AAEON CEXD-INTRBL 16th Gen Core Ultra 3 (Panther Lake) Open Robotic System

  • Product Name: AAEON CEXD-INTRBL
  • System Type: Open robotic system
  • CPU: Intel Core Ultra Series 3 processors (Panther Lake)
  • RAM: Onboard LPDDR5 8533MT/s, up to 64GB
  • Expansion: GMSL x2 (up to 8 channels), 22-pin GPIO, CANBus x1
  • Other Features: 2.5GbE x4 (IEEE support), USB 3.2 Gen 1 x4, USB 2.0 x2, HDMI x1, DisplayPort x1, 19V–24V input, compact 137mm x 135mm x 86mm design

Description

The AAEON CEXD-INTRBL Open Robotic System is a compact, high-performance industrial computing platform designed for advanced robotics, automation, and edge AI applications. Powered by Intel’s latest Core Ultra Series 3 processors (codenamed Panther Lake), it delivers next-generation processing efficiency and AI-accelerated performance for demanding real-time workloads. Built with onboard LPDDR5 memory running at 8533MT/s and supporting up to 64GB capacity, the system ensures fast data throughput and smooth multitasking across complex robotic control and vision tasks. Its robust connectivity options include dual GMSL interfaces supporting up to 8 camera channels, making it ideal for machine vision, autonomous navigation, and intelligent sensing applications.

For industrial integration, the system provides extensive I/O flexibility, including four 2.5GbE LAN ports with IEEE support, USB 3.2 Gen 1, USB 2.0, HDMI, DisplayPort, and a dedicated CANBus interface for vehicle and robotics communication networks. A 22-pin GPIO header further enhances expandability for custom control and automation designs. Designed for harsh and embedded environments, the CEXD-INTRBL operates on a wide 19V–24V power input range and features a compact 137mm x 135mm x 86mm footprint, allowing easy deployment in space-constrained robotic platforms.

Ideal for robotics, autonomous systems, industrial automation, and edge AI computing, this system combines performance, connectivity, and flexibility in a rugged, compact form factor built for next-generation intelligent machines.

Key Features

  • Open Robotic system
  • Intel Core Ultra Processors Series 3 (formerly Panther Lake)
  • Onboard LPDDR5 8533MT/s, up to 64GB
  • 137mm x 135mm x 86mm
  • 22-pin GPIO
  • GMSL x 2 (up to 8 Channels)
  • 19V-24V
  • USB 3.2 Gen 1 x 4, USB 2.0 x 2, HDMI x 1, DP x 1
  • 2.5GbE x 4 (support IEEE), CANBUS x 1

Specification

System
Form Factor Open Robotic system
CPU Intel® Core™ Ultra Series 3 processors (formerly Panther Lake):
Intel® Core™ Ultra X7 Processor 358H (16C, up to 4.8 GHz)
Chipset Integrated with Intel® SoC
Memory Type Onboard LPDDR5 8533MT/s, up to 64GB
BIOS UEFI
Wake on LAN Yes
Watchdog Timer 255 Levels
Security TPM 2.0
RTC Battery Lithium Battery 3V/240mAh
Dimension 5.39″ x 5.3″ x 3.3″ (137mm x 135mm x 86mm)
OS Support Windows® 11 (64-bit), Ubuntu 25.04 or 24.04 and later
Power
Power Requirement 19V – 24V
Power Supply Type AT mode
Connector 4-pin DIN Plug
Power Consumption 200W – 250W
Display
Controller Intel® Arc™ B390
LVDS/eDP
Display Interface HDMI 1.4 x 1, up to 3840 x 2160 @30Hz
DP 1.4 x 1, up to 3840 x 2160 @144Hz
Multiple Display Up to 2 Simultaneous Displays
Audio
Codec Realtek® ALC897
Audio Interface 3.5mm jack, Line-Out, Mic-in
Speaker 5W speaker, 2-pin header
External I/O
Ethernet Intel® Ethernet Controller I226-V, 2.5GbE x 4
USB USB 3.2 Gen 1 (Type-C) x 4
USB 2.0 (Type A) x 2
Video HDMI 1.4 x 1
DP 1.4 x 1
Others CANBus x 1
GMSL x 2 (FAKRA connector), up to 8 channels.
Internal I/O
Serial Port RS-232 x 2
RS-485 x 2
Audio
DIO/GPIO 22-bit GPIO via HAT 40
Fan Fan
SIM
Others MISC Header
MIPI CSI x 2
Expansion
Mini PCIe/mSATA
M.2 M.2 2280 B-Key x 1 (PCIe [x2])
M.2 2280 M-Key x 1 (PCIe [x4]), 256GB as default
M.2 2230 E-Key x 1 (Wifi/BT)
Others
Environment & Certification
Operating Temp System Level: -14°F – 122°F (0°C – 50°C) with 0.7m/sec air flow
Storage Temp -40°F – 185°F (-40°C – 85°C)
Operating Humidity 0% ~ 95% relative humidity, non-condensing
MTBF (Hours) TBD
Vibration IEC 60068-2-24 , 5-500Hz ; 2grms
Drop ISTA PROJECT 1A (with Packing box)
Altitude 3000m (TBD)
EMC CE/FCC Class A

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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