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LEX PALM-3A100DW-V AMD Ryzen Embedded Computer
- Product Name: Lex PALM-3A100DW-V
- System Type: AMD Ryzen Embedded Computer
- CPU: AMD Ryzen Embedded V1000 Series SoC
- RAM: 2 x DDR4 2400 MHz SODIMM, Max. 32GB
- Expansion: 2 x HDMI, 2 x DP, 3 x GbE, 4 x USB, 8DI / 8DO, 2 x COM, 1 x Mini PCIe, 2 x SIM, 2 x M.2
- Other features: With Independent Four 4K Display
SKU: PALM-3A100DW-V
Categories: ALL INDUSTRIAL AND EMBEDDED COMPUTERS, AMD Powered Industrial PCs, Fanless Industrial Mini PCs, Rugged Industrial Mini PCs, Rugged PCs
Tags: IoT, Multi Display - Dual, Multi Display - Quad, NVMe, OS: Windows, PoE, Powered by AMD, Rugged, Ryzen Embedded, Wide Temp
Brand: LEX Systems
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Description
- AMD Ryzen Embedded V1000 Series SoC With Independent Four 4K Display
- 2 x HDMI, 2 x DP, 3 x GbE, 4 x USB, 8DI / 8DO
- 2 x COM, 1 x Mini PCIe, 2 x SIM, 2 x M.2
PALM-3A100DW-V Specification
| MODEL | PALM-3A100DW-V | |
|---|---|---|
| Motherboard | 3A100DW-V | |
| System Dimension(WxDxH) | 180W x 150D x 70H mm | |
| Weight(Incl.M/B) | 1.35 kg | |
| Mounting | Wall Mount * | |
| CPU | AMD® Ryzen™ Embedded V1000 Series SoC V1807B 3.35 GHz up to 3.8 GHz (Quad Core), TDP 35-54 Watt V1605B 2.0 GHz up to 3.6 GHz (Quad Core), TDP12-25 Watt |
|
| Chipset | AMD® Ryzen™ Embedded V1000 Series SoC | |
| Memory | 2 x DDR4 2400 MHz SODIMM, Max. 32GB (V1878B CPU supports single bank 3200 MHz memory) |
|
| Storage | 2 x SATA ports 3.0 Data transfer rates up to 6.0 Gb/s (600 MB/s), optional to 2 x mSATA | |
| Expansion slots | 1 x M.2 M Key, Type 2280 (PCIe x 4), Support NVMe 1 x M.2 B Key, Type 3042 (PCIe / mSATA / USB) 1 x mini card socket (PCIe / mSATA / USB) 1 x Nano SIM, 1 x SIM |
|
| I/O ports | Network | 3 x Intel GbE |
| USB | 2 x USB 3.0, 2 x USB 2.0 | |
| Serial ports | 2 x RS232 / 422 / 485 | |
| Display | 2 x DP, 2 x HDMI | |
| Audio | Line-out, Mic-in | |
| GPIO &SIM | DI / DO (Option) | |
| Optional Modules & Accessory |
GPS, Bluetooth, PoE, WiFi, 4G LTE, Isolated COM, battery UPS, Video Input, *SATA Kit, Wall Mount Kit | |
| Power | DC input : +12V~24V AC input : External adapter 100 / 240V |
|
| Operating Temp. (100 % CPU usage) |
-20°C to +60°C with mSATA / SSD 0°C to +50°C with HDD |
|
| Storage Temp. | -20°C to +70°C | |
| Relative Humidity | 95% @ 40°C, non-condensing | |
| Certification | CE / FCC class A | |
| OS Support | Windows® 10 IOT (64bit), Ubuntu 18.04.2 above, Fedora 29 above | |
BVM Customisation Service
Design | Develop | Test | Manufacture
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.
Here’s a selection of our design, manufacturing & associated services: –
Design to Order: OEM/ODM Embedded Product Design ServicesFor customers designing a new product or working with an existing prototype.
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Build to Order: Computer Design and Customisation ServicesTake an existing system and we can:
Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs Embedded Software: Configuration, Integration and DeploymentPorting, Integration & Deployment
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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
![]() Testing |
![]() Materials Management |
![]() Logistics and Tracking |
![]() External Manufacturing |
| • Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |
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