LEX PALM-3A100DW-V AMD Ryzen Embedded Computer

  • Product Name: Lex PALM-3A100DW-V
  • System Type: AMD Ryzen Embedded Computer
  • CPU: AMD Ryzen Embedded V1000 Series SoC
  • RAM: 2 x DDR4 2400 MHz SODIMM, Max. 32GB
  • Expansion: 2 x HDMI, 2 x DP, 3 x GbE, 4 x USB, 8DI / 8DO, 2 x COM, 1 x Mini PCIe, 2 x SIM, 2 x M.2
  • Other features: With Independent Four 4K Display
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Description

  • AMD Ryzen Embedded V1000 Series SoC With Independent Four 4K Display
  • 2 x HDMI, 2 x DP, 3 x GbE, 4 x USB, 8DI / 8DO
  • 2 x COM, 1 x Mini PCIe, 2 x SIM, 2 x M.2

PALM-3A100DW-V Specification

MODEL PALM-3A100DW-V
Motherboard 3A100DW-V
System Dimension(WxDxH) 180W x 150D x 70H mm
Weight(Incl.M/B) 1.35 kg
Mounting Wall Mount *
CPU AMD® Ryzen™ Embedded V1000 Series SoC
V1807B 3.35 GHz up to 3.8 GHz (Quad Core), TDP 35-54 Watt
V1605B 2.0 GHz up to 3.6 GHz (Quad Core), TDP12-25 Watt
Chipset AMD® Ryzen™ Embedded V1000 Series SoC
Memory 2 x DDR4 2400 MHz SODIMM, Max. 32GB
(V1878B CPU supports single bank 3200 MHz memory)
Storage 2 x SATA ports 3.0 Data transfer rates up to 6.0 Gb/s (600 MB/s), optional to 2 x mSATA
Expansion slots 1 x M.2 M Key, Type 2280 (PCIe x 4), Support NVMe
1 x M.2 B Key, Type 3042 (PCIe / mSATA / USB)
1 x mini card socket (PCIe / mSATA / USB)
1 x Nano SIM, 1 x SIM
I/O ports Network 3 x Intel GbE
USB 2 x USB 3.0, 2 x USB 2.0
Serial ports 2 x RS232 / 422 / 485
Display 2 x DP, 2 x HDMI
Audio Line-out, Mic-in
GPIO &SIM DI / DO (Option)
Optional Modules
& Accessory
GPS, Bluetooth, PoE, WiFi, 4G LTE, Isolated COM, battery UPS, Video Input, *SATA Kit, Wall Mount Kit
Power DC input : +12V~24V
AC input : External adapter 100 / 240V
Operating Temp.
(100 % CPU usage)
-20°C to +60°C with mSATA / SSD
0°C to +50°C with HDD
Storage Temp. -20°C to +70°C
Relative Humidity 95% @ 40°C, non-condensing
Certification CE / FCC class A
OS Support Windows® 10 IOT (64bit), Ubuntu 18.04.2 above, Fedora 29 above

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

Build to Order Banner

Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.