DFI RPP171/RPP173 Raptor Lake Mini-ITX SBC

  • Product Name: DFI RPP171/RPP173
  • Motherboard Form Factor: Mini-ITX SBC
  • CPU: 13th Gen Intel Core Processors
  • RAM: 2 DDR5 SODIMM slots, up to 64GB
  • Expansion: 1 PCIe x4, 1 M.2 M key, 1 M.2 B key, 1 M.2 E Key, 1 M.2 A Key
  • Other features: Quad Display Support: 2 DP/HDMI + 1 USB Type C + 1 M2A Display (eDP/LVDS/VGA/HDMI), 4K resolution support, Rich I/O Connectivity: Up to 3 Intel 2.5GbE LAN ports, 4 USB 3.2 Gen2 ports, 1 USB Type C port, and 4 USB 2.0 headers

Description

Introducing the DFI RPP171/RPP173 Mini-ITX SBC motherboard, designed to deliver powerful performance for compact systems. Equipped with 13th Gen Intel® Core Processors, it offers seamless computing power for various applications. With 2 DDR5 SODIMM slots supporting up to 64GB of RAM, you can tackle demanding tasks with ease. The motherboard features multiple expansion slots including PCIe x4, M.2 M key, M.2 B key, M.2 E Key, and M.2 A Key, providing flexibility for future upgrades. Enjoy immersive visuals with quad display support, offering 2 DP/HDMI ports, 1 USB Type C port, and 1 M2A Display port with support for 4K resolution. Stay connected with rich I/O connectivity options, including up to 3 Intel 2.5GbE LAN ports, 4 USB 3.2 Gen2 ports, 1 USB Type C port, and 4 USB 2.0 headers, ensuring seamless connectivity for peripherals.

Key Features

  • 13th Gen Intel® Core Processors
  • 2 DDR5 SODIMM up to 64GB
  • Quad Displays: 2 DP/HDMI + 1 USB Type C + 1 M2A Display (eDP/LVDS/VGA/HDMI)
  • Supports 4K resolution
  • Multiple Expansion: 1 PCIe x4, 1 M.2 M key, 1 M.2 B key, 1 M.2 E Key, 1 M.2 A Key
  • Rich I/O: Up to 3 Intel 2.5GbE, 4 USB 3.2 Gen2, 1 USB Type C and 4 USB 2.0 headers

Specification

System
Processor
13th Generation Intel® Core™ Processors
Intel® Core™ i7-1365UE (10 Cores, 12M Cache, up to 4.9 GHz); 15~28W
Intel® Core™ i5-1345UE (10 Cores, 12M Cache, up to 4.6 GHz); 15~28W
Intel® Core™ i3-1315UE (6 Cores, 10M Cache, up to 4.5 GHz); 15~28W
Intel® Processor U300E (Formerly Pentium) (5 Cores, 24M Cache, up to 4.3 GHz); 15~28W
Memory
2x 262-pin SODIMM up to 64GB
Dual Channel DDR5 5200MHz
BIOS
AMI SPI 256Mbit
Graphics
Controller
Intel® Iris® Xe Graphics eligible
Feature
OpenGL 4.6, DirectX 12.1, OpenCL 3.0, OpenGL 4.6
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9
Display
2 x HDMI/DP Combo (Auto detect)
HDMI: resolution up to 4096×2160 @30Hz
DP: resolution up to 4096×2304 @60Hz
USB Type C (DP alt-mode/USB3.2 Gen2/PD 15W): resolution up to 4096×2304 @60Hz (HBR2)
Quad Displays
HDMI + DP + USB Type C (DP alt-mode/USB3.2 Gen2/PD 15W) + M2A-Display (optional)
Expansion
Interface
1 x PCIe Gen 4 x4
1 x M.2 2242/2280 M Key (PCIE Gen4x4, support NVMe )
1 x M.2 2242/3042/3052 B Key (PCIE Gen3x1, USB3.2 Gen2, USB2.0, selected by BIOS)
1 x M.2 2230 E Key (PCIE Gen3x1 and USB2.0, support Intel® CNVi)
1 x M.2 3060 A Key support DFI M2A-display module (opt. MOQ required)
Audio
Audio Codec
Realtek ALC888S
Ethernet
Controller
1 x Intel® I226LM/IT (10/100/1000/2500Mbps)
2 x Intel® I226V/IT (10/100/1000/2500Mbps)
Rear I/O
Ethernet
Up to 3 x 2.5GHz RJ45 (LAN 3 colayout with internal vertical RJ45 by option)
USB
4 x USB 3.2 Gen2
1 x USB Type C (DP alt-mode/USB3.2 Gen2/PD 15W)
Display
2 x DP/HDMI combo (Auto detect)
Internal I/O
Serial
2 x RS-232/422/485 (2.0mm pitch)
1 x RS-232 with power (2.0mm pitch)
1 x RS-232 (2.0mm pitch) colay with DIO-4bit (JP1)
USB
4 x USB 2.0 (2.0mm pitch)
Display
1 x M.2 A key, support M2A-Display (eDP/LVDS/VGA/HDMI/DP) by optional
Audio
1 x Line-out/Mic-in
SATA
2 x SATA 3.0
DIO
1 x 8-bit DIO
SMBus
1 x SMBus
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
dTPM (default)
fTPM (option)
Power
Type
RPP171: Single 12VDC
RPP173: Wide Range 9~36VDC
Connector
DC-in Jack
Right Angle Connector (4-pin) (available upon request)
Straightl Type Connector (4-pin) (available upon request)
Consumption
TBD
RTC Battery
CR2032 Coin Cell
OS Support
Microsoft
Windows IoT Enterprise 10 LTSB
Linux
Linux
Environment
Temperature
Operating: -5 to 65°C, -20 to 70°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 95% RH
Storage: 5 to 95% RH
MTBF
TBD
Mechanism
Dimensions
Mini-ITX Form Factor
170mm (6.7″) x 170mm (6.7″)
Height
PCB: 1.6mm
Top Side: TBD
Standards and Certifications
Certifications
CE, FCC, RoHS
Packing List
Packing List
· 1 RPP171/RPP173 motherboard
· 1 COM port cable with bracket (Length: 250mm, 1 x COM ports), A81-015115-018G
· 1 Serial ATA data with power cable (Length: 300mm), A81-002144-018G
· 4 M.2 screw/standoff
 
