DFI RPS183 14th Gen Raptor Lake MXM Mini-ITX Motherboard

  • Product Name: DFI RPS183
  • Motherboard Form Factor: Mini-ITX
  • CPU: Supports 14th/13th/12th Gen Intel Core Processors
  • RAM: 2x DDR5 SODIMM, up to 64GB
  • Expansion: 1x PCIe x4 (side), 1x M.2 M Key, 1x M.2 E Key, 1x M.2 B Key
  • Other Features: Supports MXM module, multiple display outputs, dual Intel 2.5GbE, USB 3.2, wide-range 19-24V power input, and long-term availability up to Q1 2038
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Description

DFI RPS183 Mini-ITX Motherboard – High-Performance Solution for Industrial Applications

The DFI RPS183 Mini-ITX motherboard is designed for high-performance industrial computing, supporting 14th, 13th, and 12th Gen Intel® Core™ processors. With DDR5 memory support up to 64GB, it delivers exceptional speed and efficiency for demanding applications.

This motherboard features versatile expansion options, including PCIe x4, M.2 M Key, M.2 E Key, and M.2 B Key, allowing seamless integration with various industrial components. Its MXM module support and multiple display outputs—DP++, HDMI, eDP, and USB Type-C (DP Alt-mode)—make it an excellent choice for embedded systems, digital signage, and AI-driven applications.

Designed for industrial reliability, the DFI RPS183 includes dual Intel® 2.5GbE LAN, multiple USB 3.2 ports, and a wide 19-24V power input. Built to last, it aligns with Intel’s 10-year CPU lifecycle roadmap, ensuring long-term availability and support until Q1 2038.

Key Features

  • 14th/13th/12th Gen Intel Core Processors
  • 2 DDR5 SODIMM up to 64GB
  • Multiple Display: 1 DP++(CPU), 1 DP++(MXM), 1 USB Type C(DP Alt-mode), 1 eDP(MXM), 1 internal HDMI(MXM)
  • Support MXM module, with 1 internal HDMI, 1 eDP and 1 external DP++
  • Multiple Expansion: 1 PCIe x4(side), 1 M.2 M key, 1 M.2 E Key, 1 M.2 B Key
  • Rich I/O: 2 Intel® 2.5GbE, up to 4 USB 3.2 Type A, up to 1 USB Type C
  • Wide Range power input 19~24V
  • Typically supports 10-Year CPU Life Cycle Until Q1’ 38 (Based on Intel IOTG Roadmap)
    • available for an additional 5 years support under SPS Process.

Specification

Specification Details
Processor Support 14th/13th/12th Gen Intel® LGA 1700 Socket (TDP up to 65W)
Chipset Q670E (RPS183-Q670E)
H610E (RPS183-H610E)
Memory 2x 262-pin SODIMM, up to 64GB, Dual Channel DDR5 4800MHz
BIOS AMI SPI 256Mbit
Graphics Controller Intel® UHD Graphics 700 series
Display Outputs 1 x DP++ (CPU), 1 x DP++ (MXM), 1 x USB Type-C (DP Alt-mode), 1 x eDP (MXM), 1 x Internal HDMI (MXM)
Multiple Displays 1 DP++ (CPU) + 1 DP++ (MXM) + 1 USB Type-C (DP Alt-mode) + 1 eDP (MXM) + 1 Internal HDMI (MXM)
Expansion Slots Q670E: 1 x PCIe Gen 3 x4, 1 x M.2 2280 M Key (PCIe Gen3x4, SATA3), 1 x M.2 2230 E Key (PCIe Gen3x, USB 2.0, Intel® CNVi), 1 x MXM Type-A/B/B+, 1 x M.2 2242/3042/3052 B Key (PCIe Gen3x1, USB 3.2 Gen2, USB 2.0)
H610E: No PCIe Gen 3 x4 slot, USB 3.2 Gen1 instead of Gen2 for M.2 B Key
Audio Codec Realtek ALC888S
Ethernet Controller Q670E: 1 x Intel® I226LM (vPro) (10/100/1000/2500Mbps), 1 x Intel® I226V (10/100/1000/2500Mbps)
H610E: 1 x Intel® I219V (10/100/1000Mbps), 1 x Intel® I226V (10/100/1000/2500Mbps)
Rear I/O – USB Q670E: 4 x USB 3.2 Gen2 or 3 x USB 3.2 Gen2 + 1 x USB Type-C
H610E: 2 x USB 3.2 Gen2 + 2 x USB 2.0 or 2 x USB 3.2 Gen2 + 1 x USB Type-C
Rear I/O – Ethernet 2 x 2.5Gbps RJ45
Rear I/O – Audio 1 x Audio Jack (Line-out/Mic-in) (Audio header optional)
Internal I/O – USB 2 x USB 3.2 Gen1 Header, 1 x USB 2.0 Type A
Internal I/O – SATA 1 x SATA 3.0
DIO (Digital I/O) 1 x 8-bit DIO (BOX HEADER 1*10P/1.00mm)
I2C 2 x I2C (BOX HEADER, 1*5P/1.0m)
Fan Support 1 x CPU, 2 x System (WAFER, 1*4P/1.25mm)
Security dTPM (default), fTPM (optional)
Power Connector 4-pin Terminal 19~24V DC-In
Power Consumption Idle: i9-13900E 65W with MXM A4500: 24V @ 2.03A (48.72W)
Max: i9-13900E 65W with MXM A4500: 24V @ 11.66A (279.84W)
RTC Battery CR2032 Coin Cell
OS Support Windows 10 IoT Enterprise 64-bit, Windows 11 LTSC, Linux Ubuntu 22.04
Operating Temperature -5°C to 65°C (w/o MXM), defined by MXM spec (w/ MXM)
Storage Temperature -40°C to 85°C
Humidity Operating: 5% ~ 90% RH
Storage: 5% ~ 90% RH
MTBF (Mean Time Between Failures) 480,169 hrs @ 25°C, 281,641 hrs @ 45°C, 182,084 hrs @ 60°C
Dimensions 195mm (7.7″) x 170mm (6.7″)
Certifications CE, FCC, RoHS
Packing List 1 RPS183 motherboard, 1 Serial ATA data cable (500mm), 1 I/O shield (P/N: TBD), 3 M.2 screw/standoffs
Country of Origin Taiwan

