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ASRock Industrial iEP-9040E 15th Gen (Bartlett Lake) Compact AIoT PC

  • Product Name: ASRock Industrial iEP-9040E
  • System Type: AIoT PC
  • CPU: Intel 15th Gen Core Processors with R680E Chipset
  • RAM: 2 x 262-pin DDR5 SO-DIMM up to 96GB (48GB per DIMM)
  • Expansion: 2 x M.2 Key M, 2 x M.2 Key B, 1 x M.2 Key E
  • Other features: 6 x USB 3.2 Gen2x1, 6 x COM, 4 x SATA3, 8 x DI, 8 x DO; 5 x Intel 2.5G LAN (2 support PoE, 1 supports vPro); 1 x Displayport, 1 x HDMI 2.0b, 1 x VGA
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Description

iEP(F) 9040S Series 1200x600

Introducing the ASRock Industrial iEP-9040E Compact and Rugged Edge AIoT Platform (Expendable AIoT PC here) engineered to meet the demanding needs of modern industries. Powered by Intel’s latest 15 Gen Core Processors along with Intel R680E Chipset and DDR5 RAM, this platform offers unmatched performance and reliability.

Key Features

  • Intel 15th Gen Core Bartlett Lake Processors with R680E Chipset
  • 2 x 262-pin DDR5 SO-DIMM up to 96GB (48GB per DIMM)
  • 2 x M.2 Key M, 2 x M.2 Key B, 1 x M.2 Key E
  • 6 x USB 3.2 Gen2x1, 6 x COM, Up to 4 x SATA3 (Default 1 piece), 8 x DI, 8 x DO
  • 5 x Intel 2.5G LAN (2 support PoE, LAN 1 supports vPro)
  • 1 x Displayport, 1 x HDMI 2.0b, 1 x VGA
  • Support Wireless Time-Sensitive Networking (WTSN)

Specification

Processor System  
  ASRock Industrial iEP-9040E 15th Gen Bartlett Lake R680E Compact AIoT PC
CPU Intel® 15th Gen Core™ Processors
Chipset  
Socket LGA 1700
Memory  
   
Technology Dual Channel DDR5 5600MHz
(ECC memory supported by R680E + Selected CPU)
Capacity 96 GB (48 GB per DIMM)
Socket 2 x 262-pin SO-DIMM
Graphics  
   
Controller Intel® UHD Graphics
DisplayPort DisplayPort 1.4a , DP++
Max resolution up to 4096×2160@60Hz
HDMI HDMI 2.0b
Max resolution up to 4096×2160@60Hz
VGA Max resolution up to 1920×1200@60Hz
Expansion Slot  
   
RF& Antenna 8 x SMA connector hole reserved
M.2 1 x M.2 (Key E, 2230) with CNVI/PCIe Gen3 x1
and USB2.0 for Wi-Fi/BT module
1 x M.2 (Key B1, 2280/3042/3052)
with PCIe Gen3 x1 / USB3.2 Gen1x1 and USB2.0 for 4G / 5G
1 x M.2 (Key B2, 3042/3052)
with PCIe Gen3 x1 / USB3.2 Gen1x1 and USB2.0 for 4G / 5G
SIM Socket 2 x Nano SIM Card slot
(2 connected to M.2 Key B)
Audio  
   
Interface Realtek ALC897, High Definition Audio.
Ethernet  
   
Controller/ Speed 3 x Intel® i226IT (1 vPro Support)
2 x Intel® i226IT (PoE Support, each port supports IEEE 802.3AT PoE,
PoE output max.30W/single port or 30W/two ports shared)
Connector 5 x RJ45
Rear I/O  
   
DisplayPort 1
HDMI 1
VGA 1
Ethernet 5 x Intel 2.5G LAN
USB 6 x USB 3.2 Gen2x1, 1 x USB2.0 internal connector w/ lock function
Audio 1 x Mic-in, 1 x Line-out
COM 4 x RS232/422/485 (COM1, COM2- optional Card w/ Isolation
Protection, COM5- Isolation Protection, COM6)
2 x RS232 (COM3, COM4)
DIO 8DIs/8DOs
Storage  
   
M.2 1 x M.2 (Key M1, 2242/2260/2280) with Gen4 x4 for NVMe SSD
1 x M.2 (Key M2, 2242/2280/22110/25110) with Gen3 x4 for NVMe SSD
SATA 4 x SATA3 (6Gb/s), support RAID 0/1/5/10
4 x 2.5″ HDD/SSD Tray
CFast 1 x Type II socket (Shared with SATA3)
Watchdog Timer  
   
Output From Super I/O to drag RESETCON#
Interval 256 Segments, 0, 1, 2, …255sec
Power Requirements  
   
Input PWR 9V~36V VDC with Ignition control and remote power on/off switch.
80V Surge Protection, OVP, UVP, OCP and reverse protection
Ignition Power Input w/ 13-mode condition
Environment  
   
Operating Temp 35W CPU: -40°C~70°C ( -40°F~158°F)
46W~65W CPU: -40°C~50°C ( -40°F~122°F)
(w/ air flow 0.5~0.8 m/s)
Storage Temp -40°C~85°C ( -40°F~185°F)
Humidity ~95% @ 40°C (non-condensing)
Shock Operating: 50G, half sine 11ms duration with SSD
Vibration Operating: 5 Grms, 5-500 Hz, 3 axes with SSD
ESD Contact +/-4kV, Air +/-8kV
EMC EN61000-6-4/-2, CE & FCC Class A
Safety LVD
Mechanical  
   
Construction Aluminium heatsink + Metal chassis
Mounting Desk Mount
Dimensions 201.7mm (W) x 244.8mm (D) x 109.5mm (H) (7.94″ x 9.64″ x 4.31″)
Net Weight 6.5kg
Others  
   
OS Support Windows 10 & Linux
TPM TPM 2.0
Real-Time Enablement TSN, TCC support under YOCTO

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

Build to Order Banner

Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing
Lifecycle

Materials Management
Logistics

Logistics and Tracking
Manufacturing

External Manufacturing
• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test		 • Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System		 • Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels		 • Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.

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