Description
The IEI TANK-8700-MPHX is a powerful fanless industrial computer designed to deliver advanced edge computing performance with enterprise-grade reliability. Built to support AMD Ryzen™ 7000 and 8000 Series mobile processors, including the Ryzen™ 5 8645HS, Ryzen™ 7 8845HS, and Ryzen™ 9 8945HS, this system provides exceptional multi-core processing power within a 45W TDP envelope—ideal for AI workloads, industrial automation, machine vision, and high-performance data processing. Equipped with dual DDR5 5600 SO-DIMM slots, the TANK-8700-MPHX offers high-speed memory performance to handle demanding applications. Dual 2.5GbE LAN ports ensure fast and stable network connectivity, while multiple USB and serial ports enable seamless integration with industrial devices and legacy systems.
The system features extensive expansion capabilities, including multiple M.2 and PCIe slots, allowing flexible configuration for storage, accelerators, communication modules, and additional I/O. Support for three independent displays makes it well-suited for control rooms, digital signage, and monitoring applications. With IPMI remote management support, administrators can monitor and manage systems remotely, reducing maintenance costs and downtime. The robust fanless design enhances reliability in harsh environments, while CE and FCC compliance ensures suitability for deployment in regulated industrial settings.
The IEI TANK-8700-MPHX is a versatile, high-performance solution for demanding edge and industrial computing applications.
Key Features
-
Supported CPUs:
-
AMD Ryzen™ 7000/8000 Series Mobile Processor
-
AMD Ryzen™ 5 8645HS 4.3 GHz, (up to 5.0 GHz, 6 Core, TDP 45W)
-
AMD Ryzen™ 7 8845HS 3.8 GHz, (up to 5.1 GHz, 8 Core, TDP 45W)
-
AMD Ryzen™ 9 8945HS 4.0 GHz, (up to 5.2 GHz, 8 Core, TDP 45W)
-
-
2 x 2.5GbE ports
-
Multiple USB ports and serial ports
-
Multiple M.2 expansions and PCIe expansions
-
Three independent display
-
Support IPMI remote management
-
CE/FCC compliant
Specification
| Specification | Details |
| Form Factor | SBC Form Factor |
| CPU | AMD Ryzen™ 7000/8000 Series Mobile Processor |
| Ryzen™ 5 8645HS 4.3 GHz (up to 5.0 GHz, 6 Core, 45W) | |
| Ryzen™ 7 8845HS 3.8 GHz (up to 5.1 GHz, 8 Core, 45W) | |
| Ryzen™ 9 8945HS 4.0 GHz (up to 5.2 GHz, 8 Core, 45W) | |
| Chipset | SoC |
| System Memory | 2 x SO-DIMM DDR5 5600 (16GB pre-installed), up to 96GB |
| Power Input | DC Jack: 12 ~ 28V DC |
| Terminal Block: 12 ~ 28V DC (with ACC Mode) | |
| Power Consumption | 19V @ 3.79A (Ryzen™ 9 7940HS with 8GB memory) |
| USB | 3 x USB 3.2 Gen2 |
| 3 x USB 2.0 | |
| Ethernet | 2 x 2.5 GbE (Realtek 8125B) |
| 1 x RJ45 via M.2 IRIS2 Module | |
| COM Ports | 2 x RS-422/485 (2K isolation, DB9) |
| 3 x RS-232 (DB9) | |
| Digital I/O | 8-bit (4-in / 4-out, DB9 Female) |
| Display | 1 x HDMI |
| 1 x DP++ | |
| 1 x USB4 (Display + USB 3.2 Gen2) | |
