DFI RPS183 14th Gen Raptor Lake MXM Mini-ITX Motherboard
- Product Name: DFI RPS183
- Motherboard Form Factor: Mini-ITX
- CPU: Supports 14th/13th/12th Gen Intel Core Processors
- RAM: 2x DDR5 SODIMM, up to 64GB
- Expansion: 1x PCIe x4 (side), 1x M.2 M Key, 1x M.2 E Key, 1x M.2 B Key
- Other Features: Supports MXM module, multiple display outputs, dual Intel 2.5GbE, USB 3.2, wide-range 19-24V power input, and long-term availability up to Q1 2038
Description
DFI RPS183 Mini-ITX Motherboard – High-Performance Solution for Industrial Applications
The DFI RPS183 Mini-ITX motherboard is designed for high-performance industrial computing, supporting 14th, 13th, and 12th Gen Intel® Core™ processors. With DDR5 memory support up to 64GB, it delivers exceptional speed and efficiency for demanding applications.
This motherboard features versatile expansion options, including PCIe x4, M.2 M Key, M.2 E Key, and M.2 B Key, allowing seamless integration with various industrial components. Its MXM module support and multiple display outputs—DP++, HDMI, eDP, and USB Type-C (DP Alt-mode)—make it an excellent choice for embedded systems, digital signage, and AI-driven applications.
Designed for industrial reliability, the DFI RPS183 includes dual Intel® 2.5GbE LAN, multiple USB 3.2 ports, and a wide 19-24V power input. Built to last, it aligns with Intel’s 10-year CPU lifecycle roadmap, ensuring long-term availability and support until Q1 2038.
Key Features
- 14th/13th/12th Gen Intel Core Processors
- 2 DDR5 SODIMM up to 64GB
- Multiple Display: 1 DP++(CPU), 1 DP++(MXM), 1 USB Type C(DP Alt-mode), 1 eDP(MXM), 1 internal HDMI(MXM)
- Support MXM module, with 1 internal HDMI, 1 eDP and 1 external DP++
- Multiple Expansion: 1 PCIe x4(side), 1 M.2 M key, 1 M.2 E Key, 1 M.2 B Key
- Rich I/O: 2 Intel® 2.5GbE, up to 4 USB 3.2 Type A, up to 1 USB Type C
- Wide Range power input 19~24V
- Typically supports 10-Year CPU Life Cycle Until Q1’ 38 (Based on Intel IOTG Roadmap)
- available for an additional 5 years support under SPS Process.
Specification
Specification | Details |
Processor Support | 14th/13th/12th Gen Intel® LGA 1700 Socket (TDP up to 65W) |
Chipset | Q670E (RPS183-Q670E) H610E (RPS183-H610E) |
Memory | 2x 262-pin SODIMM, up to 64GB, Dual Channel DDR5 4800MHz |
BIOS | AMI SPI 256Mbit |
Graphics Controller | Intel® UHD Graphics 700 series |
Display Outputs | 1 x DP++ (CPU), 1 x DP++ (MXM), 1 x USB Type-C (DP Alt-mode), 1 x eDP (MXM), 1 x Internal HDMI (MXM) |
Multiple Displays | 1 DP++ (CPU) + 1 DP++ (MXM) + 1 USB Type-C (DP Alt-mode) + 1 eDP (MXM) + 1 Internal HDMI (MXM) |
Expansion Slots | Q670E: 1 x PCIe Gen 3 x4, 1 x M.2 2280 M Key (PCIe Gen3x4, SATA3), 1 x M.2 2230 E Key (PCIe Gen3x, USB 2.0, Intel® CNVi), 1 x MXM Type-A/B/B+, 1 x M.2 2242/3042/3052 B Key (PCIe Gen3x1, USB 3.2 Gen2, USB 2.0) |
H610E: No PCIe Gen 3 x4 slot, USB 3.2 Gen1 instead of Gen2 for M.2 B Key | |
Audio Codec | Realtek ALC888S |
Ethernet Controller | Q670E: 1 x Intel® I226LM (vPro) (10/100/1000/2500Mbps), 1 x Intel® I226V (10/100/1000/2500Mbps) |
H610E: 1 x Intel® I219V (10/100/1000Mbps), 1 x Intel® I226V (10/100/1000/2500Mbps) | |
Rear I/O – USB | Q670E: 4 x USB 3.2 Gen2 or 3 x USB 3.2 Gen2 + 1 x USB Type-C |
H610E: 2 x USB 3.2 Gen2 + 2 x USB 2.0 or 2 x USB 3.2 Gen2 + 1 x USB Type-C | |
Rear I/O – Ethernet | 2 x 2.5Gbps RJ45 |
Rear I/O – Audio | 1 x Audio Jack (Line-out/Mic-in) (Audio header optional) |
Internal I/O – USB | 2 x USB 3.2 Gen1 Header, 1 x USB 2.0 Type A |
Internal I/O – SATA | 1 x SATA 3.0 |
DIO (Digital I/O) | 1 x 8-bit DIO (BOX HEADER 1*10P/1.00mm) |
I2C | 2 x I2C (BOX HEADER, 1*5P/1.0m) |
Fan Support | 1 x CPU, 2 x System (WAFER, 1*4P/1.25mm) |
Security | dTPM (default), fTPM (optional) |
Power Connector | 4-pin Terminal 19~24V DC-In |
Power Consumption | Idle: i9-13900E 65W with MXM A4500: 24V @ 2.03A (48.72W) |
