Description
The Lex 3I110BW is a high-performance 3.5″ embedded single board computer built for demanding industrial and edge computing applications. Powered by 11th Gen Intel® Tiger Lake-UP3 processors, including Core™ i7, i5, i3, and Celeron options, it delivers strong compute and graphics performance with excellent efficiency.
Supporting up to 64GB of DDR4 memory across two SODIMM slots, the platform offers extensive expansion via M.2 B Key, M.2 M Key, Mini PCIe, and SIM slots for wireless connectivity. It features rich I/O including multiple independent display outputs (VGA, HDMI/DP, eDP or LVDS), three Intel Gigabit LAN ports, USB, COM, and digital I/O for flexible system integration. With TPM 2.0 security and optional features such as USB Type-C and battery charging support (3I110BW), the Lex 3I110HW / 3I110BW is ideal for advanced industrial automation, intelligent edge systems, and mission-critical embedded deployments.
Key Features
- 11th Gen Intel Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU
- 2 x DDR4 SODIMM (Max. 64GB) Multiple Independent display: VGA, HDMI (or DP), eDP or LVDS
- 3 x Intel GbE LAN, 6 x USB 2.0
- 4 x COM, 4DI / 4DO, 1 x Mini PCIe, 1 x SIM
- 1 x M.2 B Key, 1 x M.2 M Key
- TPM 2.0
- Battery Charger Function (3I110BW)
- OEM Option: DP (Type C), 1 x USB 3.0 (type C)
3I110HW Specification
| MODEL | 3I110HW / 3I110BW |
|---|---|
| CPU Type | Intel® Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU |
| MB Chipset | Intel® Tiger Lake-UP3 SoC |
| Graphics | Intel® Iris® Xe Graphics and media encode / decode engine Intel® UHD Graphics, Support DirectX 12 & OpenGL 4.5 |
| System Memory | 2 x DDR4 SODIMM, Max 64GB |
| Storage | 2 x SATA ports 3.0 Data transfer rates up to 6.0 Gb/s (600 MB/s) 1 x M.2 B key Type 3042 (PCIe x2 / mSATA / USB 3.0 / 2.0)-share SATA2 1 x M.2 M key Type 2280 (PCIe x4), Support NVMe |
| BIOS | AMI UEFI BIOS |
| Display | 1 x VGA, 1 x HDMI (or DP), eDP or Dual Channel, 48 bits LVDS |
| Touch | USB touch screen controller |
| TPM | TPM 2.0 (Firmware) ; OEM Optional to Hardware TPM |
| LAN | 1 x Intel GbE I219LM (internal) 2 x Intel GbE I210IT (internal) |
| Audio (OEM) | High Definition Audio Specification, Support Line-out / Mic-in / Line-in Two channel Class D Audio Amplifier |
| Expansion Interface | 1 x Full size Mini PCIe (PCIe / USB 2.0) 1 x M.2 B key Type 3042 (PCIe x2 / mSATA / USB 3.0 / 2.0) 1 x M.2 M key Type 2280 (PCIe x4), Support NVMe 1 x SIM |
| Expansion Module | Mini Card : GPS, 3G / 4G, WI-FI, 2 / 4 x LAN, 4 x COM, CANBus, SDI / AHD Video By Cable : Bluetooth, Digital I/O, 2 / 4 PoE, 4 x USB mini card |
| USB | 6 x USB 2.0 (internal) |
| Serial IO | 4 x RS232 / 422 / 485 (internal) |
| GPIO | Hardware digital Input & Output, 4 x DI / 4 x DO |
| WDT | Hardware Watch Dog Timer, 0~255 sec programmable |
| Power Input | Wide Range +9~36V ; Battery Charger function (3I110BW) |
| Dimension | 3.5″ (146 x 115 mm) |
| Operation Temperature (100 % CPU Usage) |
-40°C~+70°C (Core i GRE series CPU) -20°C~+70°C (Core i G7E / G7 series CPU) |
| Operation Humidity | 5~95%, non-condensing |
| Chassis (OEM I/O Expansion by request) | Waterproof System ; Waterproof PPC |
Lex 11th Gen Tiger Lake SBC’s
| Model | Form Factor | CPU | RAM | LAN | Display | Key Features |
|---|---|---|---|---|---|---|
| 3I110HW | 3.5″ | Tiger Lake-UP3 | Up to 64GB | 3× GbE | VGA / HDMI / DP / Type-C DP / eDP-LVDS | TPM 2.0 (opt), rich multi-display, Mini PCIe, M.2, SIM |
| 3I110BW | 3.5″ | Tiger Lake-UP3 | Up to 64GB | 3× GbE | VGA / HDMI / DP / Type-C DP / eDP-LVDS | Battery charger function, TPM 2.0 (opt), expansion heavy |
| 2I110D | 2.5″ | Tiger Lake-UP3 | Up to 32GB | 4× GbE | HDMI / eDP | Compact design, TPM 2.0, rich I/O |
| 2I110AW | 2.5″ | Tiger Lake-UP3 | Up to 32GB | 3× 2.5GbE | 4× HDMI | High multi-display output, TPM 2.0 |
