LEX 3I110HW / 3I110BW 11th Gen Tiger Lake i7/i5/i3 3.5″ Embedded SBC

  • Product Name: Lex 3I110HW / 3I110BW
  • Motherboard Form Factor: 3.5″ SBC
  • CPU: 11th Gen Intel Tiger Lake-UP3, i7 / i5 / i3 / Celeron
  • RAM: 2 x DDR4 SODIMM (Max. 64GB)
  • Expansion: 1 x M.2 B Key, 1 x M.2 M Key, 1 x Mini PCIe, 1 x SIM
  • Other features: Multiple Independent display: VGA, HDMI (or DP), eDP or LVDS, 3 x Intel GbE LAN, 6 x USB 2.0, 4 x COM, 4DI / 4DO, TPM 2.0, Battery Charger Function (3I110BW), OEM Option: DP (Type C), 1 x USB 3.0 (type C)

Description

3I110HW BW 01 3I110HW BW 02
  • 11th Gen Intel Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU
  • 2 x DDR4 SODIMM (Max. 64GB) Multiple Independent display: VGA, HDMI (or DP), eDP or LVDS
  • 3 x Intel GbE LAN, 6 x USB 2.0
  • 4 x COM, 4DI / 4DO, 1 x Mini PCIe, 1 x SIM
  • 1 x M.2 B Key, 1 x M.2 M Key
  • TPM 2.0
  • Battery Charger Function (3I110BW)
  • OEM Option: DP (Type C), 1 x USB 3.0 (type C)

3I110HW Specification

MODEL 3I110HW / 3I110BW
CPU Type Intel® Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU
MB Chipset Intel® Tiger Lake-UP3 SoC
Graphics Intel® Iris® Xe Graphics and media encode / decode engine
Intel® UHD Graphics, Support DirectX 12 & OpenGL 4.5
System Memory 2 x DDR4 SODIMM, Max 64GB
Storage 2 x SATA ports 3.0 Data transfer rates up to 6.0 Gb/s (600 MB/s)
1 x M.2 B key Type 3042 (PCIe x2 / mSATA / USB 3.0 / 2.0)-share SATA2
1 x M.2 M key Type 2280 (PCIe x4), Support NVMe
BIOS AMI UEFI BIOS
Display 1 x VGA, 1 x HDMI (or DP), eDP or Dual Channel, 48 bits LVDS
Touch USB touch screen controller
TPM TPM 2.0 (Firmware) ; OEM Optional to Hardware TPM
LAN 1 x Intel GbE I219LM (internal)
2 x Intel GbE I210IT (internal)
Audio (OEM) High Definition Audio Specification, Support Line-out / Mic-in / Line-in
Two channel Class D Audio Amplifier
Expansion Interface 1 x Full size Mini PCIe (PCIe / USB 2.0)
1 x M.2 B key Type 3042 (PCIe x2 / mSATA / USB 3.0 / 2.0)
1 x M.2 M key Type 2280 (PCIe x4), Support NVMe
1 x SIM
Expansion Module Mini Card : GPS, 3G / 4G, WI-FI, 2 / 4 x LAN, 4 x COM, CANBus, SDI / AHD Video
By Cable : Bluetooth, Digital I/O, 2 / 4 PoE, 4 x USB mini card
USB 6 x USB 2.0 (internal)
Serial IO 4 x RS232 / 422 / 485 (internal)
GPIO Hardware digital Input & Output, 4 x DI / 4 x DO
WDT Hardware Watch Dog Timer, 0~255 sec programmable
Power Input Wide Range +9~36V ; Battery Charger function (3I110BW)
Dimension 3.5″ (146 x 115 mm)
Operation Temperature
(100 % CPU Usage)
-40°C~+70°C (Core i GRE series CPU)
-20°C~+70°C (Core i G7E / G7 series CPU)
Operation Humidity 5~95%, non-condensing
Chassis (OEM I/O Expansion by request) Waterproof System ; Waterproof PPC

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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