Description
The LE-37P 3.5” Single Board Computer (SBC) with Intel’s Tiger Lake / 11th Gen H processors (package type – FCBGA1787), supporting 1 x 260-pin, DDR4 3200 MHz SO-DIMM (up to) 32GB RAM.
The platform is based on Intel’s 11th Gen integrated UHD Graphics, the GPU offering 32 execution units (EUs) clocked up to 1350MHz (dependent on the CPU model). Display output is supported via 1 x LVDS, 1 x HDMI and 1 x DP port with up to three displays being controlled simultaneously. The LE-37P offers other features such high-speed data transfer interfaces in the format of :-
- 6 x USB3.2 Gen2
- 2 x SATA3,
- Dual Gigabit Ethernet
The LE37P additionally comes equipped with :-
- 2 x RS232 ports
- 2 x RS232/422/485 ports
- 2 x USB2.0 ports
- Intel® High Definition Audio
- 1 x MiniPCIe socket (support mSATA)
- 1 x M.2 (Key E 2230)
- 2 x M.2 (Key M 2280) for NVMe
- 1 x SIM slot.
Specification
| Form Factor | 3.5″ Single Board Computer |
| Processor |
Intel® Tiger Lake / 11th Gen H Processor Package Type: FCBGA1787 |
| Memory | 1 x 260-pin DDR4 3200 MHz SO-DIMM up to 32GB (Support Non-ECC, unbuffered memory) |
| Integrated Graphics | Intel® 11th Gen integrated UHD Graphics |
| Real Time Clock | Chipset integrated RTC with onboard lithium battery |
| Watchdog Timer | Generates a system reset with internal timer for 1min/s ~ 255min/s |
| Serial ATA Interface |
Intel® built-in 2 x Serial ATA3 interface up to 600MB/s Support RAID 0, 1 and Intel Rapid Storage Technology. |
| LVDS Interface | Onboard 24-bit dual channel LVDS connector with +3.3V/+5V/+12V supply |
| DisplayPort Interface | Onboard DisplayPort connector |
| HDMI Interface | Onboard HDMI connector |
| Audio Interface | Realtek ALC888S HD Audio |
| LAN Interface | 1 x Intel® i219-LM Gigabit PHY LAN (Support iAMT 15.0), 1 x Intel® i225-LM Gigabit LAN |
| GPIO Interface | Onboard programmable 8-bit digital I/O interface |
| Extended Interface |
1 x Mini PCIe card with SIM slot(support mSATA) 1 x M.2 (Key M 2280) support PCIe Gen4 and SATA 1 x M.2 (Key M 2280) support PCIe Gen4 1 x M.2 (Key E 2230) for Wi-Fi and Bluetooth |
| Internal I/O Port | 2 x SATA3, 2 x RS232/422/485, 2 x RS232, 2 x USB2.0, 1 x LVDS, 1 x LCD inverter connector, 1 x GPIO, 1 x Audio (MIC-in & Line-out), 1 x SMBus, 1 x USB3.2 Gen2 (Type E) |
| Rear I/O Port | 1 x DisplayPort, 1 x HDMI, 6 x USB3.2 Gen2, 2 x LAN, 1 x DC jack |
| Power Requirement | DC jack 9~35V |
| Board Dimension | 146 mm x 101 mm (L x W) |
| Temperature |
Operating within 0 ~ 60°C (Note1) Storage within -20 ~ 80°C |
| Relative Humidity | 10%~90%, non-condensing |
Note1: W-11865MRE,W-11865MLE,W-11555MRE,W-11555MLE,W-11155MRE,W-11155MLE W series can operate within -40°C~85°C (-40°F~185°F).
Note2: If you want to use other TGL H CPU (i5-11500HE, i3-11100HE, W-11865MRE, W-11865MLE, W-11555MRE, W-11555MLE, W-11155MRE, W-11155MLE, 6600HE), please contact with our sales.
Note3: There are two module (ADP-3355, ADP-3460), and you can choose one to support VGA or 2nd LVDS, please contact with our sales for OEM version.
Ordering Information
LE-37P5 – With Core™ i5-11500HE, QM580E, Cooler Fan, HDMI, DP, LVDS
LE-37P3 – With Core™ i3-11100HE, QM580E, Cooler Fan, HDMI, DP, LVDS
LE-37P7 – With CoreTM i7-11850HE, QM850E + Cooler Fan, support HDMI, DP, LVDS
LE-37PC – With Celeron® 6600HE, QM580E, Cooler Fan, HDMI, DP, LVDS
LE-37PW7R – With Xeon® W-11865MRE, RM590E, Cooler Fan, HDMI, DP, LVDS
LE-37PW7L – With Xeon® W-11865MLE, RM590E, Cooler Fan , HDMI, DP, LVDS
LE-37PW5R – With Xeon® W-11555MRE, RM590E, Cooler Fan, HDMI, DP, LVDS
LE-37PW5L – With Xeon® W-11555MLE, RM590E, Cooler Fan, HDMI, DP, LVDS
LE-37PW3R – With Xeon® W-11155MRE, RM590E Cooler Fan, HDMI, DP, LVDS
LE-37PW3L – With Xeon® W-11155MLE, RM590E, Cooler Fan, HDMI, DP, LVDS
ADP-3355 – DisplayPort to VGA module (For VGA)
ADP-3460 – DisplayPort to LVDS module (For 2nd LVDS)
