DFI VCX700-MTH Intel Core Ultra Rugged IP67 Vehicle PC

  • Product Name: DFI VCX700-MTH
  • System Type: Rugged in-vehicle embedded PC (IP67-rated, fanless design)
  • CPU: Intel Core Ultra processor platform
  • RAM: LPDDR5-6400 onboard soldered memory
  • Expansion: Vehicle I/O expansion via PoE (2 × GbE or 1 × GbE + 1 × 2.5GbE)
  • Other Features: 2 × CAN FD, 2 × RS232 via IP67-rated connector, built-in 9-axis sensor for driver monitoring, wide 9–36V DC vehicle power input with ACC/IGN support, and extended operating temperature range from -40°C to 70°C for harsh automotive environments

Description

The DFI VCX700-MTH is a rugged, fanless in-vehicle computing system designed for reliable performance in extreme automotive and fleet environments. Built on the Intel® Core™ Ultra platform, it delivers efficient processing power combined with low-latency responsiveness for edge AI and vehicle applications. Engineered for harsh conditions, the system features an IP67-rated enclosure, wide 9–36V DC vehicle power input with ACC/IGN support, and an extended operating temperature range from -40°C to 70°C. With integrated LPDDR5 memory, flexible Ethernet and PoE options, and rich industrial I/O including CAN FD and RS232, it is ideal for advanced fleet management, driver monitoring, and in-vehicle edge computing deployments.

Key Features

  • A ruggedized, IP67-rated, fanless in-vehicle system built for harsh environments.
  • Intel Core Ultra processor with LPDDR5-6400 soldered memory
  • 1x 2.5GbE &1x GbE Ethernet ports or 2 x 802.11af GbE PoE (By different sku)
  • 2 x CAN FD, 2x RS232 via IP67-rated combo connector
  • Build-in 9 axis sensor for driver detection within fleet management
  • Wide voltage: 9~36V vehicle power input with ACC/IGN function
  • Wide temperature up to -40°C ~ 70°C

Specification

Category Specification
System  
Processor Intel® Core™ Ultra 7/5 Series, 15W TDP
  Core™ Ultra 7 155U (12C/12T, up to 4.8GHz)
  Core™ Ultra 5 125U (12C/12T, up to 4.3GHz)
Memory Dual-channel LPDDR5/x 6400MHz onboard, up to 32GB (64GB optional)
BIOS AMI SPI 256 Mbit
Graphics  
Controller Intel® Arc™ Graphics
Features DirectX 12.2, OpenGL 4.6, OpenCL 3.0
Decode HEVC, VP9, AV1, AVC
Encode HEVC, VP9, AV1, AVC
Display  
Output 1 × HDMI 1.4b
Resolution Up to 4096 × 2160 @ 24Hz
Storage  
Interface M.2 M-Key SSD
Capacity 256GB standard (128GB / 512GB optional by project)
Expansion  
Slots 1 × M.2 3052 B-Key (PCIe x1 / USB 3.0/2.0 for 5G/LTE)
  1 × M.2 2230 E-Key (PCIe x1 / USB2.0 for Wi-Fi)
Ethernet  
Controller 2 × Intel i226IT (2.5GbE)
PoE (optional) 2 × 802.11af GbE PoE via M12 X-coded
I/O  
USB 4 × USB 3.2
Serial/CAN 2 × RS232 + 2 × CAN FD
SIM 1 × SIM slot
Antenna 6 × external antenna connectors
Display 1 × HDMI
Power  
Input 9–36V DC-in with ignition control
Connector M12 D-coded
Watchdog Timer  
Function Programmable system reset (1–255 sec)
OS Support  
Windows Windows 10 IoT Enterprise, Windows 11 IoT Enterprise LTSC 2024
Linux Linux
Environment  
Operating Temp -20°C to 70°C (up to -40°C to 70°C optional)
Storage Temp -40°C to 85°C
Humidity 5–95% RH non-condensing
Mechanical  
Mounting Wall mount
Dimensions 239.24 × 194 × 101 mm
Weight 3.62 kg
Enclosure IP67-rated
Standards  
Shock 15G half-sine, 11ms
Vibration MIL-STD-810G compliant
Certifications CE, FCC Class A, RoHS
Origin  
Country Taiwan

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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