| Audio | 1 x Mic-in |
| 1 x Line-out | |
| TPM | 1 x 20-pin TPM connector (Optional TPM-IN03 module) |
| Watchdog Timer | Programmable 1 ~ 255 sec/min |
| M.2 Expansion | 1 x M.2 M key (2280, PCIe Gen4 x2) |
| 1 x M.2 A key (2230, PCIe Gen3 x1 & USB 2.0) | |
| 1 x M.2 B key (3042/52/80, PCIe Gen3 x1 or supports IRIS2 module) | |
| Backplane Expansion | 1 x PCIe Gen4 x8 |
| 1 x PCIe Gen3 x4 | |
| 1 x PCIe Gen3 x1 (3A SKU only) | |
| 1 x PCI (3B SKU only) | |
| Cooling | Fanless |
| 4-pin external system fan connector | |
| Drive Bays | 2 x 2.5” SATA 6Gb/s HDD/SSD |
| Buttons | Power, Reset, AT/ATX switch |
| LED Indicators | Power LED (green), HDD LED (yellow) |
| Construction | Extruded aluminum alloy |
| Color | Black C + Iron Gray |
| Dimensions (W x D x H) | 254.4 x 205 x 127.2 mm |
| Weight | 3.96 kg / 5.5 kg |
| Operating Temperature | -20°C ~ 60°C |
| Humidity | 10% ~ 95% non-condensing |
| Operating Vibration | Half-sine wave shock 5G, 11ms, 100 shocks per axis (with SSD) |
| Operating Shock | MIL-STD-810G 514.6C-1 (with SSD) |
| Safety & EMC | CE / FCC compliant |
| OS Compatibility | Windows 10, Windows 11, Linux |
Ordering Information
| TANK-8700-MPHX-89AD-3B-R10 | Ruggedized Fanless embedded system with AMD Ryzen™ 9 8945HS 4.0 GHz, (up to 5.2 GHz, 8 Core, TDP 45W), 16GB DDR5 pre-installed memory, PCIe x8/PCIe x4/PCI, HDMI/DP/USB4, 12-28V DC, RoHS |
| TANK-8700-MPHX-89AD-3A-R10 | Ruggedized Fanless embedded system with AMD Ryzen™ 9 8945HS 4.0 GHz, (up to 5.2 GHz, 8 Core, TDP 45W), 16GB DDR5 pre-installed memory, PCIe x8/PCIe x4/PCIe x1,HDMI/DP/USB4, 12-28V DC, RoHS |
| TANK-8700-MPHX-87AD-3B-R10 | Ruggedized Fanless embedded system with AMD Ryzen™ 7 8845HS 3.8 GHz, (up to 5.1 GHz, 8 Core, TDP 45W), 16GB DDR5 pre-installed memory, PCIe x8/PCIe x4/PCI, HDMI/DP/USB4, 12-28VV DC, RoHS |
| TANK-8700-MPHX-87AD-3A-R10 | Ruggedized Fanless embedded system with AMD Ryzen™ 7 8845HS 3.8 GHz, (up to 5.1 GHz, 8 Core, TDP 45W), 16GB DDR5 pre-installed memory, PCIe x8/PCIe x4/PCIe x1, HDMI/DP/USB4, 12-28V DC, RoHS |
| TANK-8700-MPHX-85AD-3B-R10 | Ruggedized Fanless embedded system with AMD Ryzen™ 5 8645HS 4.3 GHz, (up to 5.0 GHz, 6 Core, TDP 45W), 16GB DDR5 pre-installed memory, PCIe x8/PCIe x4/PCI, HDMI/DP/USB4, 12-28V DC, RoHS |
| TANK-8700-MPHX-85AD-3A-R10 | Ruggedized Fanless embedded system with AMD Ryzen™ 5 8645HS 4.3 GHz, (up to 5.0 GHz, 6 Core, TDP 45W), 16GB DDR5 pre-installed memory, PCIe x8/PCIe x4/PCIe x1, HDMI/DP/USB4, 12-28V DC, RoHS |
IEI Tank Embedded Computers
- IEI TANK-XM811 12th Gen Alder Lake-S “Flexible Expansion eChassis” AIoT Developer Kit
- IEI TANK-XM811AI-RPL 13th Gen Raptor Lake-S AIoT Developer Kit
- IEI TANK-XM813 15th Gen Arrow Lake Core Ultra Fanless Embedded Computer
- IEI TANK-XM812 AMD Ryzen 7000/8000 Series Fanless Computer
- IEI TANK-8700-MPHX AMD Ryzen 7000/8000 Series Fanless Computer
