Description
DFI RPS183 Mini-ITX Motherboard – High-Performance Solution for Industrial Applications
The DFI RPS183 Mini-ITX motherboard is designed for high-performance industrial computing, supporting 14th, 13th, and 12th Gen Intel® Core™ processors. With DDR5 memory support up to 64GB, it delivers exceptional speed and efficiency for demanding applications.
This motherboard features versatile expansion options, including PCIe x4, M.2 M Key, M.2 E Key, and M.2 B Key, allowing seamless integration with various industrial components. Its MXM module support and multiple display outputs—DP++, HDMI, eDP, and USB Type-C (DP Alt-mode)—make it an excellent choice for embedded systems, digital signage, and AI-driven applications.
Designed for industrial reliability, the DFI RPS183 includes dual Intel® 2.5GbE LAN, multiple USB 3.2 ports, and a wide 19-24V power input. Built to last, it aligns with Intel’s 10-year CPU lifecycle roadmap, ensuring long-term availability and support until Q1 2038.
Key Features
- 14th/13th/12th Gen Intel Core Processors
- 2 DDR5 SODIMM up to 64GB
- Multiple Display: 1 DP++(CPU), 1 DP++(MXM), 1 USB Type C(DP Alt-mode), 1 eDP(MXM), 1 internal HDMI(MXM)
- Support MXM module, with 1 internal HDMI, 1 eDP and 1 external DP++
- Multiple Expansion: 1 PCIe x4(side), 1 M.2 M key, 1 M.2 E Key, 1 M.2 B Key
- Rich I/O: 2 Intel® 2.5GbE, up to 4 USB 3.2 Type A, up to 1 USB Type C
- Wide Range power input 19~24V
- Typically supports 10-Year CPU Life Cycle Until Q1’ 38 (Based on Intel IOTG Roadmap)
- available for an additional 5 years support under SPS Process.
Specification
| Specification | Details |
| Processor Support | 14th/13th/12th Gen Intel® LGA 1700 Socket (TDP up to 65W) |
| Chipset | Q670E (RPS183-Q670E) H610E (RPS183-H610E) |
| Memory | 2x 262-pin SODIMM, up to 64GB, Dual Channel DDR5 4800MHz |
| BIOS | AMI SPI 256Mbit |
| Graphics Controller | Intel® UHD Graphics 700 series |
| Display Outputs | 1 x DP++ (CPU), 1 x DP++ (MXM), 1 x USB Type-C (DP Alt-mode), 1 x eDP (MXM), 1 x Internal HDMI (MXM) |
| Multiple Displays | 1 DP++ (CPU) + 1 DP++ (MXM) + 1 USB Type-C (DP Alt-mode) + 1 eDP (MXM) + 1 Internal HDMI (MXM) |
| Expansion Slots | Q670E: 1 x PCIe Gen 3 x4, 1 x M.2 2280 M Key (PCIe Gen3x4, SATA3), 1 x M.2 2230 E Key (PCIe Gen3x, USB 2.0, Intel® CNVi), 1 x MXM Type-A/B/B+, 1 x M.2 2242/3042/3052 B Key (PCIe Gen3x1, USB 3.2 Gen2, USB 2.0) |
| H610E: No PCIe Gen 3 x4 slot, USB 3.2 Gen1 instead of Gen2 for M.2 B Key | |
| Audio Codec | Realtek ALC888S |
| Ethernet Controller | Q670E: 1 x Intel® I226LM (vPro) (10/100/1000/2500Mbps), 1 x Intel® I226V (10/100/1000/2500Mbps) |
| H610E: 1 x Intel® I219V (10/100/1000Mbps), 1 x Intel® I226V (10/100/1000/2500Mbps) | |
