DFI CS551 Intel 8th/9th Gen Coffee Lake iCore 3.5″ SBC
- Product Name: DFI CS551 3.5″ SBC
- Motherboard Form Factor: 3.5″
- CPU: 9th/8th Gen Intel Core with Intel C246
- RAM: 1 DDR4 SODIMM up to 32GB
- Expansion: Three independent displays: LVDS + DP++ + DP++; Multiple expansion: 1 M.2 M Key, 1 Mini PCIe
- Other features: DP++ resolution up to 4096×2304 @ 60Hz; Rich I/O: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
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Description
The World’s First! 3.5” SBC Desktop Platform with Auto Warm-up
The CS551 is the world’s first compact-sized AI motherboard with auto warm-up function for the processor to withstand the extreme cold weather at -30°C. The 3.5″ SBC is powered by robust 8th Gen Intel Core i processors that support dynamic performance adjustment of CPU and GPU, high-speed image analysis and transmission, while obtaining all the expansion interfaces required for edge AI computing. The CS551 will bring a brand-new experience with smart edge computing and make your solution a pioneer as well!
Features
- 9th/8th Gen Intel® Core™ with Intel® C246
- 1 DDR4 SODIMM up to 32GB
- Three independent displays: LVDS + DP++ + DP++
- DP++ resolution up to 4096×2304 @ 60Hz
- Multiple expansion: 1 M.2 M Key, 1 Mini PCIe
- Rich I/O: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0
- 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
Specification
Intel® Core™ i7-8700T Processor (6C/12T; Max speed 4.0 GHz; TDP 35W)
Intel® Core™ i5-8500T Processor (6C/6T; Max speed 3.5GHz; TDP 35W)
Intel® Core™ i3-8100T Processor (4C/4T; Max speed 3.1GHz; TDP 35W)
Intel® Pentium® G5400T Processor (2C/4T; Max speed 3.1GHz; TDP 35W)
Intel® Celeron® G4900T Processor (2C/2T; Max speed 2.9GHz; TDP 35W)
9th Gen Intel® Core™ Processors, LGA 1151 Socket
Intel® Core™ i7-9700TE Processor (8C/8T; Max speed 3.6GHz; TDP 35W)
Intel® Core™ i5-9500TE Processor (6C/6T; Max speed 3.6GHz; TDP 35W)
Intel® Core™ i3-9100TE Processor (4C/4T; Max speed 3.2GHz; TDP 35W)
Single Channel DDR4 2666MHz
C246 with ECC Support: Intel® Core i3-8100T/9100TE/Pentium G5400T/Pentium G4900T
HW Decode: AVC/H.264, MPEG2 (H.262), VC1, JPEG/MJPEG, HEVC/H.265, VP8, VP9, VP10
HW Encode: AVC/H.264, MPEG2 (H.262), JPEG/MJPEG, HEVC/H.265, VP8, VP9
2 x DP++
LVDS: dual channel 48-bit, resolution up to 1920×1200 @ 60Hz
DP++: resolution up to 4096×2304
1 x M.2 2280 M key (C246/Q370: NVMe PCIe x4/SATA 3.0 or H310: NVMe PCIe x1, SATA 3.0)
1 x SIM slot (optional for 3G/4G module)
1 x LVDS Backlight
1 x SATA Power
DC Jack (available upon request)
-5 to 65°C for 35W/100C CPU (fanless); 35W 100C, 82C CPU (fan)
-30 to 80°C for 15W TDP down/100C CPU (fanless); 35W/100C CPU (fan)
Note: -30°C can add heater/polyfilm for mother board warm up.
Storage: -40 to 85°C
Storage: 5 to 90% RH
146mm (5.75″) x 102mm (4.02″)
Top Side: 16.3mm, Bottom Side: 4.0 mm
1 COM port cable (Length: 250mm, 1 x COM port) 332-753040-000G
1 Serial ATA data cable (Length: 500mm) 332-553001-005G
1 Serial ATA power cable (Length: 250mm) A81-004041-016G
1 Heat sink (Height: 43mm) A71-001302-010G
Ordering Information
| Model Name | Part Number | Description |
| CS551-C246-BCA | 770-CS5511-000G | 1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0, 12V, -5 to 65°C |
| CS551-H310-BCA | 770-CS5511-100G | 1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen1, 2 USB 2.0, 12V, -5 to 65°C |
| CS551-Q370-BCA | 770-CS5511-200G | 1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0, 12V, -5 to 65°C |
| CS551-C246-ECA | 770-CS5511-300G | 1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0, 12V, -30 to 80°C |
| CS551-H310-ECA | 770-CS5511-400G | 1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen1, 2 USB 2.0, 12V, -30 to 80°C |
| CS551-Q370-ECA | 770-CS5511-500G | 1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0, 12V, -30 to 80°C |
DFI 8th/9th Gen Coffee Lake
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- DFI EC543-CS 8th/9th Gen 5G Fanless Embedded System
BVM Customisation Service
Design | Develop | Test | Manufacture
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.
Here’s a selection of our design, manufacturing & associated services: –
Design to Order: OEM/ODM Embedded Product Design ServicesFor customers designing a new product or working with an existing prototype.
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Build to Order: Computer Design and Customisation ServicesTake an existing system and we can:
Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs Embedded Software: Configuration, Integration and DeploymentPorting, Integration & Deployment
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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
![]() Testing |
![]() Materials Management |
![]() Logistics and Tracking |
![]() External Manufacturing |
| • Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |
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