DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System

Product Name: DFI EC500-CS
System Type: Fanless Embedded System
CPU: 8th/9th Gen Intel Core
RAM: Supports DDR4 SODIMM up to 64GB
Expansion: 3 M.2 slots support NVMe
Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)

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SKU: EC500-CS Categories: ALL INDUSTRIAL AND EMBEDDED COMPUTERS, Rugged Industrial Mini PCs, Rugged PCs Tags: 5G, 9~36V, Fanless, GPIO / DIO, IoT, Modular Design, Multi Display - Dual, Multi Display - Triple, NVMe, OS: Linux, OS: Windows, Powered by Intel, RAID, Rugged, Wide Temp Brand: DFI

Description

Modular-Designed Rugged System with 5G – A Smart Choice for Today’s Smart Factory

Features

8th/9th Generation Intel® Core™ with Intel® Q370/H310
Supports DDR4 SODIMM up to 64GB
Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only)
3 M.2 slots support NVMe
Support 5G Communication
Operating Temperature: -20 to 70°C
15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)

Specification

System

Processor

8th/9th Generation Intel® Core™ Processors, LGA 1151
Intel® Core™ i7-8700T Processor, Hexa Core, 12M Cache, 2.4GHz (4GHz), 35W
Intel® Core™ i5-8500T Processor, Hexa Core, 9M Cache, 2.1GHz (3.5GHz), 35W
Intel® Core™ i3-8100T Processor, Quad Core, 6M Cache, 3.1GHz, 35W
Intel® Core™ i7-9700TE , Octa Cores, 12M Cache, up to 3.8 GHz, 35W
Intel® Core™ i5-9500TE , Hexa Cores, 9M Cache, up to 3.6 GHz), 35W
Intel® Core™ i3-9100TE, Quad Cores, 6M Cache, up to 3.2 GHz, 35W
Intel® Pentium® Processor G5400T, Dual Core, 4M Cache, 3.1GHz, 35W
Intel® Celeron® Processor G4900T, Dual Core, 2M Cache, 3.1GHz, 35W

Chipset

Intel® Q370/C246 Chipset
Intel® H310 Chipset

Memory

Two 260-pin SODIMM up to 64GB
Dual Channel DDR4 2400/2666MHz

BIOS

Insyde SPI 128Mbit

Graphics

Controller

Intel® HD Graphics

Feature

OpenGL up to 5.0, DirectX 11, OpenCL 2.1
HW Decode: HEVC/H.265, H.264, M/JPEG, MPEG2, VC1/WMV9, VP8 (8-bit), VP9 (10-bit)
HW Encode: HEVC/H.265, M/JPEG, MPEG2, VP8

Display

Q370/C246:
1 x VGA
2 x HDMI/DP++ (auto detection)
H310:
1 x VGA
1 x HDMI/DP++ (auto detection)

Dual Displays/ Triple Displays

Q370/C246:
VGA + 2 x HDMI/DP++ (auto detect)
H310:
VGA + 1 x HDMI/DP++ (auto detect)

Storage

Internal

2 x 2.5″ SATA 3.0 Drive Bay
support RAID 0/1

Expansion

Interface

Q370/C246:
1 x M.2 2230 E key (PCIe/USB 2.0)
1 x M.2 2280 M key (PCIe x4 NVMe/SATA)
1 x M.2 3052 B key (PCIe/USB3.0)
H310:
1 x M.2 2230 E key (PCIe/USB 2.0)
1 x M.2 2280 M key (SATA)
1 x M.2 3052 B key (PCIe)

Ethernet

Controller

Q370/C246:
1 x Intel® I211AT PCIe (10/100/1000Mbps)
1 x Intel® I219LM with iAMT11.0 PCIe (10/100/1000Mbps) (only Core i7/i5 supports iAMT)
H310:
1 x Intel® I211AT PCIe (10/100/1000Mbps)
1 x Intel® I219V PCIe (10/100/1000Mbps)

LED

Indicators

1 x Status LED
1 x HDD LED

Front I/O

Serial

4 x RS-232/422/485 (DB-9)

USB

2 x USB 2.0 (type A)

DIO

8 bit (DB-9)

