Jetway HB368F21-XXXX-I Fanless Elkhart Lake Mini PC

  • Product Name: Jetway HB368F21-XXXX-I
  • System Type: Fanless Elkhart Lake Box PC
  • CPU: Intel Elkhart Lake SoC Processor
  • RAM: 1* DDR4 3200MHz SO-DIMM up to 32GB
  • Expansion: 1* M.2 E-key (2230, PCIe Gen.3 x1/USB2.0 interface), 1* M.2 B-key (3042,USB3.0 interface)
  • Other features: 2* USB3.1 (Gen.2), 4* USB2.0, 2* RJ45,1* Audio (MIC + Line-out), 1* Line-IN, 3* DP, 2* COM, 1* GPIO, Support TPM2.0 (option), Dimensions: 160.210627 mm, DC12V_40W/60W Adapter (BY Model)

Description

Discover the power-packed Jetway HB368F21-XXXX-I, an exceptional Fanless Elkhart Lake Box PC. Equipped with an Intel Elkhart Lake SoC Processor, this compact computing solution delivers reliable and efficient performance for a myriad of applications. The single DDR4 3200MHz SO-DIMM slot, supporting up to 32GB of RAM, ensures seamless multitasking, making it suitable for both business and industrial environments.

Connectivity is at the forefront of the Jetway HB368F21-XXXX-I, featuring 2 USB3.1 (Gen.2) ports, 4 USB2.0 ports, 2 RJ45 connectors, 1 Audio (MIC + Line-out), 1 Line-IN, 3 DisplayPort (DP) outputs, 2 COM ports, and 1 GPIO interface. This comprehensive range of ports provides versatility, catering to various peripherals and devices. The optional TPM2.0 support enhances data security, offering an additional layer of protection for sensitive information.

Measuring at a compact 160.2 x 106 x 27 mm, the Jetway HB368F21-XXXX-I is designed for seamless integration into space-constrained environments. The choice of DC12V_40W/60W Adapter (BY Model) ensures flexibility in power requirements, making it an energy-efficient solution without compromising on performance. Elevate your computing experience with the Jetway HB368F21-XXXX-I – where compact design, powerful processing, and versatile connectivity converge for an unparalleled computing solution.

Key Features

  • Intel Elkhart Lake SoC Processor
  • 1* DDR4 3200MHz SO-DIMM up to 32GB
  • 2* USB3.1 (Gen.2), 4* USB2.0, 2* RJ45,1* Audio (MIC + Line-out), 1* Line-IN, 3* DP, 2* COM, 1* GPIO
  • Support TPM2.0 (option)
  • 160.2*106*27 mm
  • DC12V_40W/60W Adapter (BY Model)

Specification

Model – HB368F21-6210-I (non-WiFi)
– HB368F21I-6210-I (WiFi)
– HB368F21-6412-I (non-WiFi)
– HB368F21I-6412-I (WiFi)
CPU/Chipset – Intel® Elkhart Lake SoC Processor (N6210, TDP 6.5W & J6412, TDP 10W)
BIOS – AMI Flash ROM
Memory – 1* DDR4 3200MHz SO-DIMM up to 32GB
Network – 2* Realtek RTL8119I GbE
Graphics – Intel® HD Graphics, shared memory
– 3* DP (Max Resolution: 4096×2160@60Hz)
– Support Triple Displays
Storage – 1* M.2 M-key (2242/2280, PCIe Gen.3 x2/SATA interface) support NVME
– 32GB eMMC onboard (option)
Expansion – 1* M.2 E-key (2230, PCIe Gen.3 x1/USB2.0 interface)
– 1* M.2 B-key (3042,USB3.0 interface)
Rear Panel I/O – 2* RJ45
– 2* USB3.1(Gen.2)
– 1* USB2.0
– 1* 8 bit GPIO (Phoenix Connector 2*9 PIN)
– 2* RS232/422/485 (Phoenix Connector 2*9 PIN)
– 1* DC in (Lockable)
Front Panel I/O – 1* Power button + Power LED
– 4* USB2.0
– 1* Audio(Line out+MIC)
– 1* Line in
– 3* DP
Internal Connector – SIM Card Holder
Power Source – Adapter : AC 90~240V input / DC12V_40W output
– MB : DC12~36V input
Compliance – CE, FCC, LVD, RoHS, ErP Ready
Dimensions – System: 160.2 (W) x 106 (D) x 27 (H) mm
– Net Weight: 0.61KG: Gross Weight: 1.12KG
Temperature Operating Temperature:
– HB368F21-6210-I : Operating Temperature: -20 ~ 60° C
– HB368F21-6412-I : Operating Temperature: -20 ~ 50° C
(Under the condition of using M.2 interface SSD)
Storage Temperature: -20 ~ 60° C
Humidity: 10% ~ 90% RH @40°C (non-condensing)
OS Support – Windows 11, Linux
Warranty – 2 Year limited warranty

  * Specifications subject to change without notice, not responsible for typographical errors. Does not include HDD or OS.

Standard Accessories  
  Part Number   Description
   HB368F21-XXXX-I Series
   WALL MOUNT KITS
   DIN RAIL KITS
 L01AS051-F  Adapter DC12V_40W
 Change according to shipping area  Power cord
 LCSCHBJC3XX-F  Screw Pack
 J05-ANT-GX57245-F  Antenna 2G4/5G 2.8dBi (WiFi only)

I/O Diagram

Front

Rear

HB368F21 6412 X Front diagram 1 HB368F21 6412 I Rear diagram

BVM Customisation Service

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If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

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• Burn in Test
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• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
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