4G LTE or 5G module |
| RF& Antenna (Option) | M.2 Wi-Fi 5 module supports IEEE 802.11 a/b/g/n/ac + BT 5.1 (Option) |
| M.2 Wi-Fi 6E module supports IEEE 802.11 a/b/g/n/ac/ax + BT 5.2 (Option) | |
| 2 x 4G LTE antenna + 2 x Wi-Fi antenna (Option) | |
| 4 x 5G antenna + 2 x Wi-Fi antenna (Option) | |
| M.2 | 1 x M.2 Key E Socket (2230) for Wi-Fi module |
| 1 x M.2 Key B Socket (3042/3052) for 4G LTE module / 5G module | |
| I/O | |
| Ethernet | 3 x 1GbE (Current FW and driver may change in the future) |
| PoE (Option) | 2 x PoE (Intel I210AT, Option) |
| The operating temp. and power delivery spec of PoE sku TBD | |
| Serial Port | 3 x COM (RS-232/422/485 BIOS select) |
| USB | 2 x USB 3.2 Gen1 |
| 2 x USB 2.0 | |
| Digital I/O | 4DIs/4DOs |
| Audio | 1 x Mic in |
| 1 x Line out | |
| CANBus (Option) | 1 x CANBus connector supports up to 2 CANBus devices via additional cable |
| Storage | |
| SD Slot | 1x Micro SD card slot, supports SDXC V3.01 |
| SATA | 1 x 2.5″ 9.5mm SATA3 HDD or SSD |
| M.2 | 1 x M.2 Key M Socket (2280) with PCIe x2/SATA3 for Storage |
| Power Requirements | |
| DC Input | 6-36 VDC, 80V Surge Protection |
| Supports Latch Adaptor | |
| AC to DC Adaptor (Option) | AC input 100-240Vac, 1.5A 50-60Hz, DC output 19V, 3.42A, |
| 65W Adaptor (Latch type) | |
| Environment | |
| Operating Temp | -40°C ~ 70°C (-40°F~158°F) |
| Storage Temp | -40°C ~ 85°C (-40°F~185°F) |
| Humidity | ~95% @ 40°C (non-condensing) |
| Vibration | Operating: 5 Grms, 5-500 Hz, 3 axes with SSD |
| ESD | Contact +/-8 KV, Air +/-15 KV |
| Shock | Operating 50 Grms, half sine 11 ms duration with SSD |
| EMC | CE and FCC Class A (EN61000-6-4/-2) |
| Safety | UL, CB |
| Mechanical | |
| Dimensions (W x H x D) | 58mm (W) x 125mm (D) x 157mm (H) |
| Indicator | 1 x SATA / NVMe Storage LED, 1 x Wi-Fi / BT LED |
| Function | 1 x Power Button, 1 x Clear CMOS Button |
| Weight | Net Weight : 1.3kg |
| Mounting | DIN-Rail or Wall mounting |
| Manageability / Security | |
| Manageability | WDT,, Intel® In-Band Manageability |
| Security | TPM2.0 |
| Add-on Feature / OS Support | |
| Real-Time Enablement | TSN, TCC support under YOCTO |
| OS Support | Windows 10, Linux |
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.
BVM Customisation Service
Design | Develop | Test | Manufacture
Here’s a selection of our design, manufacturing & associated services: –
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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
 Testing |
 Materials Management |
 Logistics and Tracking |
 External Manufacturing |
| • Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |
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