| Rear I/O – USB | Q670E: 4 x USB 3.2 Gen2 or 3 x USB 3.2 Gen2 + 1 x USB Type-C |
| H610E: 2 x USB 3.2 Gen2 + 2 x USB 2.0 or 2 x USB 3.2 Gen2 + 1 x USB Type-C | |
| Rear I/O – Ethernet | 2 x 2.5Gbps RJ45 |
| Rear I/O – Audio | 1 x Audio Jack (Line-out/Mic-in) (Audio header optional) |
| Internal I/O – USB | 2 x USB 3.2 Gen1 Header, 1 x USB 2.0 Type A |
| Internal I/O – SATA | 1 x SATA 3.0 |
| DIO (Digital I/O) | 1 x 8-bit DIO (BOX HEADER 1*10P/1.00mm) |
| I2C | 2 x I2C (BOX HEADER, 1*5P/1.0m) |
| Fan Support | 1 x CPU, 2 x System (WAFER, 1*4P/1.25mm) |
| Security | dTPM (default), fTPM (optional) |
| Power Connector | 4-pin Terminal 19~24V DC-In |
| Power Consumption | Idle: i9-13900E 65W with MXM A4500: 24V @ 2.03A (48.72W) |
| Max: i9-13900E 65W with MXM A4500: 24V @ 11.66A (279.84W) | |
| RTC Battery | CR2032 Coin Cell |
| OS Support | Windows 10 IoT Enterprise 64-bit, Windows 11 LTSC, Linux Ubuntu 22.04 |
| Operating Temperature | -5°C to 65°C (w/o MXM), defined by MXM spec (w/ MXM) |
| Storage Temperature | -40°C to 85°C |
| Humidity | Operating: 5% ~ 90% RH |
| Storage: 5% ~ 90% RH | |
| MTBF (Mean Time Between Failures) | 480,169 hrs @ 25°C, 281,641 hrs @ 45°C, 182,084 hrs @ 60°C |
| Dimensions | 195mm (7.7″) x 170mm (6.7″) |
| Certifications | CE, FCC, RoHS |
| Packing List | 1 RPS183 motherboard, 1 Serial ATA data cable (500mm), 1 I/O shield (P/N: TBD), 3 M.2 screw/standoffs |
| Country of Origin | Taiwan |
Ordering Information
| Model Name | Part Number | Description |
| RPS183-H610EDB | 770-RPS1831-000G | RPS183-H610EDB, 2 DDR5, Rear I/O (2 DP*++, 2 LAN, 2 USB 3.2 Gen2, 1 USB Type C), Internal I/O (1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*, 2 USB 3.2 Gen1, 1 USB 2.0 Type A), w/TPM, DC19~24V, -5 to 65°C (Standard rear I/O) |
| RPS183-Q670EDB | 770-RPS1831-100G | RPS183-Q670EDB, 2 DDR5, Rear I/O (2 DP*++, 2 LAN, 3 USB 3.2 Gen2, 1 USB Type C), Internal I/O (1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*, 2 USB 3.2 Gen1, 1 USB 2.0 Type A), w/TPM, DC19~24V, -5 to 65°C (One extra USB 3.2 Gen2 port compared to H610) |
| RPS183-H610EDB | 770-RPS1831-200G | RPS183-H610EDB, 2 DDR5, Rear I/O (2 DP*++, 2 LAN, 2 USB 3.2 Gen2, 2 USB 2.0 Type A), Internal I/O (1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*, 2 USB 3.2 Gen1, 1 USB 2.0 Type A), w/TPM, DC19~24V, -5 to 65°C (Replaces USB Type-C with an extra USB 2.0 Type A) |
| RPS183-Q670EDB | 770-RPS1831-300G | RPS183-Q670EDB, 2 DDR5, Rear I/O (2 DP*++, 2 LAN, 4 USB 3.2 Gen2), Internal I/O (1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*, 2 USB 3.2 Gen1, 1 USB 2.0 Type A), w/TPM, DC19~24V, -5 to 65°C (More high-speed USB ports, no USB Type-C) |