Buttons

1 x Power Button
1 x Reset Button

Antenna

4 x Antenna Hole

Rear I/O

Ethernet

2 x GbE (RJ-45)

Serial

2 x RS232 (DB-9)

USB

4 x USB 3.1 (type A)

Display

Q370/C246:
1 x VGA
2 x HDMI/DP++ (auto detect)
H310:
1 x VGA
1 x HDMI/DP++ (auto detect)

Audio

1 x Line-out
1 x Mic-in

Watchdog Timer

Output & Interval

System Reset, Programmable via Software from 1 to 255 Seconds

Security

TPM

TPM 2.0

Power

Type

Wide Range 9~36V

Connector

3-pole Terminal Block
3-pin Power Extension Switch Connector

OS Support

Windows 10 IoT Enterprise 64 Bit
Linux (available upon request)

Environment

Operating Temperature

-20 to 70°C (SSD or mSATA)

Storage Temperature

-20 to 85°C

Relative Humidity

5 to 95% RH (non-condensing)

Mechanism

Dimensions

255.3 x 85 x 224mm

Construction

Metal + Aluminum

Mounting

Wall Mount

Weight

4.15 kg

Standards and Certifications

Shock

Half sine wave 3G, 11ms, 3 shock per axis

Vibration

IEC68-2-64

Certifications

CE, FCC Class A

Country of Origin

Taiwan

Ordering Information
Model Name	Part Number	Description
EC500- CS4061-Q	750-EC5003-000G	EC500-CS4061-Q:Fanless, CS263, Q370, CPU i5-8500T, 6 COM, 6 USB, 1 VGA, 2 HDMI/DP, 2 LAN, 1 Line-out, 1 Mic-in, 8 bits DIO, DC9~36V, F/G SYSTEM RoHS
EC500- CS4061-H	750-EC5003-100G	EC500-CS4061-H:Fanless, CS263, H310, CPU i5-8500T, 6 COM, 6 USB, 1 VGA, 1 HDMI/DP, 2 LAN, 1 Line-out, 1 Mic-in, 8 bits DIO, DC9~36V, F/G SYSTEM RoHS
EC500- CS4061-C	750-EC5003-200G	EC500-CS4061-C:Fanless, CS263, C246, CPU i5-8500T, 6 COM, 6 USB, 1 VGA, 2 HDMI/DP, 2 LAN, 1 Line-out, 1 Mic-in, 8 bits DIO, DC9~36V, F/G SYSTEM RoHS

DFI 8th/9th Gen Coffee Lake

Datasheet

Download(834 KB)

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

Here’s a selection of our design, manufacturing & associated services: –

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

FREE Pre-design / Pre-sales advise
Prototyping
- Custom PC Design
- Custom Panel PC
- Custom Racks and Towers
- Custom Peli Case PCs
Prototyping pre checks (chargeable one-time fee for existing prototype)
- Hardware compatibility
- Thermal testing
- Software compatibility
Custom PCB / Board Design
- COM Express, Qseven, SMARC
  Jetson, Raspberry Pi
Custom Chassis Design
- Metal
- Plastic
Custom Cables
Custom Back Panels and Faceplates
Custom Cooling
Custom Metal Work (internal brackets, mounting brackets)
Touchscreen Integration and Display Enhancements
- Custom LCD Displays
- Integration of touch technologies
- Optical Bonding
- Anti-reflective and anti-glare coatings
All products are Designed for Manufacture
Software – Custom OS Image

Build to Order: Computer Design and Customisation Services

Take an existing system and we can:

Custom specification (CPU, RAM, I/O, Industrial Storage, RAID)
Chassis customisation and branding
Custom BIOS
Long Term Availability
Software – Custom OS Image
Custom Packaging and branding
Integrating newly designed or existing hardware into a larger system

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

Windows image capture from customers HDD
Linux image capture from customers HDD
Android image capture from customers HDD
Windows / Linux Deployment from customers image
Custom Windows images, create and deploy
Update management
Custom Linux and Android images
Custom BIOS

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing	Materials Management	Logistics and Tracking	External Manufacturing
• Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test	• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System	• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels	• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test

Click here to find out more.

DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System

DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System

Description