Neousys POC-40 x6211E Extreme-compact Computer
- Product Name: Neousys POC-40
- System Type: Extreme-compact Embedded Computer
- CPU: Intel Elkhart Lake Atom x6211E dual-core processor
- RAM: Up to 32 GB DDR4-3200 SDRAM (one SODIMM slot)
- Expansion: M.2 2280 M key SATA storage, One M.2 B key socket supporting 5G/4G 3042/3052 modules, One M.2 E key socket for WiFi 5/WiFi 6 modules
- Other features: 52 x 89 x 112 mm extremely compact form factor, Rugged -25°C to 70°C fanless wide-temperature operation, Two GigE ports, two USB 3.1 Gen1 ports, and two USB 2.0 ports, One COM port with RS-232/422/485 modes and three RS-232 COM ports
Description
The POC-40 from Neousys Technology is an extremely compact fanless computer with an external footprint measuring just 52 x 89 x 112 mm. The PC features and Intel Elkhart Lake Atom® processor and is designed for space-restricted applications such as factory data collection, rugged Edge computing and mobile gateways.
Utilising Intel’s 10nm technology manufacturing processes, the new Elkhart Lake Atom® x6211E dual-core processor can deliver up to 1.8 times the performance boost over the previous generations of Atom processor solutions. In comparison to POC-200, the POC-40 provides up to 1.9 times computing performance – but within half the footprint . The PC features standard I/O functionality in the form of 2 x Gigabit Ethernet ports, 4 x USB 3.1 Gen1/ 2.0 ports, 4 x COM ports and optional isolated digital I/O’s for industrial communication and control.
In addition, and by adopting dedicated M.2 B key and E key slots, the POC-40 can fully harness the bandwidth of 5G and WiFi 6 wireless communications to provide wide-area coverage and real-time data transmission for static and mobile gateway applications.
With a similar footprint as a PICO-ITX motherboard, the Neousys’ POC-40 is perfect for projects that require above par performance in an extremely compact package. Ideal for both Edge computing and gateway applications, the POC-40 is a low power consumption and lightweight fanless device that offers wide-temperature operation for harsh environments.
Key Features
- Intel® Elkhart Lake Atom® x6211E dual-core processor
- 52 x 89 x 112 mm extremely compact form factor
- Rugged -25°C to 70°C fanless wide-temperature operation
- Two GigE ports, two USB 3.1 Gen1 ports and two USB2.0 ports
- M.2 2280 M key SATA storage interface
- One M.2 B key socket supporting 5G/ 4G 3042/ 3052 modules
- One M.2 E key socket for WiFi 5/ WiFi 6 modules
- One COM port with RS-232/ 422/ 485 modes and three RS-232 COM ports
Specification
| System Core | |
|---|---|
| Processor | Intel® Elkhart Lake Atom® x6211E dual-core 1.3GHz/ 3.0GHz 6W processor |
| Graphics | Integrated Intel® UHD Graphics |
| Memory | Up to 32 GB DDR4-3200 SDRAM (one SODIMM slot) |
| TPM | Supports fTPM 2.0 |
| Panel I/O Interface | |
| Ethernet | 2x Gigabit Ethernet ports by Intel® I210 GbE controllers |
| USB | 2x USB 3.1 Gen1 (5 Gbps) ports 2x USB 2.0 ports |
| Video Port | 1x DisplayPort connector, supporting 4096 x 2160 resolution @ 60Hz |
| Serial Port | 1x software-programmable RS-232/ 422/ 485 port (COM1) 3x 3-wire RS-232 ports (COM2/ COM3/ COM4) |
| Isolated Digital I/O | Optional 4-ch isolated digital input and 4-ch isolated digital output |
| Storage Interface | |
| M.2 M key | 1x M.2 2280 M key SATA interface |
| Internal Expansion Bus | |
|---|---|
| M.2 B key | 1x M.2 3042/ 3052 B key socket with internal SIM socket for 4G/ 5G module |
| M.2 E key | 1x M.2 2230 E key socket for WiFi 5/ WiFi 6 module |
| Power Supply | |
| DC Input | 1x 4-pin pluggable terminal block for 12-20V DC input with optional ignition power control |
| Remote Control | 1x 4-pin pluggable terminal block for remote control |
| Mechanical | |
| Dimension | 52 mm (W) x 89 mm (D) x 112 mm (H) |
| Weight | 0.6kg |
| Mounting | DIN-rail mount (standard) or Wall-mount (optional) |
| Environmental | |
| Operating Temperature | -25°C ~ 70°C |
| Storage Temperature | -40°C ~85°C |
| Humidity | 10%~90% , non-condensing |
| Vibration | Operating, MIL-STD-810G, Method 514.6, Category 4 |
| Shock | Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| EMC | CE/FCC Class A, according to EN 55032 & EN 55024 |
Power Backup Modules:
|
PB-9250J-SA – 9250 w.s Standalone Intelligent SuperCAP Power Backup Module |
PB-4600J-SA – 4600 w.s Standalone Intelligent SuperCAP Power Backup Module |
PB-2580J-SA – 2580 w.s Standalone Intelligent SuperCAP Power Backup Module |
Ordering Information
POC-40
Intel® Elkhart Lake Atom® x6211E Extreme-compact Embedded Computer with 2x GbE and 2x USB 3.1
POC-40-DIO
Intel® Elkhart Lake Atom® x6211E Extreme-compact Embedded Controller with 2x GbE, 2x USB 3.1 and 8x isolated DIO
POC-40-IGN
Intel® Elkhart Lake Atom® x6211E Extreme-compact Embedded Controller with 2x GbE, 2x USB 3.1 and ignition power control
POC-40+
Intel® Elkhart Lake x6413E Extreme-compact IOT Gateway Computer with 2x GbE, 2x USB 3.1, 1x isolated RS422/485 and 8x isolated DIO
POC-40+IGN
Intel® Elkhart Lake x6413E Extreme-compact IOT Gateway Computer with 2x GbE, 2x USB 3.1, 1x isolated RS422/485 and ignition power control
Optional Accessories
PA-60W-OW
60W AC/DC power adapter with 12V, 5A DC output, cord end terminals for terminal block. Operating temperature : -30 to 60 °C
Wmkit-V-POC40
Wall-mount assembly for POC-40 series, vertical type
Cbl-DB9F-3DB9M-15CM
1x DB9 (Female) to 3x DB9 (Male), length: 15CM
BVM Customisation Service
Design | Develop | Test | Manufacture
Here’s a selection of our design, manufacturing & associated services: –
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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
 Testing |
 Materials Management |
 Logistics and Tracking |
 External Manufacturing |
| • Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |
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