IEI HTB-300-MTL-H Core Ultra Medical AI PC with MXM GPU

  • Product Name: IEI HTB-300-MTL-H
  • System Type: Fanless embedded medical AI PC
  • CPU: Intel Core Ultra 5-125H or Intel Core Ultra 7-155H (Meteor Lake-H, 28W TDP)
  • RAM: Up to 64GB DDR5 5600MT/s via 2 × SO-DIMM slots
  • Expansion: 2 × M.2 2280 PCIe Gen4 x4 (M Key), 1 × M.2 2230 (E Key), 1 × MXM 3.1 Type A (PCIe Gen5 x8)
  • Other Features: MXM GPU support, Wi-Fi 7 compatibility, fanless thermal design

Description

The IEI HTB-300-MTL-H is a compact, fanless medical-grade embedded AI PC designed for demanding healthcare and edge AI applications. Powered by Intel® Core™ Ultra processors (Meteor Lake-H), it delivers a strong balance of CPU, integrated AI acceleration, and energy efficiency within a low-power 28W thermal envelope, making it ideal for silent, reliable operation in clinical environments. Built for advanced medical imaging and AI workloads, the system supports an MXM 3.1 Type A GPU via a high-bandwidth PCIe Gen5 x8 interface, enabling scalable graphics and compute performance when required. Dual DDR5 SO-DIMM slots support up to 64GB of high-speed memory, ensuring smooth multitasking and fast data processing for AI inference and real-time analytics.

Storage and connectivity are equally flexible, with dual M.2 2280 PCIe Gen4 slots for high-performance NVMe SSDs and an additional M.2 2230 E-Key slot supporting the latest Wi-Fi 7 modules. Its fully fanless design enhances system reliability, reduces maintenance, and supports hygienic, noise-free operation—key requirements in medical and laboratory settings. Overall, the IEI HTB-300-MTL-H is a future-ready embedded platform tailored for medical AI, diagnostics, and edge computing applications where performance, expandability, and silent operation are critical.

Key Features

  • Intel® Core™ Ultra 5-125H/ Ultra 7-155H processor (code name: Meteor Lake-H, TDP 28W)
  • Fanless embedded system
  • 2 x M.2 2280 PCIe Gen4 x4 (M Key) for SSD
  • 1 x M.2 2230 (E Key) slot for Wi-Fi 7
  • 1 x MXM 3.1 Type A slot (signal PCIe Gen5 x8)
  • 2 x DDR5 5600MT/s SO-DIMM slots, up to 64GB

Specification

 

System

 
Processor Intel® Core™ Ultra 5-125H/ Ultra 7-155H processor
Supported OS Windows 11, Linux Ubuntu
Network  
Ethernet Controller Intel® I226-V
Wi-Fi IEEE 802.11 be, Intel® Wi-Fi 7 BE200 (optional)
Bluetooth Bluetooth V5.4 (optional)
Storage  
Storage 2 x M.2 2280 PCIe Gen4 x4 M-key slots (optional, supoorts RAID)
RAM 2 x 262-pin 5600MT/s dual-channel DDR5 SO-DIMM slots (system max. 64GB)
Expansion Slots  
Expansion Slots 2 x M.2 2280 PCIe Gen4 x4 M-key slots for SSD
  1 x M.2 2230 E Key slot (for Wi-Fi; PCIe/USB)
  1 x MXM 3.1 Type A slot (signal PCIe Gen5 x8)
  1 x PCIe Gen4 x4 slot (support Capture card)
Audio  
Audio 1 x 3.5mm Mic in & Audio out
Speaker 1 x 3W speaker
I/O Interface  
Front I/O 1 x 19V DC-in
  1 x 3.5mm Mic in & Audio out
  1 x Terminal Block (DC IN)
  2 x USB 2.0 Type-A
Rear I/O 1 x HDMI output 2.1
  1 x USB 3.2 Gen 2 Type-C (DP1.2 + USB 5V/3A)
  2 x 2.5GbE LAN
  4 x USB 3.2 Gen 2 Type-A
  4 x RS-232
Indicator&Buttons  
Buttons 1 x System power on/off button (with power LED)
  1 x Clear CMOS
  1 x AT/ATX switch
  1 x Reset
Physical Characteristics  
Color White
Thermal Fanless
Chassis Construction NCT(N), SECC
Construction Material Aluminum
Mounting Wall, Stand and Arm
  VESA 75/100 compliant
  Din Rail mount
Weight (Net) (kg) 2.04
Weight (Gross) (kg) 4.26
Dimensions (LxWxH) (mm) 232 x 202 x 43.5 (Standard)
  232 x 202 x 66.5 (MXM or Riser Card)
   
   
Power  
Input Terminal block 9-28V DC-in
Power Adapter 19V DC-in, 120W medical power adapter
Environment  
Operating Temperature 0°C – 40°C
Storage Temperature -20°C – 60°C
Humidity 10% – 95% (non-condensing)
Vibration 1G
Operating Shock 5G peak acceleration (11ms duration)
Non-operating shock 15G peak acceleration (11ms duration)
Certifications  
Safety & EMC CE, FCC Class B Part18
  UL 60601-1
  IEC/EN 60601-1: 2005+AMD1:2012 (Edition 3.2)
  IEC/EN 60601-1-2 (Edition 4.1)

Ordering Information

HTB-300-MTL-H-ULTRA7-R10 Fanless embedded system, Intel® Core™ Ultra7-155H 4.8GHz on-board processor, 2 x M.2 2280 PCIe Gen4 x4 M key slot, 1 x M.2 2230 E Key slot for Wi-Fi 7 module, 1 x MXM 3.1 Type A/B expansion, R10, RoHs
HTB-300-MTL-H-ULTRA5-R10 Fanless embedded system, Intel® Core™ Ultra5-125H 4.5GHz on-board processor, 2 x M.2 2280 PCIe Gen4 x4 M key slot, 1 x M.2 2230 E Key slot for Wi-Fi 7 module, 1 x MXM 3.1 Type A/B expansion, R10, RoHs

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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