· 1 I/O Shield
– (2 LAN, Regular type), A49-RPP171-010G
– (3 LAN, Regular type), A49-RPP171-000G
– (2 LAN, Thin type), A49-RPP171-100G (By request)
– (3 LAN, Thin type), A49-RPP171-110G(By request)
 
· 1 Cooler/Heat sink
– (Wide/Normal Temp. -Cooler for 28W), A71-108160-010G (Default)
– (Wide Temp. Fanless HS for 15W), A71-008184-010G (By request)
– (Normal Temp. Fanless HS for 15W), A71-008184-000G (By request)
Country of Origin
Country of Origin
Taiwan

Ordering Information

Model Name Part Number Description
RPP171-IE-1365UE 770-RPP1711-000G RPP171-IE-1365UE, 2 DDR5, Rear I/O(2 DP/HDMI combo, 3 LAN, 4 USB 3.2 Gen2, 1 USB Type C), Internal I/O (M.2 M/B/E/A Key, 4 USB 2.0, w/TPM), DC-Jack, Wide Temp -20 to 70°C
RPP171-IE-1345UE 770-RPP1711-100G RPP171-IE-1345UE, 2 DDR5, Rear I/O(2 DP/HDMI combo, 3 LAN, 4 USB 3.2 Gen2, 1 USB Type C), Internal I/O (M.2 M/B/E/A Key, 4 USB 2.0, w/TPM), DC-Jack, Wide Temp -20 to 70°C
RPP171-IB-1315UE 770-RPP1711-200G RPP171-IE-1315UE, 2 DDR5, Rear I/O(2 DP/HDMI combo, 3 LAN, 4 USB 3.2 Gen2, 1 USB Type C), Internal I/O (M.2 M/B/E/A Key, 4 USB 2.0, w/TPM), DC-Jack, -5 to 65°C
RPP171-IB-U300E 770-RPP1711-300G RPP171-IB-U300, 2 DDR5, Rear I/O( 2 DP/HDMI combo, 3 LAN, 4 USB 3.2 Gen2, 1 USB Type C), Internal I/O (M.2 M/B/E/A Key, 4 USB 2.0, w/TPM), DC-Jack, -5 to 65°C
RPP173-IE-1365UE 770-RPP1731-000G RPP173-IE-1365UE, 2 DDR5, Rear I/O(2 DP/HDMI combo, 3 LAN, 4 USB 3.2 Gen2, 1 USB Type C), Internal I/O (M.2 M/B/E/A Key, 4 USB 2.0, w/TPM), DC-Jack, Wide Temp -20 to 70°C

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