DFI EC300-CS AI-Enabled 5G MXM PoE High Performance System

  • Product Name: DFI EC300-CS
  • System Type: AI-Enabled 5G MXM PoE High Performance System
  • CPU: 8th/9th Generation Intel Core Processors
  • RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
  • Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
  • Other features: 4 x RJ45 type PoE ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)

Description

Introducing the EC300-CS, a robust PC specifically built for industrial use, equipped with advanced features like 5G connectivity and an MXM-module. It harnesses the processing power of 8th/9th generation Intel Processors. The EC300-CS is meticulously crafted to excel in AI Vision applications, including automated optical inspection (AOI) and vision-guided robotics within factory environments. Moreover, it offers exceptional performance in high-resolution diagnostic imaging for medical purposes and traffic flow analysis in transportation, among other diverse applications.

Features

  • 8th/9th Generation Intel® Core™ Processors
  • 4 x RJ45 type PoE ports at 15W
  • AI Accelerated: Up to 110W GPU MXM Module Supported
  • Multiple Expansion Slots for 3G/LTE/5G Cellular Support
  • Extended Operating Temperature: -25°C to 70°C
  • Support 5G Communication
  • 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)

Specification

System

Processor
8th/9th Generation Intel® Core™ Processors, LGA 1151
Intel® Core™ i7-9700TE 8C/8T 1.8GHz 12MB cache, TDP 35W with Q370PCH
Intel® Core™ i7-8700T 6C/12T 2.4GHz 12MB cache, TDP 35W with Q370PCH
Intel® Core™ i7-9700E 8C/8T 2.6GHz 12MB cache, TDP 65W with Q370PCH
Intel® Core™ i5-9500TE 6C/6T 2.2GHz 9MB cache, TDP 35W with Q370PCH
(Other CPU support upon request)
Chipset
Intel® Q370 Chipset
Memory
Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
BIOS
AMI SPI 128Mbit

Graphics

Controller
Intel® HD Graphics
Display
1 x VGA (display out by DB-15 connector)
1 x HDMI (with screw lock)
1 x DP++ (Standard Display Port Connector DIP type with screw lock)
Support NIVIDIA Optimus technology
VGA: resolution up to 1920×1200@60Hz
HDMI: resolution up to 4096×2160@24Hz
DP++: resolution up to 4096×2304@60Hz

AI Accelerator

Interface
MXM Type A, B, C on x16 PCIe 3.0
Controller
Nvidia Quadro embedded/ Geforce series

Storage

External
4 x Swappable 2.5” storage bay with lock.
Supports 7mm SSD devices
Internal
1 x M.2 2280 M key supports SATA SSD

Expansion

Interface
1 x Half-size Mini PCIe for WiFi/BT modules, with PCIe x1 & USB signal
2 x Full-size Mini PCIe support PCIe x1 & USB 2.0 signal with SIM of each (All SIM Cards can be external accessible with cover against vibration)
1 x M.2 B key supports 3042, 3052 devices or 5G module on PCIe x1, USB2.0, USB3.0 signal with SIM slot (SIM card can be external accessible with cover)
1 x M.2 2280 M key supports 2242, 2260 & 2280 devices (PCIe x4 & SATA signal, support boot up function)

Audio

Interface
1 x Mic-in
1 x Line-out

Ethernet

Controller
5 x Intel® I210IT NIC (10/100/1000Mbps)
1 x Intel® I219LM PHY (10/100/1000Mbps)
Interface
2 x RJ45 GbE
4 x 802.3af 15W PoE ports

LED

Indicators
1 x Power LED (green)
5 x Storage LED (red)
4 x PoE LED

Front I/O

PoE
4 x RJ45 802.3af PoE
Support 802.11af, max 15.4W (PSE side)
NOT support Wake on Lan
Ethernet
2 x GbE (RJ-45) support Wake on Lan
Serial
2 x High speed full RS-232/422/485 (DB-9)
2 x RS-232/422/485 (onboard)
USB
4 x USB 3.0 (type A)
Display
1 x VGA display out by DB-15 connector
DIO
1 x 8-bit isolated DI port by DB-9 connector
1 x 8-bit isolated DO port by DB-9 connector
2KV isolation
Power-in
1 x 9-pin 5.0mm terminal block

Rear I/O

USB
2 x USB 2.0 (type A)
Display
1 x HDMI
1 x DP++
Audio
1 x Mic-in
1 x Line-out
by 3.5mm 3P phone Jack
Buttons
1 x Power button
1 x Reset button
Antenna
7 x SMA type antenna holes for GNSS, WWAN/LTE MIMO, WLAN/ BT MIMO, 5G
SIM
3 x SIM sockets (external accessible with cover)

Watchdog Timer

Output & Interval
System reset, programmable via software from 1 to 255 seconds

Security

TPM
TPM 2.0

Power

Type
+12VDC
Reverse polarity protection
Connector
9-pin 5.0mm terminal block

OS Support

Microsoft
Windows 10 IoT Enterprise 64 Bit
Linux
Ubuntu 18.04

Environment

Operating Temperature
-20°C to 70°C with GTX1060, RTX2060
-20°C to 55°C with RTX2070
CPU and GPU may be throttling at high temperature
Active fan for supporting higher temperature or higher power MXM is supported per request
Storage Temperature
-40 to 85°C
Relative Humidity
10% to 90% (non-condensing)

Mechanism

Construction
Metal + Aluminum
Mounting
Wall mount
Dimensions (W x H x D)
340.5 x 132 x 223mm (3U height, excluding rubber foot)
Weight
9.85 kg

Standards and Certifications

Shock
EN61373: 2010, Category 1 Class A & Class B
Vibration
EN61373: 2010, Category 1 Class B
Certifications
CE, FCC Class B (Tested with Adapter)
IP Rating
IP40

Country of Origin

Country of Origin
Taiwan

DFI 8th/9th Gen Coffee Lake

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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