DFI ADS310-R680E/Q670E 12th Gen Alder Lake-S Micro-ATX Motherboard

DFI ADS310-R680E/Q670E 12th Gen Alder Lake-S Micro-ATX Motherboard

Product Name: DFI ADS310-R680E/Q670E
Motherboard Form Factor: Micro-ATX
CPU: 12th Gen Intel Core with Intel R680E/Q670E chipset
RAM: 4 DDR4 UDIMM up to 128GB
Expansion: Multiple expansion: 1 PCIe x16 gen 5, 3 PCIe x4, 1 M.2 E key, 2 M.2 M key, 4 SATA 3.0
Other features: Supports 4 independent displays: VGA, 2 DP++, HDMI 2.0a, Supports 8K/4K resolution, Rich I/O: 2 Intel 10GbE, 2 Intel 2.5GbE, 2 COM, 6 USB 3.2 Gen 2, 4 USB 3.2 Gen 1, 4 USB 2.0

SKU: ADS310-R680E/Q670E Category: Micro ATX (mATX) Industrial Motherboards Tags: 10GbE, 2.5GbE, GPIO / DIO, Intel Alder Lake, IoT, Multi Display - Quad, NVMe, OS: Linux, OS: Windows, OS: Windows 11, PCIe Gen 5.0, Powered by Intel, RAID, Rugged, TPM 2.0, Wide Temp Brand: DFI

Description

12th Gen Intel® Core™ with Intel® R680E/Q670E chipset (13/14th Gen)
4 DDR4 UDIMM up to 128GB
Supports 4 independent displays: VGA, 2 DP++, HDMI 2.0a
Supports 8K/4K resolution
Multiple expansion: 1 PCIe x16 gen 5, 3 PCIe x4, 1 M.2 E key, 2 M.2 M key, 4 SATA 3.0
Rich I/O: 2 Intel 10GbE, 2 Intel 2.5GbE, 2 COM, 6 USB 3.2 Gen 2, 4 USB 3.2 Gen 1, 4 USB 2.0
Intel Virtualization Technology
15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)

ADS310 Specification

System

Processor

12th Generation Intel® LGA 1700 Socket Processors, TDP support up to 125W

Intel® Core™ i9-12900E (16 Cores, 30M Cache, up to 5.0 GHz); 65W

Intel® Core™ i9-12900TE (16 Cores, 30M Cache, up to 4.8 GHz); 35W

Intel® Core™ i7-12700E (12 Cores, 25M Cache, up to 4.8 GHz); 65W

Intel® Core™ i7-12700TE (12 Cores, 25M Cache, up to 4.6 GHz); 35W

Intel® Core™ i5-12500E (6 Cores, 18M Cache, up to 4.5 GHz); 65W

Intel® Core™ i5-12500TE (6 Cores, 18M Cache, up to 4.3 GHz); 35W

Intel® Core™ i3-12100E (4 Cores, 12M Cache, up to 4.2 GHz); 60W

Intel® Core™ i3-12100TE (4 Cores, 12M Cache, up to 4.0 GHz); 35W

Intel® Pentium® G7400E (2 Cores, 6M Cache, 3.6 GHz); 46W

Intel® Pentium® G7400TE (2 Cores, 6M Cache, 3.0 GHz); 35W

Intel® Celeron® G6900E (2 Cores, 4M Cache, 3.0 GHz); 46W

Intel® Celeron® G6900TE (2 Cores, 4M Cache, 2.4 GHz); 35W

Chipset

Intel® R680E/Q670E Chipset

Memory

Four 288-pin DIMM up to 128GB

Dual Channel DDR4 3200 MHz (ECC support: R680E only)

BIOS

AMI SPI 256Mbit

Graphics

Controller

Intel® HD Gen 9 Graphics

Feature

OpenGL 4.5, DirectX 12, OpenCL 2.1

HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9

HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9

Display

1 x VGA, resolution up to 1920×1200 @ 60Hz

2 x DP++, resolution up to 7680×4320 @ 60Hz

1 x HDMI 2.0a, resolution up to 4096×2160 @ 24Hz

Quad Displays

VGA + 2 DP++ + HDMI

Expansion

Interface

1 x PCIe x16 (Gen 5)

2 x PCIe x4 (Gen 4)

1 x PCIe x4 (Gen 3) (R680E: x4 signal; Q670E: x1 signal)

1 x M.2 2230 E key (PCIe/USB 2.0/Intel CNVi support)(Discrete Wifi 6E support)