Max: i9-13900E 65W with MXM A4500: 24V @ 11.66A (279.84W) | |
RTC Battery | CR2032 Coin Cell |
OS Support | Windows 10 IoT Enterprise 64-bit, Windows 11 LTSC, Linux Ubuntu 22.04 |
Operating Temperature | -5°C to 65°C (w/o MXM), defined by MXM spec (w/ MXM) |
Storage Temperature | -40°C to 85°C |
Humidity | Operating: 5% ~ 90% RH |
Storage: 5% ~ 90% RH | |
MTBF (Mean Time Between Failures) | 480,169 hrs @ 25°C, 281,641 hrs @ 45°C, 182,084 hrs @ 60°C |
Dimensions | 195mm (7.7″) x 170mm (6.7″) |
Certifications | CE, FCC, RoHS |
Packing List | 1 RPS183 motherboard, 1 Serial ATA data cable (500mm), 1 I/O shield (P/N: TBD), 3 M.2 screw/standoffs |
Country of Origin | Taiwan |
Ordering Information
Model Name | Part Number | Description |
RPS183-H610EDB | 770-RPS1831-000G | RPS183-H610EDB, 2 DDR5, Rear I/O (2 DP*++, 2 LAN, 2 USB 3.2 Gen2, 1 USB Type C), Internal I/O (1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*, 2 USB 3.2 Gen1, 1 USB 2.0 Type A), w/TPM, DC19~24V, -5 to 65°C (Standard rear I/O) |
RPS183-Q670EDB | 770-RPS1831-100G | RPS183-Q670EDB, 2 DDR5, Rear I/O (2 DP*++, 2 LAN, 3 USB 3.2 Gen2, 1 USB Type C), Internal I/O (1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*, 2 USB 3.2 Gen1, 1 USB 2.0 Type A), w/TPM, DC19~24V, -5 to 65°C (One extra USB 3.2 Gen2 port compared to H610) |
RPS183-H610EDB | 770-RPS1831-200G | RPS183-H610EDB, 2 DDR5, Rear I/O (2 DP*++, 2 LAN, 2 USB 3.2 Gen2, 2 USB 2.0 Type A), Internal I/O (1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*, 2 USB 3.2 Gen1, 1 USB 2.0 Type A), w/TPM, DC19~24V, -5 to 65°C (Replaces USB Type-C with an extra USB 2.0 Type A) |
RPS183-Q670EDB | 770-RPS1831-300G | RPS183-Q670EDB, 2 DDR5, Rear I/O (2 DP*++, 2 LAN, 4 USB 3.2 Gen2), Internal I/O (1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*, 2 USB 3.2 Gen1, 1 USB 2.0 Type A), w/TPM, DC19~24V, -5 to 65°C (More high-speed USB ports, no USB Type-C) |
BVM Customisation Service
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.
If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements. Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.
Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.
Design | Develop | Test | Manufacture
With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality
Here’s a selection of our design, manufacturing & associated services: –
Design to Order: OEM/ODM Embedded Product Design ServicesFor customers designing a brand-new product from scratch or working with an existing prototype.
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Build to Order: Embedded Computer Design and Customisation ServicesTake an existing system and we can:
Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs Embedded Software Services : Configuration, Integration and DeploymentPorting, Integration & Deployment
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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
![]() Testing |
![]() Materials Management |
![]() Logistics and Tracking |
![]() External Manufacturing |
• Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |
Click here to find out more.
Manufacturer : DFI
Motherboard
- Form Factor :
CPU
- Powered By :
- CPU Family : iCore
- CPU Generation : Alder Lake, Raptor Lake
- CPU Model : i3 Support, i5 Support, i7 Support, i9 Support
Memory
- Memory Installed :
- Memory Slots : 2
- Memory Type : 4800Mhz DDR5
I/O and Expansion
- Expansion Slots : M.2, MXM, PCIe, SATA
- LAN Ports : 2
- Serial Ports : 2
- USB 2 Ports :
- USB 3 Ports :
- USB 3.X / USB C / USB 4.0 Ports : 2, 3
- Video Output : DisplayPort, eDisplayPort, HDMI, USB-C
- Multi Display : Quad Display
Operating System
- OS :
Certifications
- Certifications :
Features
- 5G-4G-GPS :
- Artificial Intelligence Use :
- IP Rating :
- Rugged : Yes
- System Type :
- Wide Temp : Yes
Categories : Intel Alder Lake Mini-ITX, Intel Raptor Lake Mini-ITX, Mini-ITX Motherboards