Ordering Information

Model Name Part Number Description
RPS183-H610EDB 770-RPS1831-000G RPS183-H610EDB, 2 DDR5, Rear I/O (2 DP*++, 2 LAN, 2 USB 3.2 Gen2, 1 USB Type C), Internal I/O (1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*, 2 USB 3.2 Gen1, 1 USB 2.0 Type A), w/TPM, DC19~24V, -5 to 65°C (Standard rear I/O)
RPS183-Q670EDB 770-RPS1831-100G RPS183-Q670EDB, 2 DDR5, Rear I/O (2 DP*++, 2 LAN, 3 USB 3.2 Gen2, 1 USB Type C), Internal I/O (1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*, 2 USB 3.2 Gen1, 1 USB 2.0 Type A), w/TPM, DC19~24V, -5 to 65°C (One extra USB 3.2 Gen2 port compared to H610)
RPS183-H610EDB 770-RPS1831-200G RPS183-H610EDB, 2 DDR5, Rear I/O (2 DP*++, 2 LAN, 2 USB 3.2 Gen2, 2 USB 2.0 Type A), Internal I/O (1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*, 2 USB 3.2 Gen1, 1 USB 2.0 Type A), w/TPM, DC19~24V, -5 to 65°C (Replaces USB Type-C with an extra USB 2.0 Type A)
RPS183-Q670EDB 770-RPS1831-300G RPS183-Q670EDB, 2 DDR5, Rear I/O (2 DP*++, 2 LAN, 4 USB 3.2 Gen2), Internal I/O (1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*, 2 USB 3.2 Gen1, 1 USB 2.0 Type A), w/TPM, DC19~24V, -5 to 65°C (More high-speed USB ports, no USB Type-C)

BVM Customisation Service

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.

 

If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements. Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.

Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.

 

Design | Develop | Test | Manufacture

With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.

Build to Order Banner

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.

Manufacturer : DFI

Motherboard

  • Form Factor :

CPU

  • Powered By :
  • CPU Family : iCore
  • CPU Generation : Alder Lake, Raptor Lake
  • CPU Model : i3 Support, i5 Support, i7 Support, i9 Support

Memory

  • Memory Installed :
  • Memory Slots : 2
  • Memory Type : 4800Mhz DDR5

I/O and Expansion

  • Expansion Slots : M.2, MXM, PCIe, SATA
  • LAN Ports : 2
  • Serial Ports : 2
  • USB 2 Ports :
  • USB 3 Ports :
  • USB 3.X / USB C / USB 4.0 Ports : 2, 3
  • Video Output : DisplayPort, eDisplayPort, HDMI, USB-C
  • Multi Display : Quad Display

Operating System

  • OS :

Certifications

  • Certifications :

Features

  • 5G-4G-GPS :
  • Artificial Intelligence Use :
  • IP Rating :
  • Rugged : Yes
  • System Type :
  • Wide Temp : Yes

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