1 x M.2 2242/2260/2280 M key (PCIe x4 Gen3 NVMe/SATA/Intel Optane Memory support)

1 x M.2 2242/2260/2280 M key (PCIe x4 Gen3 NVMe/Intel Optane Memory support)

Audio

Audio Codec

Realtek ALC888

Ethernet

Controller

2 x Intel® I225LM PCIe (10M/100M/1000Mbps/2.5G) (only Xeon, Core i9/i7/i5 support iAMT)

2 x Intel® x550-AT2 (10 GBASE-T/1 GbE/100 Mbps)

Rear I/O

Ethernet

2 x 2.5GbE (RJ-45)

2 x 10GbE (RJ-45)

USB

4 x USB 3.2 Gen 2

4 x USB 3.2 Gen 1

Display

1 x VGA

2 x DP++

1 x HDMI 2.0a

Audio

1 x Line-out

1 x Mic-in

1 x Line-in (opt. by request, MOQ required)

Internal I/O

Serial

2 x RS-232/422/485 (RS-232 w/ power) (2.54mm pitch)

USB

2 x USB 3.2 Gen2 Key B box header

4 x USB 2.0 (2.54mm pitch) (colay vertical Type A, MOQ required)

Audio

1 x Front Audio Header

1 x S/PDIF

SATA

4 x SATA 3.0 (up to 6Gb/s)

RAID 0/1/5/10

DIO

1 x 8-bit DIO

SMBus

1 x SMBus

PS/2

1 x PS/2 (2.54mm pitch)

Watchdog Timer

Output & Interval

System Reset, Programmable via Software from 1 to 255 Seconds

Security

TPM

Nuvoton TPM 2.0 (opt., MOQ required)

Power

Type

ATX

Connector

8-pin ATX 12V power

24-pin ATX power

Consumption

TBD

RTC Battery

CR2032 Coin Cell

OS Support

Microsoft

Windows 10 IoT Enterprise 64-bit

Linux

Linux

Environment

Temperature

Operating: -5 to 65°C

Storage: -30 to 60°C with RTC Battery; -40 to 85°C without RTC Battery

Humidity

Operating: 5 to 95% RH

Storage: 5 to 95% RH

MTBF

TBD

Mechanism

Dimensions

microATX Form Factor

244mm (9.6″) x 244mm (9.6″)

Height

PCB: 1.6mm

Top Side: TBD Bottom Side: TBD

Standards and Certifications

Certifications

CE, FCC Class B, RoHS

Packing List

1 ADS310-R680E/Q670E motherboard

1 COM port cable (Length: 300mm, 2 x COM ports) A81-015026-023G

1 Serial ATA data cable (Length: 500mm) 332-553001-005G

1 I/O shield TBD

Country of Origin

Taiwan

Datasheet

Download(413 KB)

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

Here’s a selection of our design, manufacturing & associated services: –

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

FREE Pre-design / Pre-sales advise
Prototyping
- Custom PC Design
- Custom Panel PC
- Custom Racks and Towers
- Custom Peli Case PCs
Prototyping pre checks (chargeable one-time fee for existing prototype)
- Hardware compatibility
- Thermal testing
- Software compatibility
Custom PCB / Board Design
- COM Express, Qseven, SMARC
  Jetson, Raspberry Pi
Custom Chassis Design
- Metal
- Plastic
Custom Cables
Custom Back Panels and Faceplates
Custom Cooling
Custom Metal Work (internal brackets, mounting brackets)
Touchscreen Integration and Display Enhancements
- Custom LCD Displays
- Integration of touch technologies
- Optical Bonding
- Anti-reflective and anti-glare coatings
All products are Designed for Manufacture
Software – Custom OS Image

Build to Order: Computer Design and Customisation Services

Take an existing system and we can:

Custom specification (CPU, RAM, I/O, Industrial Storage, RAID)
Chassis customisation and branding
Custom BIOS
Long Term Availability
Software – Custom OS Image
Custom Packaging and branding
Integrating newly designed or existing hardware into a larger system

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

Windows image capture from customers HDD
Linux image capture from customers HDD
Android image capture from customers HDD
Windows / Linux Deployment from customers image
Custom Windows images, create and deploy
Update management
Custom Linux and Android images
Custom BIOS

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing	Materials Management	Logistics and Tracking	External Manufacturing
• Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test	• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System	• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels	• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test