IEI DRPC-W-TGL Fanless Tiger Lake iCore DIN-Rail Embedded System

  • Product Name: IEI DRPC-W-TGL
  • System Type: Fanless Tiger Lake iCore DIN-Rail Embedded System
  • CPU: Intel Core i7-1185G7E (up to 4.4 GHz, quad-core), Intel Core i5-1145G7E (up to 4.1 GHz, quad-core) or Intel Core i3-1115G4E (up to 3.9 GHz, dual-core, TDP 15W)
  • RAM: 1 x DDR4 3200MHz SO-DIMM (pre-installed 8GB) (up to 32GB)
  • Expansion: 1 x M.2 A Key and 1 x M.2 B Key (with SIM card slot)
  • Other features: Support three independent displays, 3 x 2.5GbE ports, CE/FCC compliant

Description

The IEI DRPC-W series represents a range of compact embedded systems that are specifically designed for IEI 3.5″ single board computers. These systems are strategically built to be mounted on DIN-rails and cater to applications where space is limited, yet demand extensive I/O connectivity and improved performance. With their compact dimensions, the IEI DRPC-W series is well-suited for installations that require efficient communication capabilities on the factory floor, making them ideal for IoT gateway, motion, and vision applications.

DRPC W EHL 1 DRPC W JL 1 DRPC W TGL 1

DRPC-W-EHL

  • Intel Celeron J6412 processor
  • DIN-rail palm-size for limited space
  • Fanless -20°C ~ 60°C operating temp
  • 2 x 2.5 GbE, 2 x USB 3.2
  • Dual display via HDMI & DP
  • 1 x M.2 A key 2230 for Wi-Fi & BT
  • 1 x M.2 B key for 5G

DRPC-W-JL

  • Intel Celeron N5105 processor
  • DIN-rail palm-size for limited space
  • Fanless -20°C ~ 60°C operating temp
  • 3 x 2.5 GbE, 2 x USB 3.2
  • Dual display via HDMI & DP
  • 1 x M.2 A key for Wi-Fi & BT
  • 1 x M.2 B key for 5G/NVMe/AI accelerator

DRPC-W-TGL

  • Intel Core i7-1185G7E, i5-1145G7E, i3-1115G4E, Intel Celeron 6305
  • DIN-rail palm-size for limited space
  • Fanless -20°C ~ 60°C operating temp
  • 3 x 2.5 GbE, 4 x USB 3.2
  • Triple display via 2 HDMI & DP
  • 1 x M.2 A key 2230 for Wi-Fi & BT
  • 1 x M.2 B key for 5G

The DRPC-W-TGL fanless embedded system leverages the power of Intel’s 11th Generation Core/Celeron processor and Intel UHD graphics. Featuring up to 4 cores and a maximum turbo frequency of 4.40 GHz, the processor provides the core abilities of the DRPC-W-TGL fanless embedded system, delivering exceptional performance with a notable 2x performance improvement over its processor predecessor, Whiskey Lake, providing for a significant upgrade in the meeting of demanding computing tasks.

Key Features

  • Supported CPU:
    • Intel Core i7-1185G7E 1.8 GHz (up to 4.4 GHz, quad-core, TDP 15W)
    • Intel Core i5-1145G7E 1.5 GHz (up to 4.1 GHz, quad-core, TDP 15W)
    • Intel Core i3-1115G4E 2.2 GHz (up to 3.9 GHz, dual-core, TDP 15W)
    • Intel Celeron 6305 1.8 GHz (dual-core, TDP 15W)
  • Support three independent display
  • 3 x 2.5GbE ports
  • 1 x M.2 A Key
  • 1 x M.2 B Key (with SIM card slot)
  • CE/FCC compliant

Specification

Form factor
SBC Form Factor
  •  Supported CPU:
    • Intel Core i7-1185G7E 1.8 GHz (up to 4.4 GHz, quad-core, TDP 15W)
    • Intel Core i5-1145G7E 1.5 GHz (up to 4.1 GHz, quad-core, TDP 15W)
    • Intel Core i3-1115G4E 2.2 GHz (up to 3.9 GHz, dual-core, TDP 15W)
    • Intel Celeron 6305 1.8 GHz (dual-core, TDP 15W)
  •  Chipset: SoC
  •  System Memory: 1 x DDR4 3200MHz SO-DIMM (pre-installed 8GB) (up to 32GB)
  •  Power: DC Jack: 12 V DC
  •  Consumption: 12V@4.1A (Intel i5-1145G7E With 8GB DDR4 Memory)
I/O Interface
I/O Ports
  •  USB: 4 x USB 3.2 Gen 2
  •  Ethernet: 3 x 2.5 GbE by Intel® I225V (colay I225LM)
  •  Display: 2 x HDMI, 1 x DP
  •  TPM: Support Intel PTT
  •  Watchdog Timer: Programmable 1 ~ 255 sec/min
Expansion Slots
Expansion Slots
  •  M.2: 1 x M.2 A Key 2230 for WIFI & BT (optional), 1 x M.2 B Key (PCIe x2) 3042/3052 w/SIM slot for 5G (optional)
System
Cooling method / System Fan Fanless
4-pin external system fan connector
Drive Bays 1 x 2.5” SATA 6Gb/s HDD/SSD bay
Indicator & Buttons
Buttons 1 x Power button
1 x Reset button
Indicators 1 x Power LED
1 x HDD LED
Physical Characteristics
Construction Extruded aluminium alloy
Color
Color Black
Dimensions
Dimensions 176 x 116 x 67.8 (mm)
Weight
Weight 0.98/1.2 Kg
Environment
Operating Temperature -20°C ~ 60°C with air flow
Humidity 10% ~ 95% non-condensing
Operating Vibration 10-500 Hz,1.04 Grms, random, 1 hr/axis
Operating Shock Half-sine wave shock 5G, 11ms, 100 shocks per axis
Safety & EMC CE/FCC compliant
OS Support
OS Support Microsoft Windows 10 / Windows 11, Linux

DRPC-W-TGL Ordering Information

DRPC-W-TGL-U-i7C-R10 Fanless System with Intel Tiger Lake-U Core i7-1185G7E 1.8GHz (quad core, TDP 15W), 3 x 2.5GbE Lan, 1 x HDMI,1 x DP,8GB memory pre-installed, 12V DC, RoHS
DRPC-W-TGL-U-i5C-R10 Fanless System with Intel Tiger Lake-U Core i5-1145G7E up to 4.1GHz TDP 28/15/12W, 3 x 2.5GbE Lan, 1 x HDMI,1 x DP,8GB memory pre-installed, 12V DC, RoHS
DRPC-W-TGL-U-i3C-R10 Fanless System with Intel Tiger Lake-UCore Tiger Lake-U i3-1115G4E 2.2GHz(quad core, TDP 15W), 3 x 2.5GbE Lan, 1 x HDMI,1 x DP,8GB memory pre-installed, 12V DC, RoHS
DRPC-W-TGL-U-CC-R10 Fanless System with Intel Tiger Lake-U Celeron6305 1.8GHz (dual core, TDP 15W), 3 x 2.5GbE Lan, 1 x HDMI,1 x DP,8GB memory pre-installed, 12V DC, RoHS

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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