DFI X6-MTH-ORN Nvidia ORIN NX + Intel Core Ultra MXM AI Inference PC

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  • Product Name: DFI X6-MTH-ORN
  • System Type: AI Inference PC
  • CPU: Nvidia Jetson Orin NX + Intel Core Ultra Processor
  • RAM: Two 260-Pin SO-DIMM up to 64GB. Dual Channel DDR5 5600MHz
  • Expansion: 4 M.2 B, E, M key expansion slots; Optional MXM supported with 3 DP and 1 HDMI ports
  • Other Features: Support for remote management and OTA by DFI OOB module; AI engine up to 100 TOPS; 4 USB 3.2, 4 RJ45 GbE, micro USB, Serial, CAN bus
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Description

The DFI X6-MTH-ORN is a high-performance AI Inference PC powered by the robust combination of Nvidia Jetson Orin NX and Intel Core Ultra Processor. Designed for advanced AI applications, it features an AI engine capable of up to 100 TOPS. With extensive expansion capabilities including 4 M.2 B, E, M key slots and optional MXM support with 3 DP and 1 HDMI ports, it offers versatile connectivity options. Additionally, it supports remote management and OTA updates via the DFI OOB module. This system is equipped with 4 USB 3.2 ports, 4 RJ45 GbE ports, micro USB, Serial, and CAN bus interfaces, making it an ideal choice for demanding AI and industrial applications.

Key Features

  • Reinforce Nvidia ORIN NX computing power by Intel  Core Ultra Processor
  • AI engine NVIDIA Jetson Orin NX, up to 100 TOPS
  • Support Remote management and OTA by DFI OOB module
  • 4 M.2 B, E, M key expansion slots
  • Optional MXM supported with 3 DP and 1 HDMI ports
  • 4 USB 3.2, 4 RJ45 GbE, micro USB, Serial, CAN bus

Specification

System
Processor
Intel® Core™ Ultra 7 165U (2 P-Cores x 1.7 GHz, 8 E-Cores x 1.2 GHz, 12 MB cache, 15W)
Intel® Core™ Ultra 7 155U (2 P-Cores x 1.7 GHz, 8 E-Cores x 1.2 GHz, 12 MB cache, 15W)
Intel® Core™ Ultra 5 155U (2 P-Cores x 1.6 GHz, 8 E-Cores x 1.1 GHz, 12 MB cache, 15W)
Intel® Core™ Ultra 5 135U (2 P-Cores x 1.3 GHz, 8 E-Cores x 0.8 GHz, 12 MB cache, 15W)
Memory
Two 260-Pin SO-DIMM up to 64GB
Dual Channel DDR5 5600MHz
BIOS
AMI SPI
Graphics
Controller
Intel® Iris® Xe Graphics
Feature
DX12, Open GL 4.6, Vulkan 1.2
HW Decode: HEVC/VP9/AV1/AVC/H.265/MJPEG
HW Encode: HEVC/VP9/AV1/AVC/H.265/MJPEG
Display
Stacked type VGA and HDMI from COMe eDP
HDMI from Jetson module
ITE IT6564FN DP HDMI/VGA converter from eDP
AI Accelerator
Interface
Nvidia Orin NX, up to 100 TOPS
Nvidia Orin Nano, up to 40 TOPS (optional Type A MXM supported)
Storage
External
1 x 64GB/128GB/256GB/512GB/1024GB on board SSD (available upon request on MTH968)
Optional 2x 2.5” SATA tray kit, RAID 0/1 supported
Internal
M.2 2242/2280 M key on Jetson module (PCIe x4)
Expansion
Interface
1 x M.2 3042/3052 B key (PCIex2) and 1 x micro (or nano) SIM slot
1 x M.2 2230 E key (PCIe x1, USB 2.0)
2 x M.2 2242/2280 M key (SATA 3and PCIe gen3 x1 for NVMe)
1 x M.2 A key for DFI OOB
Ethernet
Controller
1 RJ45 GbE from COMe
1 RJ45 GbE from Intel i210
2×2 stacked RJ45 GbE ports from 4x Intel i210
Optional 2x 15W PoE via X103-PE30-48
LED
Indicators
1 x Power Status
1 x HDD activity
Front I/O
Ethernet
2 x GbE
2×2 stacked RJ45 GbE
USB
2 x USB 3.2 from Type 6 or 2 x USB 2.0 from Type 10
2 x USB 3.2
2 x USB 2.0 from Jetson module
Display
1 x VGA
1 x HDMI port with screw hole
DC in
1 x 3-pin power terminal block
Rear I/O
Serial
1 x DB-9 RS232/422/485 port
1 combo DB-9 RS232/422/485/ CAN bus/ GPIO port
USB
1 x micro USB from Jetson module
Display
3 x DP++ ports
2 x HDMI port
Flank I/O
Antenna Hole
6 x antenna holes
Internal I/O
OOB
Support DFI OOB module
Security
TPM
TPM 2.0 on COMe
Power
Type
9-36V DC
Connector
1x 3-pin terminal block
RTC Battery
Rechargeable battery
OS Support
Microsoft
Windows 10, 11
Linux
Ubuntu 22.04
Environment
Operating Temperature
-20°C to 60°C (sku dependent)
Storage Temperature
-40°C to 85°C
Relative Humidity
5 to 95% RH (non-condensing)
Mechanism
Construction
Aluminium + SGCC
Mounting
Wall mount (mounting brackets and screws)
DIN mount by optional
Dimensions (W x H x D)
250 x 65 x 150 mm
Weight
< 3.5 kg
Standards and Certifications
Shock
· Operation
IEC 60068-2-27 Test Ea: Shock test
Half-sine, 3G @ 11ms, 18 Shock ±X, ±Y, ±Z (each axis 3 times)
· Non- Operation
IEC 60068-2-27 Test Ea: Shock test
Half-sine, 5G @ 11ms, 18 Shock ±X, ±Y, ±Z (each axis 3 times)
Vibration
· Operation
IEC 60068-2-64 Test Fh: Vibration board-band random test
Random,2Grms @ 5~500 Hz, 30min.
· Non- Operation
IEC 60068-2-6 Test Fc: Vibration Sinusoidal Test
Sweep sine, 3Grms @ 10~500Hz, 30min.
Certifications
CE, FCC Class A, RoHS, UL 62368-1, UL Certified Product: Ensuring Electrical Safety
IP Rating
IP20
Country of Origin
Country of Origin
Taiwan

Datasheet

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BVM Customisation Service

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.

 

If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements.

Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.

Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.

 

Design | Develop | Test | Manufacture

With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.

Build to Order Banner

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

Manufacturer : DFI

CPU

  • Powered By : Intel, Nvidia
  • CPU Family : iCore, NVIDIA Jetson
  • CPU Generation : Meteor Lake
  • CPU Model : Core Ultra 5 135U, Core Ultra 7 155U, Core Ultra 7 165U, Core Ultra5 155U

Memory

  • Memory Installed :
  • Memory Slots : 2
  • Memory Type : 5600Mhz DDR5

I/O and Expansion

  • Expansion Slots : M.2
  • LAN Ports : 2
  • Serial Ports : 1
  • USB 2 Ports : 2
  • USB 3 Ports :
  • USB 3.X / USB C / USB 4.0 :
  • Video Output : eDisplayPort, HDMI, VGA
  • Multi Display : Triple Display

Operating System

  • OS : Linux, Windows

Certifications

  • Certifications :

Features

  • 5G-4G-GPS :
  • Artificial Intelligence Use : Edge Computing
  • IP Rating :
  • Rugged : Yes
  • System Type : Box PC
  • Wide Temp : Yes

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